JPH01116460U - - Google Patents
Info
- Publication number
- JPH01116460U JPH01116460U JP1119488U JP1119488U JPH01116460U JP H01116460 U JPH01116460 U JP H01116460U JP 1119488 U JP1119488 U JP 1119488U JP 1119488 U JP1119488 U JP 1119488U JP H01116460 U JPH01116460 U JP H01116460U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- resin
- package
- view
- showing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例を示す樹脂封止型半
導体装置の側面図、第２図は同半導体装置の裏面
図、第３図は同半導体装置の実装状態を示す側面
図、第４図は同半導体装置の実装状態を示す正面
図、第５図は同半導体装置の要部拡大断面図、第
６図は従来の樹脂封止型半導体装置ＳＯＪの側面
図、第７図は同半導体装置のプリント基板への実
装状態を示す図、第８図は従来技術の問題点の説
明図である。
１１…モールド樹脂、１２…外部リード、１３
…プリント基板、１４…チツプ部品、１５…リー
ド部、１６…アイランド、１７…半導体素子、１
８…突起部。
FIG. 1 is a side view of a resin-sealed semiconductor device showing an embodiment of the present invention, FIG. 2 is a back view of the semiconductor device, FIG. 3 is a side view showing the semiconductor device in a mounted state, and FIG. The figure is a front view showing the mounted state of the semiconductor device, FIG. 5 is an enlarged cross-sectional view of the main part of the semiconductor device, FIG. 6 is a side view of a conventional resin-sealed semiconductor device SOJ, and FIG. 7 is the semiconductor device. FIG. 8, which is a diagram showing a state in which the device is mounted on a printed circuit board, is an explanatory diagram of problems in the prior art. 11...Mold resin, 12...External lead, 13
...Printed circuit board, 14...chip component, 15...lead part, 16...island, 17...semiconductor element, 1
8...Protrusion.
Claims (1)
封止型半導体装置において、 リード間隔の大きい部分のパツケージ裏面に樹
脂の突起部を設けたことを特徴とする樹脂封止型
半導体装置。[Claim for Utility Model Registration] A resin-sealed semiconductor device having leads led out from a package, characterized in that a resin protrusion is provided on the back of the package where the lead spacing is large. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1119488U JPH01116460U (en) | 1988-02-01 | 1988-02-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1119488U JPH01116460U (en) | 1988-02-01 | 1988-02-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01116460U true JPH01116460U (en) | 1989-08-07 |
Family
ID=31219531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1119488U Pending JPH01116460U (en) | 1988-02-01 | 1988-02-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01116460U (en) |
-
1988
- 1988-02-01 JP JP1119488U patent/JPH01116460U/ja active Pending