JPH0263565U - - Google Patents
Info
- Publication number
- JPH0263565U JPH0263565U JP14284988U JP14284988U JPH0263565U JP H0263565 U JPH0263565 U JP H0263565U JP 14284988 U JP14284988 U JP 14284988U JP 14284988 U JP14284988 U JP 14284988U JP H0263565 U JPH0263565 U JP H0263565U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- semiconductor device
- main surface
- sticker
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 2
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の一実施例としてユニバーサル
プリント基板上に実装された集積回路装置直下の
配線側の基板面に集積回路装置リード番号表示シ
ールが貼付られた例を示す平面図である。
１……ユニバーサルプリント基板、２……集積
回路装置リード番号表示シール、３……集積回路
装置、４……シール上印刷数字、５……集積回路
装置用実使用端子座、６……未使用座。
FIG. 1 is a plan view showing an example in which an integrated circuit device lead number display sticker is affixed to the wiring side surface of the integrated circuit device mounted on a universal printed circuit board as an embodiment of the present invention. 1...Universal printed circuit board, 2...Integrated circuit device lead number display sticker, 3...Integrated circuit device, 4...Numbers printed on the seal, 5...Actually used terminal base for integrated circuit device, 6...Unused seat.
Claims (1)
配列されたプリント基板において、前記半導体装
置が装着される主面と反対の主面上に貼付される
シールを備え、このシールには前記リードの番号
が各々設けられていることを特徴とするプリント
基板。 A printed circuit board in which a large number of holes into which semiconductor device leads are inserted is provided with a sticker affixed on the main surface opposite to the main surface into which the semiconductor device is mounted, and this sticker includes the number of the lead. A printed circuit board characterized in that each of these is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14284988U JPH0263565U (en) | 1988-10-31 | 1988-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14284988U JPH0263565U (en) | 1988-10-31 | 1988-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0263565U true JPH0263565U (en) | 1990-05-11 |
Family
ID=31409145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14284988U Pending JPH0263565U (en) | 1988-10-31 | 1988-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0263565U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04303991A (en) * | 1991-04-01 | 1992-10-27 | Nec Corp | Printed wiring board |
-
1988
- 1988-10-31 JP JP14284988U patent/JPH0263565U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04303991A (en) * | 1991-04-01 | 1992-10-27 | Nec Corp | Printed wiring board |
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