JPS6452255U - - Google Patents

Info

Publication number
JPS6452255U
JPS6452255U JP14701887U JP14701887U JPS6452255U JP S6452255 U JPS6452255 U JP S6452255U JP 14701887 U JP14701887 U JP 14701887U JP 14701887 U JP14701887 U JP 14701887U JP S6452255 U JPS6452255 U JP S6452255U
Authority
JP
Japan
Prior art keywords
light receiving
receiving element
coupling device
optical coupling
lead terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14701887U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14701887U priority Critical patent/JPS6452255U/ja
Publication of JPS6452255U publication Critical patent/JPS6452255U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例の断面図、第2図は
従来の半導体光結合装置の一例の断面図、第3図
は半導体光結合装置を説明するための断面図であ
る。 1……第1のリード端子、2……発光素子、3
……第2のリード端子、4……受光素子、5……
成形部、6……透明部、7……外被部。
FIG. 1 is a sectional view of an embodiment of the present invention, FIG. 2 is a sectional view of an example of a conventional semiconductor optical coupling device, and FIG. 3 is a sectional view for explaining the semiconductor optical coupling device. 1...First lead terminal, 2...Light emitting element, 3
...Second lead terminal, 4...Light receiving element, 5...
Molded part, 6... Transparent part, 7... Outer covering part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 第1のリード端子に接続し保持される発光素子
と第2のリード端子に接続し保持される受光素子
とを滴下した樹脂で覆つて形成する透明部を含む
半導体光結合装置において、前記発光素子と前記
受光素子との下方で滴下される前記樹脂を受ける
湾曲部を上面に設けた成形部を有することを特徴
とする半導体光結合装置。
A semiconductor optical coupling device including a transparent part formed by covering a light emitting element connected to and held by a first lead terminal and a light receiving element connected to and held by a second lead terminal with a dropped resin. A semiconductor optical coupling device comprising a molded part having a curved part on an upper surface for receiving the resin dripped below the light receiving element and the light receiving element.
JP14701887U 1987-09-25 1987-09-25 Pending JPS6452255U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14701887U JPS6452255U (en) 1987-09-25 1987-09-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14701887U JPS6452255U (en) 1987-09-25 1987-09-25

Publications (1)

Publication Number Publication Date
JPS6452255U true JPS6452255U (en) 1989-03-31

Family

ID=31417044

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14701887U Pending JPS6452255U (en) 1987-09-25 1987-09-25

Country Status (1)

Country Link
JP (1) JPS6452255U (en)

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