JPH031431U - - Google Patents
Info
- Publication number
- JPH031431U JPH031431U JP5881489U JP5881489U JPH031431U JP H031431 U JPH031431 U JP H031431U JP 5881489 U JP5881489 U JP 5881489U JP 5881489 U JP5881489 U JP 5881489U JP H031431 U JPH031431 U JP H031431U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- view
- utility
- semiconductor chip
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Description
第１図ａは本考案の一実施例を示す平面図。第
１図ｂは第１図ａのＡ部断面図。第２図ａは従来
のＩＣダイパツト構造を示す平面図。第２図ｂは
第２図ａのＡ部断面図。第３図ａは従来のＩＣダ
イパツト構造を示す平面図。第３図ｂは第３図ａ
のＡ部断面図。第４図ａは本考案の実施例を示す
平面図。第４図ｂは第４図ａのＡ部断面図。
１……回路基板、２……ＩＣダイパツト、３…
…ＩＣチツプ、４……接着剤、５……ＩＣダイパ
ツト凹部、６……接着剤の逃げ。
FIG. 1a is a plan view showing an embodiment of the present invention. FIG. 1b is a sectional view of section A in FIG. 1a. FIG. 2a is a plan view showing a conventional IC die pad structure. FIG. 2b is a sectional view of section A in FIG. 2a. FIG. 3a is a plan view showing a conventional IC die pad structure. Figure 3b is Figure 3a
A sectional view of part A. FIG. 4a is a plan view showing an embodiment of the present invention. FIG. 4b is a sectional view of section A in FIG. 4a. 1... Circuit board, 2... IC die part, 3...
...IC chip, 4...adhesive, 5...IC die-pat recess, 6...adhesive escape.
Claims (1)
Ｃダイパツトが凹構造をしており、接着剤の逃げ
部を有することを特徴とする回路基板。 In a circuit board on which a semiconductor chip is mounted, I
A circuit board characterized in that the C die part has a concave structure and has an adhesive relief part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5881489U JPH031431U (en) | 1989-05-22 | 1989-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5881489U JPH031431U (en) | 1989-05-22 | 1989-05-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH031431U true JPH031431U (en) | 1991-01-09 |
Family
ID=31584766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5881489U Pending JPH031431U (en) | 1989-05-22 | 1989-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH031431U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005296484A (en) * | 2004-04-15 | 2005-10-27 | Takahane Akihiko | Footwear which allows projecting toes individually from upper |
| JP2014022576A (en) * | 2012-07-18 | 2014-02-03 | Nichia Chem Ind Ltd | Semiconductor element mounting member and semiconductor device |
| JP2016184756A (en) * | 2016-06-10 | 2016-10-20 | 日亜化学工業株式会社 | Semiconductor element mounting member and semiconductor device |
-
1989
- 1989-05-22 JP JP5881489U patent/JPH031431U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005296484A (en) * | 2004-04-15 | 2005-10-27 | Takahane Akihiko | Footwear which allows projecting toes individually from upper |
| JP4504725B2 (en) * | 2004-04-15 | 2010-07-14 | 高羽 昭彦 | Footwear that allows the toes to be individually projected from the upper |
| JP2014022576A (en) * | 2012-07-18 | 2014-02-03 | Nichia Chem Ind Ltd | Semiconductor element mounting member and semiconductor device |
| JP2016184756A (en) * | 2016-06-10 | 2016-10-20 | 日亜化学工業株式会社 | Semiconductor element mounting member and semiconductor device |