JPS63124556A - Semiconductor package - Google Patents

Abstract

PURPOSE:To prevent damage due to a mechanical load and thermal deformation, by fixing one point of the upper part of a semiconductor module to a printed board through a supporting member having rigidity. CONSTITUTION:One point of the upper part of a semiconductor module is fixed to a printed board 20 through a frame member 30 forming a supporting member having rigidity. The linear expansion coefficient of the frame member 30 is made equal with respect to the thermal deformation of the printed board 20, and the frame member 30 is thermally matched and can be deformed in free stress. Meanwhile, with respect to a mechanical load, which is applied to the semiconductor module 10 and a cooling jacket, the module and the jacket are fixed to the printed board 20 through arm members 33 and the frame member 30 and supported. Thus, the stress, which is applied to the connecting parts of output terminals 13 that are mechanically or thermally weak parts or the bonding part of a main body 11 of the module can be alleviated.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a semiconductor package, and more specifically, it has a semiconductor module support structure suitable for mounting a group of high-density packaging semiconductor modules. Regarding semiconductor packages.

[Conventional technology]

As a conventionally known semiconductor package.

As described in Japanese Utility Model Application Publication No. 59-96889, it has a structure in which an electronic component consisting of a single semiconductor chip is mounted on a printed circuit board.

With such a structure, since the electronic components mounted on the tower are themselves lightweight, there is no particular problem with the support structure for the electronic components.

Therefore, even in the device disclosed in the above-mentioned publication, the printed circuit board itself is supported by a board insertion/extraction guide having a power supply function.

[Problem that the invention seeks to solve]

However, when a large number of semiconductor chips are mounted at high density to form a module and then mounted on a printed circuit board for packaging, the mounted semiconductor module becomes large and heavy.

Moreover, thermal deformation becomes large and the amount of thermal deformation differs depending on the part of the package. Therefore, there is a problem in that the mechanical loads and thermal deformation may damage weak parts such as the joints or input/output terminals of the semiconductor module itself.

An object of the present invention is to provide a semiconductor package having a support structure that can prevent damage due to mechanical loads and thermal deformation.

[Means for solving problems]

In order to achieve the above object, the present invention includes at least one semiconductor module mounted on a printed circuit board by electrically connecting input/output terminals of the semiconductor module to a printed circuit on the printed circuit board. The semiconductor package is characterized in that one point on the upper part of the semiconductor module is fixed to the printed circuit board via a rigid support member.

[Effect]

Here, the principle of the present invention will be explained. First, in view of the above objectives, we would like to explain mechanically the semiconductor package in which the semiconductor module is mounted on the printed circuit board by electrically connecting the input/output terminals of the semiconductor module to the printed circuit on the printed circuit board. Alternatively, the behavior of thermal deformation was analyzed and simulated experimentally. The semiconductor module used in the analysis is as shown in FIG. The module body 11 has a structure in which a large number of semiconductor chips are mounted on a base material such as ceramic, and the semiconductor chips are covered with a cap made of metal or ceramic. It is said that

The input/output terminals 13 of the printed circuit of the printed circuit board 20 are electrically connected and supported.

Therefore, the parts that are vulnerable to mechanical or thermal deformation are the joint between the cap and the base of the module main body 11, and the joint between the input/output terminal 13 and the module main body 11 and the printed circuit board 20. It will be a representative place.

It has been found that in the semiconductor package having the structure shown in FIG. 5, the semiconductor module 10 and the printed circuit board 20 are thermally deformed as shown schematically by arrows 41 and 42, respectively. In this case, the semiconductor module 10
If there is no external support for the semiconductor module 10 and the printed circuit board 20, due to the difference in their deformation resistance,
It is clear that the package as a whole undergoes bending deformation and is mechanically self-balancing, and is considered to be stable in terms of stress.

Therefore, as a result of the above analysis, the semiconductor module 10 and the printed circuit board 20 that are applied to the printed circuit board 20
It has been found that a support structure is required that can maintain the above-mentioned stress-stable state under any load conditions such as self weight 1 mechanical external force and thermal load. In other words, it is necessary to adopt a point support structure that can restrain the rigid displacement of the semiconductor module 10 in response to mechanical loads, and absorb thermal deformation in response to thermal loads. This allows the above objectives to be achieved with high reliability.

That is, according to the present invention configured as described above, each member constituting the semiconductor package undergoes a temperature change due to chip heat generation of the semiconductor module, but since each member has a different expansion coefficient and deformation resistance, In terms of stress, it exhibits a self-equilibrium deformation state. However,
If the printed circuit board and the semiconductor module are each fixed at one place, the printed circuit board and the semiconductor module will not be restrained from expanding or contracting each other, and will basically exhibit a stress-free state. On the other hand, since the semiconductor module is fixed by a support member having a fixed end on the printed circuit board, the rigid body of the semiconductor module can withstand the weight of the semiconductor module or mechanical external force (impact force) applied to the semiconductor module. Displacement is supported, making it possible to prevent damage due to mechanical load or thermal deformation.

〔Example〕

Hereinafter, the present invention will be explained based on examples.

FIG. 1 shows an exploded perspective view of an embodiment of the present invention.

In this embodiment, the present invention is applied to a semiconductor package in which four semiconductor modules 10 are mounted. The semiconductor module 10 has the same configuration as the semiconductor module shown in FIG.
is connected to a metal pad provided on the surface opposite to the chip mounting surface of the ceramic body of the module body 11, and the other end of the input/output terminal 13 is connected to a printed circuit of the printed circuit board 20. It has a structure in which it is inserted into a through hole and bonded. The cooling water jacket 12 of the semiconductor module 10 is fixed to the top of the module body 11 by screws 14. Printed circuit board 2
A connector portion 21 for connection to an external circuit is formed on one side edge of the 0. Further, stiffening plates 22 are fixed to opposing side edges of the printed circuit board 20 in the longitudinal direction.

On the other hand, the frame member 30 forming the support member is formed of a rigid body made of metal such as aluminum,
It is formed from two sides 31 corresponding to the stiffening plate 22 and a connecting side 32 connecting the sides 31 at one end. An arm member 33 is formed extending from one side portion 31 to the top of the semiconductor module 10 . Further, the frame member 30 is formed to have substantially the same coefficient of linear expansion as the printed circuit board 20. The frame member 3o formed in this manner is fixed to the upper part of the stiffening plate 22 by screws 34 at the base end of the side portion 31 of the frame. The tip end of the arm member 33 is fixed to the semiconductor module 10 with a screw 35 using a fixing screw hole in the cooling jacket.

Because of this configuration, according to this embodiment, the frame member 30, which is thermally matched with equal coefficients of linear expansion, exhibits stress-free deformation in response to thermal deformation of the printed circuit board 20. On the other hand, the semiconductor module 10 and the cooling jacket 12 are fixedly supported by the printed circuit board 2o via the arm member 33 and the frame member 30, so that mechanical loads applied to the semiconductor module 10 and the cooling jacket 12 are not affected mechanically or thermally. It is possible to reduce the stress burden applied to the connection portion of the input/output terminal 13 or the joint portion of the module body 11, which is a weak portion.

In the embodiment shown in FIG. 1 above, the cooling jacket 1
Although the semiconductor module 10 is fixedly supported by the arm member 33 using the set screw No. 2, it is preferable to provide a screw hole or the like in the center of the upper surface of the cooling water jacket 12.
By fixedly supporting the arm member at its center, the balance of mechanical or thermal support is improved.

In addition, in the embodiment shown in FIG. 1, four semiconductor modules 10
Although an embodiment in which a single semiconductor module is mounted has been described, the present invention is not limited thereto, and can be applied to a semiconductor package in which a single semiconductor module is mounted to achieve the same effect. Further, it goes without saying that the semiconductor module 10 may consist of a single semiconductor chip. Other embodiments of the present invention are shown in FIGS. 2 to 4.

In the embodiment shown in FIG. 2, instead of the pair of sides 31 of the frame member 30 of the embodiment in FIG. The difference is that the embodiment shown in FIG. 1 can have the same effect as the embodiment shown in FIG.

The embodiment shown in FIG. 3 has a structure in which the side part 31 and connecting side 32 of the frame member 30 in the embodiment in FIG. 1 are omitted, and the arm member 33 is directly fixed to the stiffening plate 22 with screws 34. It becomes. Therefore, according to this embodiment, the structure of the support member is simpler than that of the embodiment shown in FIG. In addition, in the case of this embodiment,
Arm member 33 and stiffening plate 22 fixed by screws 34
It is important to fix it so that the fixed part becomes a rigid body.

In the embodiment shown in FIG. 4, the arm member 33 is formed of a round bar, one end of which is inserted into a through hole provided in the stiffening plate 22 and fixed with a screw 37. Almost the same effect can be achieved.

〔Effect of the invention〕

As explained above, according to the present invention, one point on the upper part of the semiconductor module is directly fixed to the printed circuit board by a rigid supporting member, so that the joint part and the input/output terminal part of the semiconductor module can be fixed directly to the printed circuit board.

It is possible to maintain a free state without restricting thermal deformation between different parts of the printed circuit board, and to support the rigid displacement of the semiconductor module. It is possible to prevent the weakest part from being damaged by mechanical external force applied to the structure, and to avoid load concentration on the weakest part due to thermal deformation, resulting in high reliability.

[Brief explanation of the drawing]

FIG. 1 is an exploded perspective view of one embodiment of the invention, FIG. 2 is an exploded perspective view of another embodiment of the invention, and FIGS. 3 and 4 are perspective views of still other embodiments of the invention. , FIG. 5 is a diagram for explaining the present invention. DESCRIPTION OF SYMBOLS 10... Semiconductor module, 11... Module body, 12... Cooling jacket, 13... Input/output terminal, 20... Printed circuit board, 2
2... Stiffening plate, 30... Frame member, 31...
Side portion, 32... Connection side, 33... Arm member.

Claims (2)

[Claims] (1) In a semiconductor package in which at least one semiconductor module is mounted on a printed circuit board by electrically connecting input/output terminals of the semiconductor module to a printed circuit on the printed circuit board, an upper part of the semiconductor module is provided. A semiconductor package characterized in that the printed circuit board is fixed at one point via a rigid supporting member. (2) The supporting member includes a frame member fixed to a printed circuit board and an arm member fixed to the frame member, and a semiconductor module is fixed to the tip of the arm member. semiconductor package.