JPH01121953U - - Google Patents
Info
- Publication number
- JPH01121953U JPH01121953U JP1721488U JP1721488U JPH01121953U JP H01121953 U JPH01121953 U JP H01121953U JP 1721488 U JP1721488 U JP 1721488U JP 1721488 U JP1721488 U JP 1721488U JP H01121953 U JPH01121953 U JP H01121953U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- transparent
- semiconductor device
- sealing material
- synthetic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000003566 sealing material Substances 0.000 claims description 3
- 229920003002 synthetic resin Polymers 0.000 claims 2
- 239000000057 synthetic resin Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
Description
第１図は本考案に係る半導体装置の実施例を示
す断面図、第２図は従来例を示す断面図、第３図
は第２図の従来例の改良試考例を示す断面図であ
る。
１……基板、２……ＩＣチツプ、４……カバー
系、４１……遮蔽枠、４１′……透光窓穴、４２
……透光フード、５……シール材料、６……空隙
、Ｗ……透光部。
FIG. 1 is a sectional view showing an embodiment of a semiconductor device according to the present invention, FIG. 2 is a sectional view showing a conventional example, and FIG. 3 is a sectional view showing an improved trial example of the conventional example shown in FIG. . 1... Board, 2... IC chip, 4... Cover system, 41... Shielding frame, 41'... Transparent window hole, 42
...Transparent hood, 5...Sealing material, 6...Void, W...Transparent part.
Claims (1)
る実装構造を備えた半導体装置において、合成樹
脂製の基板に載置したＩＣチツプ周りにＩＣチツ
プの上方を開放する透光窓穴を有する合成樹脂製
の遮蔽枠を設け、透光窓穴内のＩＣチツプ直上を
除く部分に透明性、耐湿性の高いシール材料を充
填すると共に、透光フードの周縁をシール材料に
埋込み支持し透光フードをＩＣチツプ直上に設け
たことを特徴とする半導体装置。 In a semiconductor device equipped with a mounting structure having a transparent part that allows light to pass through to an IC chip, the semiconductor device has a transparent window hole around the IC chip mounted on a synthetic resin substrate that opens the upper part of the IC chip. A shielding frame made of synthetic resin is provided, and a highly transparent and moisture-resistant sealing material is filled in the transparent window hole except for directly above the IC chip, and the periphery of the transparent hood is embedded and supported in the sealing material to form a transparent hood. A semiconductor device characterized in that a semiconductor device is provided directly above an IC chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1721488U JPH01121953U (en) | 1988-02-10 | 1988-02-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1721488U JPH01121953U (en) | 1988-02-10 | 1988-02-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01121953U true JPH01121953U (en) | 1989-08-18 |
Family
ID=31230796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1721488U Pending JPH01121953U (en) | 1988-02-10 | 1988-02-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01121953U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001185657A (en) * | 1999-12-10 | 2001-07-06 | Amkor Technology Korea Inc | Semiconductor package and manufacturing method therefor |
-
1988
- 1988-02-10 JP JP1721488U patent/JPH01121953U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001185657A (en) * | 1999-12-10 | 2001-07-06 | Amkor Technology Korea Inc | Semiconductor package and manufacturing method therefor |