JPS6291458U - - Google Patents
Info
- Publication number
- JPS6291458U JPS6291458U JP18234485U JP18234485U JPS6291458U JP S6291458 U JPS6291458 U JP S6291458U JP 18234485 U JP18234485 U JP 18234485U JP 18234485 U JP18234485 U JP 18234485U JP S6291458 U JPS6291458 U JP S6291458U
- Authority
- JP
- Japan
- Prior art keywords
- light
- lead frame
- sealed
- resin
- transmitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例の断面図、第２図及
び第３図は従来の光結合型半導体装置の断面図で
ある。
１……受光素子、２……リードフレーム、３…
…発光素子、４……リードフレーム、５，５Ａ…
…光透過性樹脂、６……エポキシ樹脂、７……光
透過性エポキシ樹脂、８……光透過性シリコーン
樹脂。
FIG. 1 is a sectional view of an embodiment of the present invention, and FIGS. 2 and 3 are sectional views of a conventional optically coupled semiconductor device. 1... Light receiving element, 2... Lead frame, 3...
...Light emitting element, 4...Lead frame, 5,5A...
...light-transmitting resin, 6... epoxy resin, 7... light-transmitting epoxy resin, 8... light-transmitting silicone resin.
Claims (1)
性の硬質樹脂で封止してなる受光デバイスの受光
面と、リードフレームに固定された発光素子を光
透過性でかつ柔軟性を有する樹脂で封止してなる
発光デバイスの発光面とを光学的に対向させて密
着し、これらデバイスの周囲を光不透過性樹脂で
封止し一体化したことを特徴とする光結合型半導
体装置。 The light-receiving surface of a light-receiving device is made by sealing a light-receiving element fixed to a lead frame with a light-transmitting hard resin, and the light-emitting element fixed to the lead frame is sealed with a light-transmitting and flexible resin. 1. An optically coupled semiconductor device characterized in that the light emitting surfaces of light emitting devices are optically opposed to each other in close contact with each other, and the peripheries of these devices are sealed with a light-opaque resin and integrated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18234485U JPS6291458U (en) | 1985-11-26 | 1985-11-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18234485U JPS6291458U (en) | 1985-11-26 | 1985-11-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6291458U true JPS6291458U (en) | 1987-06-11 |
Family
ID=31128053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18234485U Pending JPS6291458U (en) | 1985-11-26 | 1985-11-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6291458U (en) |
-
1985
- 1985-11-26 JP JP18234485U patent/JPS6291458U/ja active Pending