JPS6387850U - - Google Patents
Info
- Publication number
- JPS6387850U JPS6387850U JP18192286U JP18192286U JPS6387850U JP S6387850 U JPS6387850 U JP S6387850U JP 18192286 U JP18192286 U JP 18192286U JP 18192286 U JP18192286 U JP 18192286U JP S6387850 U JPS6387850 U JP S6387850U
- Authority
- JP
- Japan
- Prior art keywords
- solid
- state image
- image sensor
- sensor
- sectional
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 1
- 238000003384 imaging method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
Landscapes
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
Description
第1図はこの考案の固体撮像素子の1実施例の
構成を示す断面図、第2図は他の実施例の断面図
、第3図は従来の固体撮像素子の断面図、第4図
、第5図はこの考案の固体撮像素子と従来のもの
の作用の説明図、第6図に撮像レンズの1例を示
すレンズ断面図、第7図は上記撮像レンズを用い
た場合の撮像光学系の構成を示す断面図である。
1:センサー部、2:パツケージ基板、3:ウ
インドガラス、4:ピン、5:ウインドレンズ、
6:撮像レンズ、8:射出瞳位置。
Fig. 1 is a sectional view showing the configuration of one embodiment of the solid-state image sensor of this invention, Fig. 2 is a sectional view of another embodiment, Fig. 3 is a sectional view of a conventional solid-state image sensor, Fig. 4, Fig. 5 is an explanatory diagram of the function of the solid-state image sensor of this invention and the conventional one, Fig. 6 is a lens sectional view showing an example of an imaging lens, and Fig. 7 is an illustration of the imaging optical system when the above imaging lens is used. FIG. 3 is a cross-sectional view showing the configuration. 1: Sensor part, 2: Package board, 3: Wind glass, 4: Pin, 5: Wind lens,
6: Imaging lens, 8: Exit pupil position.
Claims (1)
面を、正の屈折力を有するウインドレンズによつ
て密封したことを特徴とする固体撮像素子。 1. A solid-state image sensor, characterized in that the upper surface of a concave portion of a package substrate on which a sensor portion is disposed is sealed with a wind lens having positive refractive power.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18192286U JPS6387850U (en) | 1986-11-28 | 1986-11-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18192286U JPS6387850U (en) | 1986-11-28 | 1986-11-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6387850U true JPS6387850U (en) | 1988-06-08 |
Family
ID=31127243
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18192286U Pending JPS6387850U (en) | 1986-11-28 | 1986-11-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6387850U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1197659A (en) * | 1997-09-22 | 1999-04-09 | Casio Comput Co Ltd | Image-pickup device unit |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS607767A (en) * | 1983-06-27 | 1985-01-16 | Nec Corp | Semiconductor device |
-
1986
- 1986-11-28 JP JP18192286U patent/JPS6387850U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS607767A (en) * | 1983-06-27 | 1985-01-16 | Nec Corp | Semiconductor device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1197659A (en) * | 1997-09-22 | 1999-04-09 | Casio Comput Co Ltd | Image-pickup device unit |