JPS63115233U - - Google Patents
Info
- Publication number
- JPS63115233U JPS63115233U JP766387U JP766387U JPS63115233U JP S63115233 U JPS63115233 U JP S63115233U JP 766387 U JP766387 U JP 766387U JP 766387 U JP766387 U JP 766387U JP S63115233 U JPS63115233 U JP S63115233U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- lead
- lead frame
- resin
- chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000004020 conductor Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の断面図、第２図は
従来の断面図である。
１……配線基板、２……リードフレーム、３…
…導体配線、４……外装樹脂、５……外装樹脂、
６……配線基板、７……リードフレーム、８……
ＩＣチツプ、９……導体配線、１０……金ワイヤ
、１１……リードフレーム。
FIG. 1 is a sectional view of one embodiment of the present invention, and FIG. 2 is a sectional view of a conventional device. 1... Wiring board, 2... Lead frame, 3...
...Conductor wiring, 4...Exterior resin, 5...Exterior resin,
6...Wiring board, 7...Lead frame, 8...
IC chip, 9...conductor wiring, 10...gold wire, 11...lead frame.
Claims (1)
ームの一部とを樹脂封止した混成集積回路におい
て、前記リードの一端部が前記配線基板と直接接
着していることを特徴とする混成集積回路。 1. A hybrid integrated circuit in which a wiring board on which a plurality of chips are mounted and a part of a lead frame are sealed with resin, characterized in that one end of the lead is directly bonded to the wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP766387U JPS63115233U (en) | 1987-01-21 | 1987-01-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP766387U JPS63115233U (en) | 1987-01-21 | 1987-01-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63115233U true JPS63115233U (en) | 1988-07-25 |
Family
ID=30791326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP766387U Pending JPS63115233U (en) | 1987-01-21 | 1987-01-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63115233U (en) |
-
1987
- 1987-01-21 JP JP766387U patent/JPS63115233U/ja active Pending
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