JPH0447542U - - Google Patents
Info
- Publication number
- JPH0447542U JPH0447542U JP8870490U JP8870490U JPH0447542U JP H0447542 U JPH0447542 U JP H0447542U JP 8870490 U JP8870490 U JP 8870490U JP 8870490 U JP8870490 U JP 8870490U JP H0447542 U JPH0447542 U JP H0447542U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- base
- ceramic
- cover
- except
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
Landscapes
- Electronic Switches (AREA)
Description
第１図はこの考案の一実施例によるサーマルヘ
ツドの示す断面図、第２図は下面図である。第３
図は他の実施例によるサーマルヘツドの断面図、
第４図は他の実施例による下面図、第５図は従来
のサーマルヘツドを示す断面図である。
図において、１……ベース、２……セラミツク
回路基板、３……抵抗体、４……ＩＣ、５……カ
バー、６……プリント基板、７……コネクター、
８……接着剤、９……両面テープ、１０……穴を
示す。なお、図中、同一符号は同一、または相当
部分を示す。
FIG. 1 is a sectional view showing a thermal head according to an embodiment of the invention, and FIG. 2 is a bottom view. Third
The figure is a sectional view of a thermal head according to another embodiment.
FIG. 4 is a bottom view of another embodiment, and FIG. 5 is a sectional view showing a conventional thermal head. In the figure, 1... base, 2... ceramic circuit board, 3... resistor, 4... IC, 5... cover, 6... printed circuit board, 7... connector,
8... Adhesive, 9... Double-sided tape, 10... Hole. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
ープの上に、セラミツク回路基板を組付け、その
となりにＩＣを搭載したプリント基板を、ＩＣの
ワイヤーにて電気的にセラミツク基板に接合され
るよう組付け、その上にセラミツク回路基板及び
プリント基板を保護する目的でカバーを配設し固
定し、ベースの中心付近の穴から接着剤を塗布し
、セラミツク回路基板の抵抗体とＩＣ部の裏面以
外の中心部分とベースを接合するような構造にし
たことを技術としたサーマルヘツド。 A ceramic circuit board is assembled onto the double-sided tape pasted on the surface of the base except for the holes in the base, and a printed circuit board with an IC mounted next to it is electrically bonded to the ceramic board using the IC wire. After assembly, place a cover on top of it to protect the ceramic circuit board and printed circuit board, and then apply adhesive from the hole near the center of the base to cover all parts of the ceramic circuit board except for the resistor and the back side of the IC part. Thermal head technology is based on a structure that connects the center part of the head to the base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8870490U JP2501908Y2 (en) | 1990-08-24 | 1990-08-24 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8870490U JP2501908Y2 (en) | 1990-08-24 | 1990-08-24 | Thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0447542U true JPH0447542U (en) | 1992-04-22 |
| JP2501908Y2 JP2501908Y2 (en) | 1996-06-19 |
Family
ID=31822148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8870490U Expired - Lifetime JP2501908Y2 (en) | 1990-08-24 | 1990-08-24 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2501908Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014213527A (en) * | 2013-04-25 | 2014-11-17 | 京セラ株式会社 | Thermal head and thermal printer |
| JP2015085535A (en) * | 2013-10-28 | 2015-05-07 | 京セラ株式会社 | Thermal head and thermal printer including the same |
-
1990
- 1990-08-24 JP JP8870490U patent/JP2501908Y2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014213527A (en) * | 2013-04-25 | 2014-11-17 | 京セラ株式会社 | Thermal head and thermal printer |
| JP2015085535A (en) * | 2013-10-28 | 2015-05-07 | 京セラ株式会社 | Thermal head and thermal printer including the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2501908Y2 (en) | 1996-06-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |