JPS62211879A - Electrical connection structure of molded case terminal and hybrid ic - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to an electrical connection structure between a molded case terminal such as an IC igniter and a hybrid IC board. The present invention relates to an electrical connection structure between a molded case terminal and a hybrid IC having a lead frame shape suitable for absorbing stress.

[Conventional technology]

A conventional electrical connection structure between a mold block terminal such as an IC igniter and a hybrid IC board is a connection structure using a linear lead frame as described in, for example, Japanese Utility Model Application Publication No. 52-42930.

[Problem that the invention seeks to solve]

However, the conventional connection structure using a linear lead frame has a lead frame shape that easily applies stress to the soldering surface of the board due to deformation due to thermal expansion of the mold block, and there is insufficient structural support for stress absorption and relaxation. Due to this lack of consideration, there were durability problems such as peeling of the soldering surface.

The purpose of the present invention is to reduce the stress applied to the soldering surface of the board by X and Y.
, a flexible lead frame-shaped molded case terminal that can absorb in three directions of Z, and a hybrid IC.
The purpose is to provide an electrical connection structure.

[Means for solving problems]

The above purpose is to form a lead frame made of a thin metal plate that electrically connects the molded case terminal and the hybrid IC board into a shape bent in three directions (x, y, and z), and to bend and twist the lead frame with the bent portion as the base point. This is achieved through a more flexible electrical connection structure.

[For use]

The electrical connection structure having the above means has a lead frame bent in three directions (X, Y, and Z).

Since it acts with flexibility in three directions (Y and Z), it absorbs stress caused by deformation due to thermal expansion of the mold case, reducing stress on the surface of lead frame board soldering and improving durability. do.

〔Example〕

An embodiment of the present invention will be described below with reference to FIGS. 1 to 3.

FIG. 1 is a perspective view of essential parts showing an embodiment of an electrical connection structure between a molded case terminal and a hybrid IC according to the present invention. In FIG. 1, 1 is a terminal, 2 is a molded case, 3 is a base, 4 is a hybrid IC board, and 5 is a lead frame. 2A, 2B, and 2C are front views of the lead frame 5 of FIG. 1 in the Y, X, and Z directions.

FIG. 3 is an enlarged perspective view of the lead frame 5 of FIG. 1.

A molded case 2 in which 13 terminals 1 of a connector for electrical connection with the outside are molded is adhesively fixed to a metal base 3 such as die-cast aluminum, and a hybrid IC board is mounted on the metal base 3 inside the molded case 2. 4 is fixed with adhesive. The electrical connection between the molded terminal 1 and the hybrid IC board 4 is made by soldering the pattern on the case inner side terminal 1a of the molded terminal 1 and the pattern on the hybrid IC board 4 between the surface 4a in three directions of X, Y, and Z. This is carried out by arranging a lead frame 5 made of a thin metal plate bent into a shape, and soldering both ends of the frame. This lead frame 5 has a thickness of 0.15 m and a width of 1.5 m, for example.
It is made of an oIIII sn-plated brass plate, and each dimension in the x, y, and z directions is approximately 6 to 7.5+ nm.

Due to thermal expansion when the temperature rises from 20"C to 130°C, this molded case 2 undergoes deformation of approximately 0.1mm to 0.14m, including warpage in the Y direction, and deformation in the X and Z directions. are equal to or less than equal.These variations (
If a displacement (displacement) is applied directly to the surface 4a of the hybrid IC board 4 through a linear lead frame, a very large stress will be generated, and there is a risk that the soldering part will break. In order to prevent this, according to the present invention, three of x, y, and z are
By using a connection structure that uses a flexible lead frame 5 that is bent in the direction, displacement in the X direction is deflected and twisted, displacement in the Y direction is deflected, and displacement in the Z direction is absorbed by the deformation action of the bending point. Thus, the stress applied to the surface 4a during soldering of the hybrid IC board 4 is sufficiently reduced. As a result, with respect to the deformation (displacement) O, 15+m due to thermal expansion of the mold case 2, the stress in the three directions of X, Y, and Z applied to the soldering surface 4a can be suppressed to about 5 g or less. can.

When soldering the lead frame 5 to the hybrid IC board 44, a hole is formed in the part of the lead frame 5 that allows the components in the solder to release the gas generated at high temperatures during soldering to ensure complete soldering. Helpful.

As described above, according to this example, a lead frame shape with high flexibility in the three directions of X, Y, and Z can be obtained, which greatly reduces the stress applied to the surface when soldering a hybrid IC board. As a result, sufficient durability can be demonstrated even when the temperature rises to about 130° C., and conventionally used lead frame materials can be used, resulting in almost no price increase.

〔Effect of the invention〕

As described above, according to the present invention, soldering caused by deformation due to thermal expansion of the mold case reduces stress on the surface by
Provided is an economical electrical connection structure between a molded case terminal and a hybrid IC that can improve durability by absorbing energy in three directions: , Y, and Z.

[Brief explanation of drawings]

FIG. 1 is a perspective view of essential parts showing an embodiment of an electrical connection structure between a molded case terminal and a hybrid TC according to the present invention;
2(a), (b), and (c) are front views of the lead frame shown in FIG. 1 in Y, X, and Z directions, and FIG. 3 is an enlarged perspective view of the lead frame shown in FIG. 1.

Claims (1)

[Claims] 1. A molded case terminal that can absorb stress by connecting the integrally molded case terminal and the hybrid IC board using a thin metal lead frame bent in three directions (X, Y, and Z). and the electrical connection structure of hybrid IC.