JPH0258339U - - Google Patents
Info
- Publication number
- JPH0258339U JPH0258339U JP13741288U JP13741288U JPH0258339U JP H0258339 U JPH0258339 U JP H0258339U JP 13741288 U JP13741288 U JP 13741288U JP 13741288 U JP13741288 U JP 13741288U JP H0258339 U JPH0258339 U JP H0258339U
- Authority
- JP
- Japan
- Prior art keywords
- surface mount
- mount component
- protrusion
- circuit board
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図及び第２図は本考案の一実施例を示す平
面図、第３図及び第４図は従来の一例を示す平面
図である。
１……半導体チツプ封止樹脂、２……リード、
３……突起、４……回路基板、５……パターン、
６……スルーホール、７……リード番号印。
FIGS. 1 and 2 are plan views showing an embodiment of the present invention, and FIGS. 3 and 4 are plan views showing an example of the conventional device. 1...Semiconductor chip sealing resin, 2...Lead,
3...Protrusion, 4...Circuit board, 5...Pattern,
6...Through hole, 7...Lead number stamp.
Claims (1)
の周囲に有し回路基板上に実装する表面実装部品
において、半導体チツプを封止する樹脂に突起を
有することを特徴とする表面実装部品。 1. A surface mount component having a large number of leads arranged in parallel at predetermined intervals around the surface mount component and mounted on a circuit board, the surface mount component having a protrusion on a resin for sealing a semiconductor chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13741288U JPH0258339U (en) | 1988-10-20 | 1988-10-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13741288U JPH0258339U (en) | 1988-10-20 | 1988-10-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0258339U true JPH0258339U (en) | 1990-04-26 |
Family
ID=31398812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13741288U Pending JPH0258339U (en) | 1988-10-20 | 1988-10-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0258339U (en) |
-
1988
- 1988-10-20 JP JP13741288U patent/JPH0258339U/ja active Pending
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