JPS6447066U - - Google Patents
Info
- Publication number
- JPS6447066U JPS6447066U JP14263787U JP14263787U JPS6447066U JP S6447066 U JPS6447066 U JP S6447066U JP 14263787 U JP14263787 U JP 14263787U JP 14263787 U JP14263787 U JP 14263787U JP S6447066 U JPS6447066 U JP S6447066U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- semiconductor device
- photodetector
- optical semiconductor
- photodetector chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 claims 2
Description
第１図及び第２図は本考案の第１及び第２の実
施例を示す半導体装置の断面図、第３図ａ，ｂは
従来の光半導体装置の一例を示す平面図及びＡ―
Ａ′線断面図である。
１…受光素子チツプ、２…ＩＣチツプ、３ａ，
３ｂ，３ｃ…内部リード、４…透明樹脂体、５…
外部リード。
1 and 2 are cross-sectional views of semiconductor devices showing first and second embodiments of the present invention, and FIGS. 3a and 3b are plan views and A--
It is a sectional view taken along the line A'. 1... Light receiving element chip, 2... IC chip, 3a,
3b, 3c...internal lead, 4...transparent resin body, 5...
External lead.
Claims (1)
の信号を入力し処理するＩＣチツプとを透明樹脂
体で一体に封止することを含む光半導体装置にお
いて、前記受光素子チツプと前記ＩＣチツプを互
いに上下の２層に配置したことを特徴とする光半
導体装置。 In an optical semiconductor device that includes a semiconductor photodetector chip and an IC chip that inputs and processes signals from the photodetector chip, which are integrally sealed with a transparent resin, the photodetector chip and the IC chip are placed above and below each other. An optical semiconductor device characterized by being arranged in two layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14263787U JPS6447066U (en) | 1987-09-17 | 1987-09-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14263787U JPS6447066U (en) | 1987-09-17 | 1987-09-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6447066U true JPS6447066U (en) | 1989-03-23 |
Family
ID=31408762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14263787U Pending JPS6447066U (en) | 1987-09-17 | 1987-09-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6447066U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7271040B2 (en) | 2000-05-15 | 2007-09-18 | Kabushiki Kaisha Toshiba | Electrode contact section of semiconductor device |
-
1987
- 1987-09-17 JP JP14263787U patent/JPS6447066U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7271040B2 (en) | 2000-05-15 | 2007-09-18 | Kabushiki Kaisha Toshiba | Electrode contact section of semiconductor device |