JPH01104736U - - Google Patents
Info
- Publication number
- JPH01104736U JPH01104736U JP40988U JP40988U JPH01104736U JP H01104736 U JPH01104736 U JP H01104736U JP 40988 U JP40988 U JP 40988U JP 40988 U JP40988 U JP 40988U JP H01104736 U JPH01104736 U JP H01104736U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead
- semiconductor device
- semiconductor
- flush
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例図、第２図は従来の
半導体装置図、第３図は本考案の半導体装置をプ
リント基板に実装し放熱板を取り付けた図である
。
１……半導体装置の放熱板、２……ネジ穴、３
……半導体装置、４……半導体装置傾斜防止用樹
脂、５……半導体装置のリード、６……半導体装
置のリードフオーシングされたリード、７……プ
リント基板、８……ネジ、９……外付け放熱板。
FIG. 1 is a diagram of an embodiment of the present invention, FIG. 2 is a diagram of a conventional semiconductor device, and FIG. 3 is a diagram of the semiconductor device of the present invention mounted on a printed circuit board and a heat sink attached. 1... Heat sink of semiconductor device, 2... Screw hole, 3
... Semiconductor device, 4 ... Resin for preventing tilting of semiconductor device, 5 ... Lead of semiconductor device, 6 ... Lead faced lead of semiconductor device, 7 ... Printed circuit board, 8 ... Screw, 9 ... External heat sink.
Claims (1)
部リードのうち所定の外部リードのリード面に封
入樹脂により半導体装置の片側の樹脂面と同一面
となる様樹脂をリードに付けた事を特徴とする半
導体装置。 A semiconductor characterized in that resin is attached to the lead surface of a predetermined external lead among a plurality of external leads led out in the same direction from a package using an encapsulating resin so that the lead surface is flush with the resin surface on one side of the semiconductor device. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP40988U JPH01104736U (en) | 1988-01-05 | 1988-01-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP40988U JPH01104736U (en) | 1988-01-05 | 1988-01-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01104736U true JPH01104736U (en) | 1989-07-14 |
Family
ID=31199409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP40988U Pending JPH01104736U (en) | 1988-01-05 | 1988-01-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01104736U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011155171A (en) * | 2010-01-28 | 2011-08-11 | Denso Corp | Semiconductor module |
-
1988
- 1988-01-05 JP JP40988U patent/JPH01104736U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011155171A (en) * | 2010-01-28 | 2011-08-11 | Denso Corp | Semiconductor module |