JPH0270447U - - Google Patents
Info
- Publication number
- JPH0270447U JPH0270447U JP1988150469U JP15046988U JPH0270447U JP H0270447 U JPH0270447 U JP H0270447U JP 1988150469 U JP1988150469 U JP 1988150469U JP 15046988 U JP15046988 U JP 15046988U JP H0270447 U JPH0270447 U JP H0270447U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- recess
- placement
- utility
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Die Bonding (AREA)
Description
第１図は本考案のＩＣ実装の回路基板構造の一
実施例を示す主要断面図。第２図は従来のＩＣ実
装の回路基板構造を示す断面図。
１……回路基板基材、２……配線導体、３……
レジスト、４……回路基板、５……凹部、６……
ＩＣチツプ、７……接着剤、８……金線、９……
ＩＣ封止樹脂、１０……貫通穴。
FIG. 1 is a main cross-sectional view showing an embodiment of the IC-mounted circuit board structure of the present invention. FIG. 2 is a sectional view showing the structure of a conventional IC-mounted circuit board. 1... Circuit board base material, 2... Wiring conductor, 3...
Resist, 4... Circuit board, 5... Recess, 6...
IC chip, 7...adhesive, 8...gold wire, 9...
IC sealing resin, 10...through hole.
Claims (1)
回路基板のＩＣ配置部にＩＣ配置用の凹部を有し
さらに、前記凹部に回路基板の両側、両間に貫通
する穴を少なくとも１つ以上設けたことを特徴と
する回路基板構造。 In the structure in which an IC is mounted on a circuit board, the IC placement part of the circuit board has a recess for IC placement, and the recess has at least one hole penetrating between both sides of the circuit board. A circuit board structure featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988150469U JPH0270447U (en) | 1988-11-18 | 1988-11-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988150469U JPH0270447U (en) | 1988-11-18 | 1988-11-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0270447U true JPH0270447U (en) | 1990-05-29 |
Family
ID=31423644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988150469U Pending JPH0270447U (en) | 1988-11-18 | 1988-11-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0270447U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0845968A (en) * | 1994-08-04 | 1996-02-16 | Nec Corp | Semiconductor package |
| JPH08167678A (en) * | 1994-12-09 | 1996-06-25 | Sony Corp | Semiconductor device |
| JP2818975B2 (en) * | 1992-06-23 | 1998-10-30 | ミンテック コーポレーション | Hollow fiber membrane containing surfactant and its production method |
| JP4489137B1 (en) * | 2009-01-20 | 2010-06-23 | パナソニック株式会社 | Circuit module and electronic device |
-
1988
- 1988-11-18 JP JP1988150469U patent/JPH0270447U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2818975B2 (en) * | 1992-06-23 | 1998-10-30 | ミンテック コーポレーション | Hollow fiber membrane containing surfactant and its production method |
| JPH0845968A (en) * | 1994-08-04 | 1996-02-16 | Nec Corp | Semiconductor package |
| JPH08167678A (en) * | 1994-12-09 | 1996-06-25 | Sony Corp | Semiconductor device |
| JP4489137B1 (en) * | 2009-01-20 | 2010-06-23 | パナソニック株式会社 | Circuit module and electronic device |
| JP2010171082A (en) * | 2009-01-20 | 2010-08-05 | Panasonic Corp | Circuit module and electronic equipment |