JPS62154672U - - Google Patents
Info
- Publication number
- JPS62154672U JPS62154672U JP4158186U JP4158186U JPS62154672U JP S62154672 U JPS62154672 U JP S62154672U JP 4158186 U JP4158186 U JP 4158186U JP 4158186 U JP4158186 U JP 4158186U JP S62154672 U JPS62154672 U JP S62154672U
- Authority
- JP
- Japan
- Prior art keywords
- positioning display
- circuit board
- printing
- utility
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012528 membrane Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Die Bonding (AREA)
Description
第１図は、本考案の一実施例の膜回路基板の使
用状態を示す平面図である。
１……膜回路基板、２，３……チツプコンデン
サ、４，５……ＦＥＴチツプ、６ａ〜ｃ，８……
実装部品位置決め表示、７ａ，７ｂ……ワイヤー
ボーデイング位置決め表示、９……パターン、１
０……ワイヤーである。
FIG. 1 is a plan view showing a state in which a membrane circuit board according to an embodiment of the present invention is used. 1... Membrane circuit board, 2, 3... Chip capacitor, 4, 5... FET chip, 6a-c, 8...
Mounted component positioning display, 7a, 7b...Wire boarding positioning display, 9...Pattern, 1
0...It is a wire.
Claims (1)
品位置決め表示及びワイヤーボンデイング位置決
め表示のうち少なくとも一方が附してあることを
特徴とする膜回路基板。 1. A film circuit board characterized in that at least one of a mounting component positioning display and a wire bonding positioning display are printed simultaneously when printing a circuit pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4158186U JPS62154672U (en) | 1986-03-20 | 1986-03-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4158186U JPS62154672U (en) | 1986-03-20 | 1986-03-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62154672U true JPS62154672U (en) | 1987-10-01 |
Family
ID=30856714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4158186U Pending JPS62154672U (en) | 1986-03-20 | 1986-03-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62154672U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05145215A (en) * | 1991-11-19 | 1993-06-11 | Taiyo Yuden Co Ltd | Formation of parts-positioning mark for printed wiring board |
-
1986
- 1986-03-20 JP JP4158186U patent/JPS62154672U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05145215A (en) * | 1991-11-19 | 1993-06-11 | Taiyo Yuden Co Ltd | Formation of parts-positioning mark for printed wiring board |