JPH0287654A - Surface mounting semiconductor device - Google Patents

Surface mounting semiconductor device

Info

Publication number
JPH0287654A
JPH0287654A JP24147588A JP24147588A JPH0287654A JP H0287654 A JPH0287654 A JP H0287654A JP 24147588 A JP24147588 A JP 24147588A JP 24147588 A JP24147588 A JP 24147588A JP H0287654 A JPH0287654 A JP H0287654A
Authority
JP
Japan
Prior art keywords
board
groove
fixation use
protruding part
face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24147588A
Other languages
Japanese (ja)
Inventor
Yasuhisa Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP24147588A priority Critical patent/JPH0287654A/en
Publication of JPH0287654A publication Critical patent/JPH0287654A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Abstract

PURPOSE: To prevent a protruding part tor fixation use on a mounting board from falling off when it is passed through a soldering tank by a method wherein the protruding part for fixation use is provided with a groove, for fixation use, which is coupled mechanically to the mounting board and is used to prevent the board from being detached and a difference in a size between a face closest to a sealing resin body of the groove and a face closest to the board of an external lead is specified.
CONSTITUTION: A protruding part 3 for fixation use is provided with a groove 4 for fixation use of a carved structure coupled mechanically to a mounting board 5. During this process, a difference δ in size between a face coming into contact with the board 5 of an external lead 2 and a bonding face of the groove 4 for fixation use and the board 5 is set at 0.1 to 0.3mm.
COPYRIGHT: (C)1990,JPO&Japio
JP24147588A 1988-09-26 1988-09-26 Surface mounting semiconductor device Pending JPH0287654A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24147588A JPH0287654A (en) 1988-09-26 1988-09-26 Surface mounting semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24147588A JPH0287654A (en) 1988-09-26 1988-09-26 Surface mounting semiconductor device

Publications (1)

Publication Number Publication Date
JPH0287654A true JPH0287654A (en) 1990-03-28

Family

ID=17074867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24147588A Pending JPH0287654A (en) 1988-09-26 1988-09-26 Surface mounting semiconductor device

Country Status (1)

Country Link
JP (1) JPH0287654A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5635760A (en) * 1993-07-01 1997-06-03 Nec Corporation Surface mount semiconductor device
US5661639A (en) * 1994-10-25 1997-08-26 Rohm Co., Ltd. Structure for attaching a heat sink to a semiconductor device
US5670429A (en) * 1993-06-30 1997-09-23 Rohm Co. Ltd. Process of conveying an encapsulated electronic component by engaging an integral resin projection

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5670429A (en) * 1993-06-30 1997-09-23 Rohm Co. Ltd. Process of conveying an encapsulated electronic component by engaging an integral resin projection
US5739054A (en) * 1993-06-30 1998-04-14 Rohm Co., Ltd. Process for forming an encapsulated electronic component having an integral resin projection
US5760481A (en) * 1993-06-30 1998-06-02 Rohm Co., Ltd. Encapsulated electronic component containing a holding member
US5635760A (en) * 1993-07-01 1997-06-03 Nec Corporation Surface mount semiconductor device
US5661639A (en) * 1994-10-25 1997-08-26 Rohm Co., Ltd. Structure for attaching a heat sink to a semiconductor device

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