JPS62184760U - - Google Patents

Info

Publication number
JPS62184760U
JPS62184760U JP1986074057U JP7405786U JPS62184760U JP S62184760 U JPS62184760 U JP S62184760U JP 1986074057 U JP1986074057 U JP 1986074057U JP 7405786 U JP7405786 U JP 7405786U JP S62184760 U JPS62184760 U JP S62184760U
Authority
JP
Japan
Prior art keywords
package
solid
imaging device
state imaging
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986074057U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986074057U priority Critical patent/JPS62184760U/ja
Publication of JPS62184760U publication Critical patent/JPS62184760U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の固体撮像装置の分解断面図、
第２図は本考案装置の他の実施例の分解断面図、
第３図は従来装置の分解断面図、第４図ａ，ｂは
夫々従来装置の接着剤塗布工程を示す断面図であ
る。 １…封止ガラス、２，４…接着剤、３…遮光板
、８…パツケージ、３１，３２…段部。 FIG. 1 is an exploded cross-sectional view of the solid-state imaging device of the present invention.
FIG. 2 is an exploded sectional view of another embodiment of the device of the present invention;
FIG. 3 is an exploded sectional view of the conventional device, and FIGS. 4a and 4b are sectional views showing the adhesive application process of the conventional device, respectively. DESCRIPTION OF SYMBOLS 1... Sealing glass, 2, 4... Adhesive, 3... Light shielding plate, 8... Package, 31, 32... Step part.

Claims (1)

【実用新案登録請求の範囲】 (1) 固体撮像素子をパツケージの凹所内に収納
してなる固体撮像装置に於いて、該パツケージ内
への光入射を制限する遮光板と、該パツケージの
凹所を封止する封止ガラスとをパツケージ上に積
層接着した事を特徴とした固体撮像素子。 (2) 上記遮光板はその一面側に接着剤が塗布さ
れたパツケージ用係合部とその他面側に接着剤が
塗布された封止ガラス用係合部とを備えた事を特
徴とする実用新案登録請求の範囲第１項記載の固
体撮像装置。[Claims for Utility Model Registration] (1) In a solid-state imaging device in which a solid-state imaging device is housed in a recess in a package, a light-shielding plate for restricting light incidence into the package and a recess in the package A solid-state image sensor characterized by laminating and bonding a sealing glass on a package. (2) The above-mentioned light-shielding plate has a package engaging portion coated with adhesive on one side thereof and a sealing glass engaging portion coated with adhesive on the other side. A solid-state imaging device according to claim 1 of patent registration.
JP1986074057U 1986-05-16 1986-05-16 Pending JPS62184760U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986074057U JPS62184760U (en) 1986-05-16 1986-05-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986074057U JPS62184760U (en) 1986-05-16 1986-05-16

Publications (1)

Publication Number Publication Date
JPS62184760U true JPS62184760U (en) 1987-11-24

Family

ID=30918931

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986074057U Pending JPS62184760U (en) 1986-05-16 1986-05-16

Country Status (1)

Country Link
JP (1) JPS62184760U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100407407B1 (en) * 2001-11-20 2003-11-28 한국 고덴시 주식회사 Color sensor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100407407B1 (en) * 2001-11-20 2003-11-28 한국 고덴시 주식회사 Color sensor

Similar Documents

Publication Publication Date Title
JPS62184760U (en)
JPH01140850U (en)
JPS6398660U (en)
JPH02146461U (en)
JPS6421580U (en)
JPS59104551U (en) solid-state imaging device
JPH03113564U (en)
JPS6316462U (en)
JPS61131U (en) camera
JPS58132885U (en) Infrared human body detector
JPS63113377U (en)
JPH0479439U (en)
JPS62118461U (en)
JPS6251763U (en)
JPS6212965U (en)
JPS6295368U (en)
JPS6294651U (en)
JPS62188155U (en)
JPH01125565U (en)
JPH01140837U (en)
JPS62169179U (en)
JPH0270449U (en)
JPH01139460U (en)
JPS614445U (en) Surface protection member for photoelectric conversion elements
JPH0268755U (en)