JPH0163140U - - Google Patents
Info
- Publication number
- JPH0163140U JPH0163140U JP15798087U JP15798087U JPH0163140U JP H0163140 U JPH0163140 U JP H0163140U JP 15798087 U JP15798087 U JP 15798087U JP 15798087 U JP15798087 U JP 15798087U JP H0163140 U JPH0163140 U JP H0163140U
- Authority
- JP
- Japan
- Prior art keywords
- envelope
- optical semiconductor
- semiconductor device
- lens
- concave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims 4
- 239000004065 semiconductor Substances 0.000 claims 4
- 230000000994 depressogenic effect Effects 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例を示す断面図、第２
図は本考案の他の実施例を示す断面図、第３図は
本考案のさらに他の実施例を示す断面図、第４図
および第５図はそれぞれ異なる従来例を示す断面
図である。
１…受光素子、２…リードフレーム、４…透光
性樹脂、６…落し込み部、７…発光素子、８…レ
ンズ。
Fig. 1 is a sectional view showing one embodiment of the present invention;
The figure is a cross-sectional view showing another embodiment of the present invention, FIG. 3 is a cross-sectional view showing still another embodiment of the present invention, and FIGS. 4 and 5 are cross-sectional views showing different conventional examples. DESCRIPTION OF SYMBOLS 1... Light receiving element, 2... Lead frame, 4... Translucent resin, 6... Recessed part, 7... Light emitting element, 8... Lens.
Claims (1)
なる光半導体装置において、上記外囲器の前面を
外側より凹状に落し込んだ形状にしかつ上記外囲
器の外面を粗面状にしたことを特徴とする光半導
体装置。 ２ 上記外囲器の落し込み部の底面がレンズ状に
なされたことを特徴とする実用新案登録請求の範
囲第１項記載の光半導体装置。[Claims for Utility Model Registration] 1. An optical semiconductor device in which an optical semiconductor element is covered with a transparent resin envelope, the front surface of the envelope being concave from the outside, and the outer envelope An optical semiconductor device characterized by having a roughened outer surface. 2. The optical semiconductor device according to claim 1, wherein the bottom surface of the depressed portion of the envelope is shaped like a lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15798087U JPH0163140U (en) | 1987-10-15 | 1987-10-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15798087U JPH0163140U (en) | 1987-10-15 | 1987-10-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0163140U true JPH0163140U (en) | 1989-04-24 |
Family
ID=31437898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15798087U Pending JPH0163140U (en) | 1987-10-15 | 1987-10-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0163140U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006237264A (en) * | 2005-02-24 | 2006-09-07 | Kyocera Corp | Light emitting device and lighting apparatus |
| JP2018190861A (en) * | 2017-05-09 | 2018-11-29 | ローム株式会社 | Optical device |
-
1987
- 1987-10-15 JP JP15798087U patent/JPH0163140U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006237264A (en) * | 2005-02-24 | 2006-09-07 | Kyocera Corp | Light emitting device and lighting apparatus |
| JP2018190861A (en) * | 2017-05-09 | 2018-11-29 | ローム株式会社 | Optical device |