JP2501908Y2 - Thermal head - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to an improvement of a thermal head used for printing on thermal recording paper.

[Prior Art] A conventional thermal head mechanism is shown in FIG. Assemble the ceramic circuit board (2) to the base (1) with the double-sided tape (9) stretched on one side of the surface, and place the printed circuit board (6) on which the IC (4) is mounted next to the IC (4).
The cover (5) is installed for the purpose of protecting the ceramic circuit board (2) and the printed circuit board (6) on the ceramic circuit board (2) so as to be electrically connected with the wire However, they were fixed by screws (not shown).

[Problems to be solved by the device]

Since the conventional thermal head is configured as described above, when printing, the ceramic circuit board (2) receives a stronger force than the adhesive force of the double-sided tape (9) in the direction of the arrow by the platen roller (not shown), paper, etc. Not to move when
At the end of BASE, we had to make a structure to receive the ceramic circuit board. With this structure, the distance from the end of the base (1) to the resistor (3) is determined by the accumulation of the processing accuracy of the base (1) and the processing accuracy of the ceramic circuit board, and it is difficult to obtain accuracy. I got it.

Furthermore, when mounting the thermal head on the device,
Although the connector (7) is attached and detached, the printed circuit board (6) is held only by the double-sided tape (9), and therefore the printed circuit board (6) does not move due to pulling or shearing load. Therefore, there was a problem that the wire of the IC (4) was broken.

The present invention has been made to solve the above-mentioned problems, and it secures the positioning and accuracy of the resistor without moving even if it receives the force of the platen roller, etc. The purpose is to obtain a thermal head having a structure that prevents the occurrence of defects such as IC wire breakage due to movement of the IC.

[Means for solving the problem]

The thermal head according to this invention has a hole in BASE,
Apply adhesive from the hole to join the resistor of the ceramic circuit board and the center of the IC part other than the back surface to the base,
In addition, the adhesive is applied from one or more holes in another BASE to join the printed circuit board near the connector to the base.

[Action]

In the thermal head according to the present invention, the base and the ceramic circuit board, the base and the printed board, and the base and the connector are fixed with an adhesive, so that a good mechanical connection can be achieved.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, (1) is a base, (2) is a ceramic circuit board, (3) is a resistor, (4) is an IC, (5) is a cover, (6) is a printed circuit board, and (7) is a connector. ,
(8) is an adhesive, (9) is a double-sided tape, and (10) is a hole.

A printed circuit board on which the ceramic circuit board (2) is mounted on the double-sided tape (9) stretched on the surface of the base (1) other than the holes (10) of the base (1), and the IC (4) is mounted next to it. Assemble (6) with the wire of the IC (4) so as to be electrically joined to the ceramic substrate (2), and cover () to protect the ceramic circuit board (2) and the printed circuit board (6). 5) is arranged and fixed with screws (not shown), and further, an adhesive (8) is applied from the hole (10) near the center of the base to form the resistor (3) of the ceramic circuit board (2). Adhesive (8) is applied from the single or multiple holes (10) near the connector (7) so that the central part other than the back surface of the IC part (4) is joined to the base (1) and the vicinity of the connector (7) The printed board (6) and the base (1) were joined together.

The ceramic circuit board (2) has a resistor (3), and the generated heat must be released. for that reason,
The base (1) is required under the resistor (3) for heat dissipation, and the hole (10) should not be provided. Further, the hole (10) should not be provided under the mounting portion of the IC (4) on the ceramic circuit board (2) for the sake of stability during mounting. Therefore, a hole (10) for joining is provided in the other portion.
If the base (1) and the ceramic circuit board (2) are fixed to each other with adhesives (8) at a plurality of locations, the bimetal will differ due to the difference in linear expansion coefficient between the metal base (1) and the ceramic circuit board (2). Due to the effect, warpage occurs, so that the thermal head is joined at only one central portion. This time,
Since the double-sided tape (9) is elastic, the base (1) and the
It plays a role of absorbing the difference in linear expansion coefficient of the ceramic circuit board (2). Further, the holes in the base (1) near the connector (7) are for applying and curing an adhesive (8) in order to prevent the printed circuit board (6) from moving due to the attachment and detachment of the connector (7). ) The number, size, and type are free depending on the size. Fig. 2 shows examples of three-point holes and long holes.

In the above embodiment, in order to prevent the printed circuit board (6) from moving when the connector (7) was attached and detached, the adhesive (8) was applied through the hole (10) near the printed circuit board (6) and fixed. However, even if the adhesive (8) is directly filled between the connector (7) and the base (1) as shown in FIGS. 3 and 4, the same effect as that of the above-mentioned embodiment is obtained.

[Effect of device]

As described above, according to the present invention, it is possible to fill the holes in the base with the adhesive and fix the ceramic circuit board,
It is not necessary to have a structure to receive the ceramic circuit board at the base end, and it is possible to position the resistor without being affected by the processing accuracy of the ceramic circuit board and the base, and the hole in the base near the connector. By filling the adhesive with the adhesive, it is possible to eliminate the movement of the printed circuit board when the connector is attached and detached, and it is possible to prevent the defect that the IC wire is disconnected.

[Brief description of drawings]

FIG. 1 is a sectional view showing a thermal head according to an embodiment of the present invention, and FIG. 2 is a bottom view. FIG. 3 is a sectional view of a thermal head according to another embodiment, FIG. 4 is a bottom view of the other embodiment, and FIG. 5 is a sectional view showing a conventional thermal head. In the figure, (1) base, (2) ceramic circuit board, (3) resistor, (4) IC, (5) cover, (6) printed board, (7) connector, (8) adhesive, (9) )
Double-sided tape, showing (10) hole. In the drawings, the same reference numerals indicate the same or corresponding parts.

Claims (1)

(57) [Scope of utility model registration request] 1. A ceramic circuit board is assembled on a double-sided tape stretched on the surface of the base other than the holes of the base, and a printed circuit board mounted with an IC next to the ceramic circuit board is electrically connected by a wire of the IC. Assembled so as to be bonded to, and fixed and fixed a cover on it for the purpose of protecting the ceramic circuit board and the printed circuit board, and applying adhesive from the hole near the center of the base, and the resistor of the ceramic circuit board. A thermal head whose technology is to have a structure that joins the base and the central part other than the back surface of the IC section.