JPH053738B2 - - Google Patents
Info
- Publication number
- JPH053738B2 JPH053738B2 JP61095583A JP9558386A JPH053738B2 JP H053738 B2 JPH053738 B2 JP H053738B2 JP 61095583 A JP61095583 A JP 61095583A JP 9558386 A JP9558386 A JP 9558386A JP H053738 B2 JPH053738 B2 JP H053738B2
- Authority
- JP
- Japan
- Prior art keywords
- tabic
- ceramic substrate
- buffering
- electronic component
- organic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000919 ceramic Substances 0.000 claims description 13
- 239000012212 insulator Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 11
- 230000003139 buffering effect Effects 0.000 claims description 8
- 230000035882 stress Effects 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、テープキヤリア方式で組立られた
TABICと、セラミツク基板とで構成される電子
部品の構造に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a
This article relates to the structure of an electronic component consisting of TABIC and a ceramic substrate.
従来、この種の電子部品の実装構造としては、
例えば、第２図に図示されるようなものがある。
この構成では、セラミツク基板１の上にブロツク
状の緩衝用有機絶縁体１２が設置され、その上に
TABIC３が装着され、TABIC３とセラミツク基
板１はTABICリード５で接続され、さらにキヤ
ツプ４がセラミツク基板１の上に装着された電子
部品をカバーするように取付けられている。
Conventionally, the mounting structure for this type of electronic component is as follows:
For example, there is one as shown in FIG.
In this configuration, a block-shaped buffering organic insulator 12 is installed on a ceramic substrate 1, and
A TABIC 3 is mounted, the TABIC 3 and the ceramic board 1 are connected by a TABIC lead 5, and a cap 4 is mounted on the ceramic board 1 so as to cover the electronic components mounted thereon.
上述した従来の電子部品組立体の構造では、緩
衝用有機絶縁体の弾力性が不足し、電子部品の発
熱等によつて生じる構成部品間の歪を充分吸収す
ることができず、TABICにこれらの歪による大
きな応力が作用し、TABICが破損するなど電子
部品の信頼性を著しく低下させるという欠点があ
る。
In the structure of the conventional electronic component assembly described above, the buffering organic insulator lacks elasticity and cannot sufficiently absorb the strain between the components caused by heat generation of the electronic component. The drawback is that the large stress caused by the distortion of the TABIC can cause damage to the TABIC, significantly reducing the reliability of electronic components.
本発明の電子部品の実装構造は、微細幅の緩衝
用有機絶縁体をセラミツク基板とTABICの間の
複数箇所に設置したことを特徴とする。
The electronic component mounting structure of the present invention is characterized in that micro-width buffering organic insulators are installed at multiple locations between the ceramic substrate and the TABIC.
したがつて、複数箇所に設置された微細幅の緩
衝用有機絶縁体により、セラミツク基板と
TABICの間の緩衝力が向上し、電子部品の発熱
等により発生した応力を吸収することが可能とな
る。 Therefore, by using micro-width organic buffer insulators installed in multiple locations, the ceramic substrate and
The buffering force between the TABICs is improved, making it possible to absorb stress caused by heat generation from electronic components.
次に、本発明の実施例について図面を参照して
説明する。
Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の電子部品の実装構造の一実施
例の断面図である。本実施例では、セラミツク基
板１の上の２箇所に微細幅のポリイミドからなる
緩衝用有機絶縁体２が設置され、その上に
TABIC３が装着されており、それ以外の構造は
第２図のものと同様である。 FIG. 1 is a sectional view of one embodiment of the electronic component mounting structure of the present invention. In this embodiment, a buffering organic insulator 2 made of polyimide with a fine width is installed at two locations on a ceramic substrate 1, and
TABIC3 is installed, and the other structure is the same as the one in Figure 2.
上記のように構成された電子部品において、キ
ヤツプ４が熱によつて歪むか、又は、キヤツプ４
の上から外力が加わる等によりTABIC３に応力
が作用しても、２個所に設けられた微細幅のポリ
イミドからなる有機絶縁体２は耐熱応力性を有す
るのでこれら外力による応力を変位により吸収
し、TABIC３の損傷を避けることができる。 In the electronic component configured as described above, the cap 4 may be distorted due to heat, or the cap 4 may be distorted due to heat.
Even if stress is applied to the TABIC 3 due to an external force being applied from above, the organic insulator 2 made of polyimide with a fine width provided at two locations has heat stress resistance, so it absorbs the stress caused by these external forces through displacement. Damage to TABIC3 can be avoided.
以上説明したように本発明は、セラミツク基板
とTABICとの間に、微細幅の有機絶縁体を複数
箇所に設置することにより、緩衝力が向上して高
い弾性が得られ、熱又は、外力等により発生する
応力をこれら有機絶縁体により吸収して、応力に
よるTABICの破損を防止し、これにより電子部
品の高い信頼性を得ることができるという効果が
ある。
As explained above, the present invention improves the buffering force and obtains high elasticity by installing micro-width organic insulators at multiple locations between the ceramic substrate and the TABIC. These organic insulators absorb the stress generated by the TABIC, thereby preventing damage to the TABIC due to the stress, thereby making it possible to obtain high reliability of electronic components.
第１図は、本発明の電子部品組立体の一実施例
の断面図、第２図は、従来の電子部品の一例の断
面図である。
１……セラミツク基板、２……有機絶縁体、３
……TABIC、４……キヤツプ、５……TABICリ
ード。
FIG. 1 is a cross-sectional view of an embodiment of an electronic component assembly according to the present invention, and FIG. 2 is a cross-sectional view of an example of a conventional electronic component. 1...Ceramic substrate, 2...Organic insulator, 3
...TABIC, 4...cap, 5...TABIC lead.
Claims (1)
ープキヤリア方式で組立られたTABICと、前記
セラミツク基板上に設けられたTABICの緩衝用
有機絶縁体と、前記セラミツク基板上に載置され
た部品をカバーするキヤツプとからなる電子部品
の組立構造において、 微細幅の緩衝用有機絶縁体を前記セラミツク基
板とTABICの間の複数箇所に設置したことを特
徴とする電子部品の実装構造。[Scope of Claims] 1. A ceramic substrate having a wiring pattern, a TABIC assembled by a tape carrier method, an organic buffering insulator for the TABIC provided on the ceramic substrate, and a TABIC buffer mounted on the ceramic substrate. 1. A mounting structure for electronic components, characterized in that, in the assembly structure for electronic components, the structure includes a cap for covering the components, wherein micro-width buffering organic insulators are installed at multiple locations between the ceramic substrate and the TABIC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61095583A JPS62250650A (en) | 1986-04-23 | 1986-04-23 | Mounting structure of electronic component part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61095583A JPS62250650A (en) | 1986-04-23 | 1986-04-23 | Mounting structure of electronic component part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62250650A JPS62250650A (en) | 1987-10-31 |
| JPH053738B2 true JPH053738B2 (en) | 1993-01-18 |
Family
ID=14141606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61095583A Granted JPS62250650A (en) | 1986-04-23 | 1986-04-23 | Mounting structure of electronic component part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62250650A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5264726A (en) * | 1989-07-21 | 1993-11-23 | Nec Corporation | Chip-carrier |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5810841A (en) * | 1981-07-13 | 1983-01-21 | Mitsubishi Electric Corp | Resin sealing type semiconductor device |
| JPS60206314A (en) * | 1984-03-30 | 1985-10-17 | Matsushita Electric Ind Co Ltd | Ladder-type ceramic filter |
-
1986
- 1986-04-23 JP JP61095583A patent/JPS62250650A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5810841A (en) * | 1981-07-13 | 1983-01-21 | Mitsubishi Electric Corp | Resin sealing type semiconductor device |
| JPS60206314A (en) * | 1984-03-30 | 1985-10-17 | Matsushita Electric Ind Co Ltd | Ladder-type ceramic filter |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62250650A (en) | 1987-10-31 |
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