JPS63117431A - Mounting structure of electronic parts - Google Patents
Mounting structure of electronic partsInfo
- Publication number
- JPS63117431A JPS63117431A JP61262686A JP26268686A JPS63117431A JP S63117431 A JPS63117431 A JP S63117431A JP 61262686 A JP61262686 A JP 61262686A JP 26268686 A JP26268686 A JP 26268686A JP S63117431 A JPS63117431 A JP S63117431A
- Authority
- JP
- Japan
- Prior art keywords
- tab
- ceramic substrate
- buffer member
- heat
- thermal expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 239000000463 material Substances 0.000 claims abstract description 3
- 239000012212 insulator Substances 0.000 claims description 8
- 230000003139 buffering effect Effects 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、テープキャリア方式で組立てられたタブ付集
積回路とセラミック基板とで構成される電子部品の構造
に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the structure of an electronic component composed of a tabbed integrated circuit assembled using a tape carrier method and a ceramic substrate.
従来、この種の電子部品の実装構造としては、例えば第
２図に示すようなものがある。第２図に示す電子部品１
は、セラミック基板２の上にブロック状の緩衝用有機絶
縁体３が設置されていて、その上にタブ付集積回路（以
下タブＩＣという）４が実装されている。タブＩＣ４の
タブ５とセラミック基板２は、タブＩＣリード６で接続
されている。セラミック基板２上の上記の各部品は、セ
ラミック基板２に固着されたキャップ７によりカバーさ
れている。Conventionally, there is a mounting structure for this type of electronic component as shown in FIG. 2, for example. Electronic component 1 shown in Figure 2
A block-shaped buffering organic insulator 3 is placed on a ceramic substrate 2, and a tab integrated circuit (hereinafter referred to as tab IC) 4 is mounted thereon. The tab 5 of the tab IC 4 and the ceramic substrate 2 are connected by a tab IC lead 6. Each of the above components on the ceramic substrate 2 is covered by a cap 7 fixed to the ceramic substrate 2.
上述した従来の電子部品の組立て構造では、緩衝用有機
絶縁体３がブロック体であるので、タブＩＣ４をセラミ
ック基板２に装着するときに加えられる熱のために緩衝
用有機絶縁体３が熱瞼脹を起こし、タブＩＣ４を変位さ
せてしまう。この緩衝用有機絶縁体３の変位によりタブ
ＩＣ４を精度よくセラミック基板２に装着できないとい
う欠点があった。また、緩衝用有機絶縁体３の熱膨脹を
抑えるために、有機絶縁体以外の金属物を使用すると、
緩衝用有機絶縁体３を構成しているブロック体に弾性が
ないので、電子部品の発熱等によって生じる構成部品間
の歪を充分吸収することができず、これらの歪による大
きな応力がタブＩＣ４に作用して、タブＩＣ４を破損さ
せてしまうという欠点があった。In the above-described conventional electronic component assembly structure, the buffer organic insulator 3 is a block body, so the buffer organic insulator 3 is heated due to the heat applied when the tab IC 4 is attached to the ceramic substrate 2. This causes swelling and displaces the tab IC4. Due to this displacement of the buffering organic insulator 3, there was a drawback that the tab IC 4 could not be accurately mounted on the ceramic substrate 2. In addition, if a metal material other than the organic insulator is used to suppress the thermal expansion of the buffer organic insulator 3,
Since the block body constituting the buffering organic insulator 3 has no elasticity, it cannot sufficiently absorb the strain between the components caused by heat generation of electronic components, etc., and the large stress due to this strain is applied to the tab IC 4. This has the disadvantage that the tab IC 4 may be damaged.
本発明は、このような欠点を解消した電子部品の実装構
造の提供を目的としている。The present invention aims to provide a mounting structure for electronic components that eliminates such drawbacks.
本発明の電子部品の実装構造は、緩衝用部材を、熱膨脹
率の小さく、かつ弾性の高い薄板で構成し、この緩衝部
材品をセラミック基板とタブＩＣとの間に設置したこと
を特徴としている。The electronic component mounting structure of the present invention is characterized in that the buffer member is composed of a thin plate with a low coefficient of thermal expansion and high elasticity, and the buffer member is installed between the ceramic substrate and the tab IC. .
従って、熱膨脹率が小さく、弾性の高い緩衝部材により
、セラミック基板とタブＩＣとの間の緩衝力が向上して
、タブＩＣを損傷させることなく、かつ熱膨脹によりタ
ブＩＣを変位させることなく、タブＩＣを精度よくセラ
ミック基板に装着することが可能となる。Therefore, the buffering member with a low coefficient of thermal expansion and high elasticity improves the buffering force between the ceramic substrate and the tab IC, so that the tab It becomes possible to mount an IC on a ceramic substrate with high precision.
以下本発明の一実施例を、図面に基づいて説明する。 An embodiment of the present invention will be described below based on the drawings.
なお、第２図に示すものと同一の機能のものは同じ符号
で表わしてその説明は省略する。Components having the same functions as those shown in FIG. 2 are designated by the same reference numerals, and their explanation will be omitted.
第１図は、本発明の電子部品の実装構造の一実施例を示
す縦断正面図である。FIG. 1 is a longitudinal sectional front view showing an embodiment of the electronic component mounting structure of the present invention.
本発明の実装構造による電子部品１１は、セラミック基
板２とタブＩＣ４との間に緩衝部材１２が配置されてい
る。この緩衝部材１２は、上方に開口していて弾性を有
する薄板からなる凹状部材１２ａと、その下部に基部を
それぞれ固着されていて、自由端がほぼ水平状をなす弾
性を有する１対の脚部材１２ｂとから形成されている。In the electronic component 11 according to the mounting structure of the present invention, a buffer member 12 is disposed between the ceramic substrate 2 and the tab IC 4. This buffer member 12 includes a concave member 12a made of an elastic thin plate that is open upward, and a pair of elastic leg members whose bases are fixed to the lower part of the concave member 12a and whose free ends are substantially horizontal. 12b.
状緩衝部材１２には、熱膨脹率が小さく、かつ弾性の高
い材質が用いられている。The shaped buffer member 12 is made of a material with a low coefficient of thermal expansion and high elasticity.
上記のように構成された電子部品１１において、キャッ
プ７が、熱によって歪むか、あるいはキャップ７の上か
ら外力が加わる等により、タブＩＣ４に外力が作用して
も、緩衝部材１２がこれらの外力による応力を変位によ
り吸収して、タブＩＣ４の損傷をさけることができる。In the electronic component 11 configured as described above, even if an external force acts on the tab IC 4 due to the cap 7 being distorted due to heat or an external force being applied from above the cap 7, the buffer member 12 is able to absorb the external force. Damage to the tab IC 4 can be avoided by absorbing the stress due to the displacement.
また、タブＩＣ４を、緩衝部材１２を介してセラミック
基板２に装着する際に熱を加えても、緩衝部材１２は熱
による変位が小さいので、タブＩ Ｃ’４がこれにより
ずれるということがなく、タブＩＣ４を精度よくセラミ
ック基板２に装着することができる。Furthermore, even if heat is applied when attaching the tab IC4 to the ceramic substrate 2 via the buffer member 12, the buffer member 12 is only slightly displaced by the heat, so the tab IC'4 will not shift due to this. , the tab IC 4 can be mounted on the ceramic substrate 2 with high precision.
以上説明したように本発明によれば、セラミック基板と
、タブＩＣとの間に熱膨脹率が小さく、かつ弾性の高い
緩衝部材を設置することにより、電子部品に作用する熱
または外力によりタブＩＣに発生する応力を緩衝部材に
より吸収してタブＩＣの破損を防止するとともに、タブ
ＩＣをセラミック基板に装着する際に熱が加えられても
、緩衝部材の変位が小さいのでタブＩＣがずれることが
な（、精度よくタブＩＣをセラミック基板に装着するこ
とができる。As explained above, according to the present invention, by installing a buffer member having a small coefficient of thermal expansion and high elasticity between a ceramic substrate and a tab IC, heat or external force acting on the electronic component can be applied to the tab IC. The generated stress is absorbed by the buffer member to prevent damage to the tab IC, and even if heat is applied when attaching the tab IC to the ceramic substrate, the displacement of the buffer member is small, so the tab IC will not shift. (The tab IC can be mounted on the ceramic substrate with high precision.
第１図は本発明の一実施例を示す電子部品の実装構造の
縦断正面図、第２図は従来の電子部品の実装構造の一例
を示す縦断正面図である。
２・・・・・・セラミック基板、
４・・・・・・タブ付集積回路、
５・・・・・・タブ、６・・・・・・タブＩＣリード、
７・・・・・・キャップ、１１・・・・・・電子部品、
１２・・・・・・緩挿１部材。
出 願 人
日本電気株式会社
代 理 人FIG. 1 is a longitudinal sectional front view of an electronic component mounting structure showing an embodiment of the present invention, and FIG. 2 is a longitudinal sectional front view showing an example of a conventional electronic component mounting structure. 2... Ceramic substrate, 4... Integrated circuit with tab, 5... Tab, 6... Tab IC lead,
7...Cap, 11...Electronic parts,
12...1 member for loose insertion. Applicant: NEC Corporation Representative
Claims (1)
ーンに接続可能の複数のタブを有するタブ付集積回路と
、このタブ付集積回路を前記セラミック基板に接合固定
するための緩衝部材と、前記セラミック基板上に搭載さ
れた部品をカバーするキャップとからなる電子部品組み
立て構造において、前記緩衝部材を、熱膨脹の小さい材
料であって弾性を有する薄板で形成し、この緩衝用有機
絶縁体を、前記セラミック基板とタブ付集積回路との間
に設置したことを特徴とする電子部品の実装構造。a ceramic substrate having a wiring pattern; a tabbed integrated circuit having a plurality of tabs connectable to the wiring pattern; a buffer member for bonding and fixing the tabbed integrated circuit to the ceramic substrate; In an electronic component assembly structure consisting of a cap that covers mounted components, the buffer member is formed of a thin elastic plate made of a material with low thermal expansion, and the buffer organic insulator is attached to the ceramic substrate and the tab. An electronic component mounting structure characterized by being installed between an attached integrated circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61262686A JPS63117431A (en) | 1986-11-06 | 1986-11-06 | Mounting structure of electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61262686A JPS63117431A (en) | 1986-11-06 | 1986-11-06 | Mounting structure of electronic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63117431A true JPS63117431A (en) | 1988-05-21 |
Family
ID=17379183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61262686A Pending JPS63117431A (en) | 1986-11-06 | 1986-11-06 | Mounting structure of electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63117431A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03136258A (en) * | 1988-11-21 | 1991-06-11 | Honeywell Inc | Semiconductor chip package and its manufacture |
| US5548487A (en) * | 1991-09-27 | 1996-08-20 | Siemens Nixdorf Informationssysteme Aktiengesellchaft | Flat circuit module mounting using an elastic pad in a depression of a circuit board |
-
1986
- 1986-11-06 JP JP61262686A patent/JPS63117431A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03136258A (en) * | 1988-11-21 | 1991-06-11 | Honeywell Inc | Semiconductor chip package and its manufacture |
| US5548487A (en) * | 1991-09-27 | 1996-08-20 | Siemens Nixdorf Informationssysteme Aktiengesellchaft | Flat circuit module mounting using an elastic pad in a depression of a circuit board |
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