JPS6164186A - Mounting structure of electronic part leadless package - Google Patents
Mounting structure of electronic part leadless packageInfo
- Publication number
- JPS6164186A JPS6164186A JP18690584A JP18690584A JPS6164186A JP S6164186 A JPS6164186 A JP S6164186A JP 18690584 A JP18690584 A JP 18690584A JP 18690584 A JP18690584 A JP 18690584A JP S6164186 A JPS6164186 A JP S6164186A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- leadless package
- substrate
- mounting structure
- component leadless
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野］
この発明は電子部品リードレスパッケージノ実装構造、
特に電子部品リードレスパッケージをその熱膨張係数と
は異なる熱膨張係数の基板に搭載する実装構造に関する
ものである。[Detailed Description of the Invention] [Industrial Field of Application] This invention provides a mounting structure for an electronic component leadless package,
In particular, the present invention relates to a mounting structure in which an electronic component leadless package is mounted on a substrate having a thermal expansion coefficient different from that of the electronic component leadless package.
［従来の技術］
従来、基板に電子部品リードレスパッケージを実装する
場合には、基板表面電極と電子部品リードレスパッケー
ジ電極とをロー材を介して電気的および機械的に接合す
るのが通例である。[Prior Art] Conventionally, when mounting an electronic component leadless package on a board, it has been customary to electrically and mechanically bond the board surface electrode and the electronic component leadless package electrode via a brazing material. be.
第４図は従来のこの種の実装構造を示すもので、図中（
１）は基板、（２）はこの基板（１）に搭載される電子
部品リードレスパッケージ、（３）は基板表面電極、（
４）は電子部品リードレスパッケージ電極、（５）は上
記両電極（３） 、 （４）を電気的および機械的に接
続するロー材である。また各ロー材（５）内に記した矢
印の方向は、基板（１）の熱膨張係数が電子部品リード
レスパッケージ（２）の熱膨張係数よりも大きい場合に
接合部に加わる一般的な応力の方向を示す。Figure 4 shows a conventional mounting structure of this type.
1) is a board, (2) is an electronic component leadless package mounted on this board (1), (3) is a board surface electrode, (
4) is an electronic component leadless package electrode, and (5) is a brazing material that electrically and mechanically connects the above electrodes (3) and (4). Furthermore, the direction of the arrow marked inside each brazing material (5) indicates the general stress applied to the joint when the thermal expansion coefficient of the substrate (1) is larger than that of the electronic component leadless package (2). indicates the direction.
［発明が解決しよＡとする問題点］
上記のような従来の実装構造では、ロー材接合部に電子
部品リードレスパッケージ（２゛）と基板（１）との熱
−膨張係数の違いにより生じる応力が加 ′わり、最終
的には接合部が破壊されるという問題点があった。[Problem A to be solved by the invention] In the conventional mounting structure as described above, due to the difference in thermal expansion coefficient between the electronic component leadless package (2゛) and the board (1), The problem was that the resulting stress would eventually destroy the joint.
この発明は、かかる問題点を解決するためになされたも
ので、電子部品リードレスパッケージと基板との間に熱
膨張係数の違いがあっても、ロー材接合部に発生する応
力を緩和することができる電子部品リードレスパッケー
ジの実装構造を得ることを目的とする。This invention was made in order to solve this problem, and even if there is a difference in thermal expansion coefficient between the electronic component leadless package and the board, it is possible to alleviate the stress generated in the brazing material joint. The purpose is to obtain a mounting structure for an electronic component leadless package that can be used.
［問題点を解決するための手段］ ′この発明に係
る電子部品リードレスパッケージの実装構造は、電子部
品リードレスパッケージと基板との間に、電子部品リー
ドレスパッケージと基板とを導通させる弾性体基板を介
装したものである。[Means for Solving the Problems] 'The mounting structure of the electronic component leadless package according to the present invention includes an elastic body between the electronic component leadless package and the board, which conducts the electronic component leadless package and the board. A substrate is inserted.
［作用コ
この発明においては、弾性体基板が、電子部品リードレ
スパッケージと基板との熱膨張係数差によって発生する
応力を緩和する。[Operations] In the present invention, the elastic substrate relieves the stress generated due to the difference in coefficient of thermal expansion between the electronic component leadless package and the substrate.
し実施例］
゛第１図〜第３図はこの発明の一実施例を示すもので、
図中第４図と同一符号は同−又は相当部分を示す、（Ｂ
）は弾性体基板を構成する方形状の絶縁弾性体、（７）
はこの絶縁弾性体（８）の四隅部に貫通配置されロー材
（５）を介して基板表面電極（３）と電子部品リードレ
スパッケージ電極（４）と電気的および機械的に接続す
る導体電極である。Embodiment] ゛Figures 1 to 3 show an embodiment of the present invention.
In the figure, the same reference numerals as in Fig. 4 indicate the same or corresponding parts. (B
) is a rectangular insulating elastic body constituting the elastic substrate, (7)
are conductor electrodes which are arranged through the four corners of this insulating elastic body (8) and are electrically and mechanically connected to the substrate surface electrode (3) and the electronic component leadless package electrode (4) via the brazing material (5). It is.
また（８）は上記基板（１）とその構成をほぼ同一にす
る印刷配線板である。Further, (8) is a printed wiring board whose structure is almost the same as that of the above-mentioned board (1).
以上の構成において、第１図に示す通電前の応力の加わ
らない状態から回路に通電すると、第３図に示すように
通電により発生する熱応力が例えば図中矢印方向に加わ
る。ところが電子部品リードレスパッケージ（３）と印
刷配線板（８）との間には弾性体基板が配置され、その
絶縁弾性体（８）が弾性変形するので、熱膨張係数の違
いにより発生した応力は、絶縁弾性体（６）の変形によ
り緩衝され、接合部の破壊が有効に防止される。In the above configuration, when the circuit is energized from the stress-free state before energization shown in FIG. 1, thermal stress generated by the energization is applied, for example, in the direction of the arrow in the figure, as shown in FIG. However, since an elastic substrate is placed between the electronic component leadless package (3) and the printed wiring board (8), and the insulating elastic body (8) is elastically deformed, the stress generated due to the difference in thermal expansion coefficient is buffered by the deformation of the insulating elastic body (6), effectively preventing the joint from breaking.
なお上記実施例においては、弾性体基板を構成する絶縁
弾性体（６）が方形を・なしその四隅部に４個の導体電
極（７）を配したものについて説明したが、絶縁弾性体
（８）の形状、導体電極（７）の個数および配置位置は
これに限るものではなく、どのようなものでもよい。In the above embodiment, the insulating elastic body (6) constituting the elastic substrate has a rectangular shape and four conductor electrodes (7) are arranged at its four corners, but the insulating elastic body (8) ), the number and arrangement position of the conductor electrodes (7) are not limited to these, and may be of any shape.
［発明の効果］
この発明は以上説明した通り、電子部品リードレスパッ
ケージと基板との間に、電子部品リードレスパッケージ
と基板とを導通させ−る弾性体基板を介装しているので
、熱膨張、係数の差により発生する応力を弾性体基板の
変形で緩和し、ロー材接合部の信頼性を向上させること
ができる等の効果がある。[Effects of the Invention] As explained above, in this invention, an elastic substrate is interposed between the electronic component leadless package and the substrate, so that the electronic component leadless package and the substrate are electrically connected. This has the effect of alleviating stress caused by expansion and coefficient differences by deforming the elastic substrate, improving the reliability of the brazing material joint.
第１図はこの発明の一実施例を示す電子部品リードレス
パッケージの実装構造の断面図、第２図は電子部品リー
ドレスパッケージと印刷配線板との間に介装される弾性
体基板を示す斜視図、第３図は熱応力が加わった際の弾
性体基板の状態を示す第１図相当図、第４図は従来の電
子部品リードレスパッケージの実装構造を示す断面図で
第１図相当図である。
図中、（２）は電子部品リードレスパッケージ、（３）
？ｊ！＆ｉ板表面電極、（４）は電子部品リードレスパ
ッケージ電極、（５）はロー材、（６）は絶縁弾性体、
（７）は導体電極、（８）は−印刷配線板である。
なお各図中、同一符号は同−又は相当部夛を示すものと
する。FIG. 1 is a sectional view of a mounting structure of an electronic component leadless package showing an embodiment of the present invention, and FIG. 2 shows an elastic substrate interposed between the electronic component leadless package and the printed wiring board. A perspective view, FIG. 3 is a view equivalent to FIG. 1 showing the state of the elastic substrate when thermal stress is applied, and FIG. 4 is a cross-sectional view showing the mounting structure of a conventional electronic component leadless package and is equivalent to FIG. It is a diagram. In the figure, (2) is an electronic component leadless package, (3)
? j! &i plate surface electrode, (4) is electronic component leadless package electrode, (5) is brazing material, (6) is insulating elastic material,
(7) is a conductor electrode, and (8) is a printed wiring board. In each figure, the same reference numerals indicate the same or equivalent parts.
Claims (2)
数とは異なる基板に搭載する実装構造において、上記電
子部品リードレスパッケージと基板との間に、電子部品
リードレスパッケージと基板とを導通させる弾性体基板
を介装したことを特徴とする電子部品リードレスパッケ
ージの実装構造。(1) In a mounting structure in which an electronic component leadless package is mounted on a substrate whose coefficient of thermal expansion is different from that of the electronic component leadless package, elasticity is provided between the electronic component leadless package and the substrate to provide electrical continuity between the electronic component leadless package and the substrate. A mounting structure for an electronic component leadless package characterized by having a body substrate interposed therebetween.
極と基板表面電極との間にロー材を介し取付けられて両
電極を導通させる複数の導体電極と、これら各導体電極
を保持する絶縁弾性体とから構成したことを特徴とする
特許請求の範囲第１項記載の電子部品リードレスパッケ
ージの実装構造。(2) An elastic substrate is provided with a plurality of conductor electrodes that are attached between the electronic component leadless package electrode and the substrate surface electrode via brazing material to provide electrical continuity between the two electrodes, and an insulated elastic body that holds each of these conductor electrodes. A mounting structure for an electronic component leadless package according to claim 1, characterized in that it is comprised of:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18690584A JPS6164186A (en) | 1984-09-06 | 1984-09-06 | Mounting structure of electronic part leadless package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18690584A JPS6164186A (en) | 1984-09-06 | 1984-09-06 | Mounting structure of electronic part leadless package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6164186A true JPS6164186A (en) | 1986-04-02 |
Family
ID=16196730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18690584A Pending JPS6164186A (en) | 1984-09-06 | 1984-09-06 | Mounting structure of electronic part leadless package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6164186A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1987000686A1 (en) * | 1985-07-16 | 1987-01-29 | Nippon Telegraph And Telephone Corporation | Connection terminals between substrates and method of producing the same |
| US4746661A (en) * | 1984-11-22 | 1988-05-24 | Hoechst Aktiengesellschaft | Phenylpiperazine propyloxyquinolinones and methods for sedating and inhibiting aggression in livestock therewith |
-
1984
- 1984-09-06 JP JP18690584A patent/JPS6164186A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4746661A (en) * | 1984-11-22 | 1988-05-24 | Hoechst Aktiengesellschaft | Phenylpiperazine propyloxyquinolinones and methods for sedating and inhibiting aggression in livestock therewith |
| WO1987000686A1 (en) * | 1985-07-16 | 1987-01-29 | Nippon Telegraph And Telephone Corporation | Connection terminals between substrates and method of producing the same |
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