JPH01121956U - - Google Patents

Info

Publication number
JPH01121956U
JPH01121956U JP1721788U JP1721788U JPH01121956U JP H01121956 U JPH01121956 U JP H01121956U JP 1721788 U JP1721788 U JP 1721788U JP 1721788 U JP1721788 U JP 1721788U JP H01121956 U JPH01121956 U JP H01121956U
Authority
JP
Japan
Prior art keywords
chip
semiconductor device
substrate
moisture
extended
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1721788U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1721788U priority Critical patent/JPH01121956U/ja
Publication of JPH01121956U publication Critical patent/JPH01121956U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案に係る半導体装置の実施例を示
す断面図、第２図は従来例を示す断面図、第３図
は第２図の従来例の改良試考例を示す断面図であ
る。 １……基板、２……ＩＣチツプ、３……リード
系、５……フイルム、Ｗ……透光部。 FIG. 1 is a sectional view showing an embodiment of a semiconductor device according to the present invention, FIG. 2 is a sectional view showing a conventional example, and FIG. 3 is a sectional view showing an improved trial example of the conventional example shown in FIG. . 1...Substrate, 2...IC chip, 3...Lead system, 5...Film, W...Transparent part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ＩＣチツプへの透光を可能とする透光部を有す
る実装構造を備えた半導体装置において、合成樹
脂製の基板に載置されるＩＣチツプの表面に透明
性、耐湿性の高い材質からなるフイルムを被着す
ると共に、ＩＣチツプに接続されるリード系を基
板の側方へ引出したことを特徴とする半導体装置
。 In a semiconductor device equipped with a mounting structure having a transparent part that allows light to pass through the IC chip, a film made of a highly transparent and moisture-resistant material is placed on the surface of the IC chip mounted on a synthetic resin substrate. 1. A semiconductor device characterized in that a lead system connected to an IC chip is extended to the side of the substrate.
JP1721788U 1988-02-10 1988-02-10 Pending JPH01121956U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1721788U JPH01121956U (en) 1988-02-10 1988-02-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1721788U JPH01121956U (en) 1988-02-10 1988-02-10

Publications (1)

Publication Number Publication Date
JPH01121956U true JPH01121956U (en) 1989-08-18

Family

ID=31230802

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1721788U Pending JPH01121956U (en) 1988-02-10 1988-02-10

Country Status (1)

Country Link
JP (1) JPH01121956U (en)

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