JPH02146461U - - Google Patents
Info
- Publication number
- JPH02146461U JPH02146461U JP5660989U JP5660989U JPH02146461U JP H02146461 U JPH02146461 U JP H02146461U JP 5660989 U JP5660989 U JP 5660989U JP 5660989 U JP5660989 U JP 5660989U JP H02146461 U JPH02146461 U JP H02146461U
- Authority
- JP
- Japan
- Prior art keywords
- protection member
- periphery
- image sensor
- utility
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
第１図及び第２図はそれぞれ本考案の一実施例
及び従来例の断面模式図である。
１……ガラスキヤツプ、２……表面保護部材、
３……受光面、４……センサチツプ、５……セラ
ミツクケース、６……外部リード。
1 and 2 are schematic cross-sectional views of an embodiment of the present invention and a conventional example, respectively. 1...Glass cap, 2...Surface protection member,
3... Light receiving surface, 4... Sensor chip, 5... Ceramic case, 6... External lead.
Claims (1)
とも２辺に表面保護部材が設けられていることを
特徴とするイメージセンサ。 An image sensor characterized in that a surface protection member is provided on at least two sides of the periphery of the glass cap on the light incident surface side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5660989U JPH02146461U (en) | 1989-05-16 | 1989-05-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5660989U JPH02146461U (en) | 1989-05-16 | 1989-05-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02146461U true JPH02146461U (en) | 1990-12-12 |
Family
ID=31580590
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5660989U Pending JPH02146461U (en) | 1989-05-16 | 1989-05-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02146461U (en) |
-
1989
- 1989-05-16 JP JP5660989U patent/JPH02146461U/ja active Pending