JPH0456340U - - Google Patents
Info
- Publication number
- JPH0456340U JPH0456340U JP9883490U JP9883490U JPH0456340U JP H0456340 U JPH0456340 U JP H0456340U JP 9883490 U JP9883490 U JP 9883490U JP 9883490 U JP9883490 U JP 9883490U JP H0456340 U JPH0456340 U JP H0456340U
- Authority
- JP
- Japan
- Prior art keywords
- main surface
- test pad
- circuit board
- circuit
- output terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
図は本発明の実施例の構成を示す断面図である
。
主要部分の符号の説明、1……回路基板、2…
…ICチツプ、3……半導体集積回路、4……ボ
ンデイングランド、5……ワイヤ、6……接続ラ
ンド、7……リード、8……スルーホール、9…
…試験用パツド。
The figure is a sectional view showing the configuration of an embodiment of the present invention. Explanation of symbols of main parts, 1...Circuit board, 2...
...IC chip, 3...Semiconductor integrated circuit, 4...Bonding land, 5...Wire, 6...Connection land, 7...Lead, 8...Through hole, 9...
...Test pad.
Claims (1)
つて、他主表面に設けられた試験用パツドと、前
記回路部品の入出力端子と前記試験用パツドとを
接続する接続手段とを含むことを特徴とする回路
基板。 A circuit board with circuit components mounted on one main surface, including a test pad provided on the other main surface, and connection means for connecting the input/output terminal of the circuit component and the test pad. A circuit board featuring:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9883490U JPH0456340U (en) | 1990-09-20 | 1990-09-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9883490U JPH0456340U (en) | 1990-09-20 | 1990-09-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0456340U true JPH0456340U (en) | 1992-05-14 |
Family
ID=31840308
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9883490U Pending JPH0456340U (en) | 1990-09-20 | 1990-09-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0456340U (en) |
-
1990
- 1990-09-20 JP JP9883490U patent/JPH0456340U/ja active Pending