JPS646053U - - Google Patents
Info
- Publication number
- JPS646053U JPS646053U JP1987101263U JP10126387U JPS646053U JP S646053 U JPS646053 U JP S646053U JP 1987101263 U JP1987101263 U JP 1987101263U JP 10126387 U JP10126387 U JP 10126387U JP S646053 U JPS646053 U JP S646053U
- Authority
- JP
- Japan
- Prior art keywords
- polarizer
- light
- resin body
- incident side
- polarization plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Description
第１図ａ，ｂは本考案の一実施例を示す光半導
体装置の一部切欠平面図及びＡ―Ａ′線断面図、
第２図は第１図ａ，ｂに示す一実施例の斜視図、
第３図は従来の光半導体装置の一例を示す断面図
である。
１……受光素子、２，３……リード線、４……
金線、５……光透過性樹脂体、６，７……偏光子
、８……パツケージ、９……レンズ、１０……光
透過性樹脂体、１１……キヤツプ。
FIGS. 1a and 1b are a partially cutaway plan view and a cross-sectional view taken along the line A-A' of an optical semiconductor device showing an embodiment of the present invention;
FIG. 2 is a perspective view of one embodiment shown in FIGS. 1a and b;
FIG. 3 is a sectional view showing an example of a conventional optical semiconductor device. 1... Light receiving element, 2, 3... Lead wire, 4...
Gold wire, 5... Light-transmitting resin body, 6, 7... Polarizer, 8... Package, 9... Lens, 10... Light-transmitting resin body, 11... Cap.
Claims (1)
前記光透過性樹脂体の光入射側に設けられた第１
の偏光子とを有するパツケージと、前記第１の偏
光子と相対する第２の偏光子を備え且つ前記第１
の偏光子の偏光面に対して前記第２の偏光子の偏
光面を回転できるように前記パツケージの光入射
側に取付けられた光透過性樹脂体からなるキヤツ
プとを含むことを特徴とする光半導体装置。 a light-transmissive resin body encapsulating a semiconductor light-receiving element;
a first provided on the light incident side of the light-transmissive resin body;
a second polarizer opposite to the first polarizer, and a second polarizer opposite to the first polarizer;
and a cap made of a light-transmitting resin body attached to the light incident side of the package so as to be able to rotate the polarization plane of the second polarizer with respect to the polarization plane of the polarizer. Semiconductor equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987101263U JPS646053U (en) | 1987-06-30 | 1987-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987101263U JPS646053U (en) | 1987-06-30 | 1987-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS646053U true JPS646053U (en) | 1989-01-13 |
Family
ID=31330099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987101263U Pending JPS646053U (en) | 1987-06-30 | 1987-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS646053U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001004878A (en) * | 1999-06-23 | 2001-01-12 | Sharp Corp | Optical transmitting / receiving module, optical cable, and single-core bidirectional optical communication system using them |
| JP2002512436A (en) * | 1998-02-06 | 2002-04-23 | シェルケース リミティド | Integrated circuit device |
-
1987
- 1987-06-30 JP JP1987101263U patent/JPS646053U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002512436A (en) * | 1998-02-06 | 2002-04-23 | シェルケース リミティド | Integrated circuit device |
| US9530945B2 (en) | 1998-02-06 | 2016-12-27 | Invensas Corporation | Integrated circuit device |
| JP2001004878A (en) * | 1999-06-23 | 2001-01-12 | Sharp Corp | Optical transmitting / receiving module, optical cable, and single-core bidirectional optical communication system using them |