JPS63140649U - - Google Patents
Info
- Publication number
- JPS63140649U JPS63140649U JP3363087U JP3363087U JPS63140649U JP S63140649 U JPS63140649 U JP S63140649U JP 3363087 U JP3363087 U JP 3363087U JP 3363087 U JP3363087 U JP 3363087U JP S63140649 U JPS63140649 U JP S63140649U
- Authority
- JP
- Japan
- Prior art keywords
- light
- resin
- light receiving
- receiving element
- outer peripheral
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Description
第１図及び第２図は本考案受光装置の一実施例
を示し、第１図は平面図、第２図は第１図の―
線断面図、第３図及び第４図は従来装置を示し
、第３図は平面図、第４図は第３図の―′線
断面図、を夫々示している。
１……受光素子、１ａ……受光面、５……モー
ルド樹脂、５ａ……入射面、５ｂ……外周面、６
……凹所。
1 and 2 show an embodiment of the light receiving device of the present invention, FIG. 1 is a plan view, and FIG. 2 is the same as that shown in FIG. 1.
3 and 4 show a conventional device, FIG. 3 is a plan view, and FIG. 4 is a sectional view taken along the line -' in FIG. 3, respectively. DESCRIPTION OF SYMBOLS 1... Light receiving element, 1a... Light receiving surface, 5... Mold resin, 5a... Incident surface, 5b... Outer peripheral surface, 6
...Concavity.
Claims (1)
子の受光面に対し傾斜した樹脂封止型の受光装置
であつて、上記入射面は受光素子を樹脂封止する
モールド樹脂の外周面から窪んだ凹所に設けられ
ると共に、上記外周面は受光素子の受光面と平行
であることを特徴とした受光装置。 It is a resin-sealed light receiving device in which an incident surface that allows the incidence of light to be received is inclined with respect to the light receiving surface of the light receiving element, and the incident surface is recessed from the outer peripheral surface of the mold resin that resin-seals the light receiving element. A light-receiving device characterized in that the outer peripheral surface is parallel to a light-receiving surface of a light-receiving element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3363087U JPH0632695Y2 (en) | 1987-03-06 | 1987-03-06 | Light receiving device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3363087U JPH0632695Y2 (en) | 1987-03-06 | 1987-03-06 | Light receiving device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63140649U true JPS63140649U (en) | 1988-09-16 |
| JPH0632695Y2 JPH0632695Y2 (en) | 1994-08-24 |
Family
ID=30841415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3363087U Expired - Lifetime JPH0632695Y2 (en) | 1987-03-06 | 1987-03-06 | Light receiving device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0632695Y2 (en) |
-
1987
- 1987-03-06 JP JP3363087U patent/JPH0632695Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0632695Y2 (en) | 1994-08-24 |