JPS62293693A - Wiring board for mounting surface mount parts - Google Patents
Wiring board for mounting surface mount partsInfo
- Publication number
- JPS62293693A JPS62293693A JP13739286A JP13739286A JPS62293693A JP S62293693 A JPS62293693 A JP S62293693A JP 13739286 A JP13739286 A JP 13739286A JP 13739286 A JP13739286 A JP 13739286A JP S62293693 A JPS62293693 A JP S62293693A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- component
- mounting surface
- surface mount
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000000694 effects Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 発明の詳細な説明 〔産業上の利用分野〕 本発明は表面実装部品搭載用配線基板に関する。[Detailed description of the invention] Detailed description of the invention [Industrial application field] The present invention relates to a wiring board for mounting surface-mounted components.
従来の表面実装部品搭載用配線基板の部品接続用パッド
形状は、第２図の参照数字４に示す様に、長方形タイプ
で構成され、各搭載部品３ごとに、整然と分離された形
で表面実装部品搭載用配線基板１上に配置され部品リー
ド５を固定していた。The component connection pad shape of the conventional wiring board for mounting surface mount components is a rectangular type, as shown by reference numeral 4 in Fig. 2, and each mounting component 3 is neatly separated from the surface mount pad. It was arranged on the component mounting wiring board 1 and fixed the component leads 5.
上述した、従来の表面実装部品搭載用配線基板は、各接
続パッドが長方形タイプで構成され且つ各部品ごとに、
完全に分離されており高密度実装を阻害するという欠点
がある。−
〔問題点を解決するための手段〕
本発明の表面実装部品搭載用配線基板は、互いに隣接し
て搭載される第１および第２の部品の部品リードに対応
して配置される第１および第２の接続パッドが前記部品
の取付はエリヤにおいて交互に配列して構成される。In the above-mentioned conventional wiring board for mounting surface mount components, each connection pad is constructed of a rectangular type, and each component has a
It has the disadvantage that it is completely separated and hinders high-density packaging. - [Means for solving the problem] The surface mount component mounting wiring board of the present invention has first and second component leads disposed corresponding to component leads of first and second components mounted adjacent to each other. The second connection pads are arranged alternately in the mounting area of the component.
次に本発明の実施例について図面を参照して説明する。 Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例を示す平面図である。FIG. 1 is a plan view showing one embodiment of the present invention.
第１図においては表面実装部品搭載用配線基板１には互
に隣接する２つの搭載部品３同志では上下方向に部品リ
ード５の間隔の約１／２ピツチずらして実装している。In FIG. 1, two adjacent mounted components 3 are mounted on a surface-mounted component mounting wiring board 1 so as to be shifted vertically by about 1/2 pitch of the interval between component leads 5.
そのため部品取付エリヤ６においては互に隣接する２つ
の搭載部品３の部品リード６を固定する三角形状部品接
続パッド２が交互に配置されている。Therefore, in the component mounting area 6, triangular component connection pads 2 for fixing the component leads 6 of two adjacent mounted components 3 are alternately arranged.
このようにすることにより部品取付エリヤ６が従来に比
べ格段に狭くでき単位面積当りの部品取付は数を増大す
ることができる。By doing so, the parts mounting area 6 can be made much narrower than in the past, and the number of parts mounted per unit area can be increased.
接続パッドは第１図では三角形状のものを示したが本発
明はこれに限定されるものではなく交互に配置できるも
のであれば形状は問わない。Although the connection pads are shown in a triangular shape in FIG. 1, the present invention is not limited to this, and any shape may be used as long as the connection pads can be arranged alternately.
以上説明したように本発明は、表面実装部品搭載用配線
基板の部品接続パッド形状を例えば三角形状で構成し、
隣接部品の接続パッド同士を交互に配置する事により、
部品実装密度を大幅に向上でき、ひいては装置性能をも
向上出来るという効果がある。As explained above, the present invention configures the component connection pad shape of the wiring board for mounting surface-mounted components into, for example, a triangular shape,
By alternately arranging the connection pads of adjacent components,
This has the effect of significantly increasing component mounting density and, in turn, improving device performance.
第１図は本発明の一実施例の表面実装部品搭載用配線基
板の接続パッド上に部品を搭載した場合を示す平面図、
第２図は従来例を示す平面図である。FIG. 1 is a plan view showing a case where components are mounted on connection pads of a wiring board for mounting surface-mounted components according to an embodiment of the present invention;
FIG. 2 is a plan view showing a conventional example.
Claims (1)
品リードに対応して配置される第１および第２の接続パ
ッドが前記部品の取付けエリヤにおいて交互に配列され
ていることを特徴とする表面実装部品搭載用配線基板。The first and second connection pads, which are arranged to correspond to the component leads of the first and second components mounted adjacent to each other, are arranged alternately in the mounting area of the component. Wiring board for mounting surface mount components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13739286A JPS62293693A (en) | 1986-06-12 | 1986-06-12 | Wiring board for mounting surface mount parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13739286A JPS62293693A (en) | 1986-06-12 | 1986-06-12 | Wiring board for mounting surface mount parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62293693A true JPS62293693A (en) | 1987-12-21 |
Family
ID=15197602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13739286A Pending JPS62293693A (en) | 1986-06-12 | 1986-06-12 | Wiring board for mounting surface mount parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62293693A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02183595A (en) * | 1989-01-09 | 1990-07-18 | Nec Corp | Printed circuit board |
-
1986
- 1986-06-12 JP JP13739286A patent/JPS62293693A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02183595A (en) * | 1989-01-09 | 1990-07-18 | Nec Corp | Printed circuit board |
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