JPS6012304Y2 - Substrate for electronic components - Google Patents

Substrate for electronic components

Info

Publication number
JPS6012304Y2
JPS6012304Y2 JP9910180U JP9910180U JPS6012304Y2 JP S6012304 Y2 JPS6012304 Y2 JP S6012304Y2 JP 9910180 U JP9910180 U JP 9910180U JP 9910180 U JP9910180 U JP 9910180U JP S6012304 Y2 JPS6012304 Y2 JP S6012304Y2
Authority
JP
Japan
Prior art keywords
electronic components
board
metal plate
substrate
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP9910180U
Other languages
Japanese (ja)
Other versions
JPS5722265U (en
Inventor
博 鳥居
Original Assignee
ブラザー工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ブラザー工業株式会社 filed Critical ブラザー工業株式会社
Priority to JP9910180U priority Critical patent/JPS6012304Y2/en
Publication of JPS5722265U publication Critical patent/JPS5722265U/ja
Application granted granted Critical
Publication of JPS6012304Y2 publication Critical patent/JPS6012304Y2/en
Expired legal-status Critical Current

Links

Landscapes

  • Combinations Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【考案の詳細な説明】 技術分野 この考案は電動タイプライタ−等に使用される電子部品
用基板に関するものである。
[Detailed Description of the Invention] Technical Field This invention relates to a board for electronic parts used in electric typewriters and the like.

従来技術 従来、操作キーの押下げに基づく電気的な押下げ信号に
より活字選択動作等が行われるようにした電動タイプラ
イタ−においては、操作キ一群の配列部下方に1枚の配
線基板が設けられ、その基板上には各操作キーと対応す
る接点や、制御回路を構成する半導体等の電子部品が実
装されていた。
PRIOR ART Conventionally, in an electric typewriter in which a type selection operation is performed by an electrical push signal based on the depression of an operation key, a single wiring board is provided below the arrangement of a group of operation keys. On the board were mounted contacts corresponding to each operation key and electronic components such as semiconductors that made up the control circuit.

従って、この基板は、例えば前記接点をとってみると操
作キーに対応する数だけ設ければよいので、操作キ一群
全体を含むように大きな面積のものを使用する必要があ
る。
Therefore, since it is sufficient to provide the same number of contacts as the number of operation keys, for example, it is necessary to use a board with a large area so as to include the entire group of operation keys.

ところが、従来一般に配線基板として使用される材質の
ものはかなり高価なものであり、これを使用して大きな
基板とすることはコストアップの要因となっていた。
However, the materials generally used for wiring boards in the past are quite expensive, and using them to make a large board increases costs.

このためには安価な材質のものを使用すればよいが、現
在のところこれらの使用は制御回路における信頼性の低
下を招く原因になり、高価なものを全面的に使用せざる
を得ない。
For this purpose, inexpensive materials may be used, but at present, the use of these materials causes a decrease in reliability in the control circuit, and expensive materials have no choice but to be used throughout.

考案の目的 この考案の目的は前述した問題を解消して大幅なコスト
ダウンを図り得るとともに、発熱量の多い電子部品の保
護等を行い得る電子部品用基板を提供することにある。
Purpose of the invention The purpose of this invention is to provide a substrate for electronic components that can solve the above-mentioned problems and achieve a significant cost reduction, as well as protect electronic components that generate a large amount of heat.

実施例 以下、この考案を電動タイプライタ−における電子部品
用基板として具体化した一実施例を図面に基ツいて説明
すると、電動タイプライタ−の操作キー(図示しない)
の配列群下方に固定される大きなキーボード用の基板1
にはボール紙にフェノール樹脂を含浸して構成された安
価なものが使用され、その上面には各操作キーと対応す
る接点2(3個のみ図示)等がプリントされている。
EXAMPLE Hereinafter, an example in which this invention was embodied as a board for electronic components in an electric typewriter will be explained based on the drawings.
Board 1 for a large keyboard fixed below the array group of
An inexpensive one made of cardboard impregnated with phenolic resin is used, and on its top surface, contacts 2 (only three are shown) corresponding to each operation key are printed.

前記キーボード用基板1の近傍において、そのキーボー
ド用基板1と同一平面内に配置される小さなコントロー
ル用プリント基板3はプリント基板としての優秀な特性
を有するガラス繊維入リエポキシ樹脂により構成されて
いる。
A small control printed circuit board 3 disposed in the vicinity of the keyboard substrate 1 on the same plane as the keyboard substrate 1 is made of glass fiber-containing epoxy resin having excellent characteristics as a printed circuit board.

又、このコントロール用プリント基板3と前記キーボー
ド用基板1とは1枚の剛性を有する金属板4によりねじ
5等を使用して機械構造的に連結し一体化されている。
Further, the control printed circuit board 3 and the keyboard circuit board 1 are mechanically connected to each other by a single rigid metal plate 4 using screws 5 and the like and are integrated.

コントロール用基板3上には制御回路を構成する半導体
6等(1個のみ図示)が配置され、又、前記金属板4上
には前記半導体6とともに側御回路を構成する発熱量の
多い半導体7が配置されている。
On the control board 3, a semiconductor 6 etc. (only one is shown) that constitutes a control circuit is disposed, and on the metal plate 4, a semiconductor 7 that generates a large amount of heat and constitutes a side control circuit together with the semiconductor 6 is disposed. is located.

キーボード用基板1上の電子回路と、コントロール用基
板3上の電子回路とは金属板4上を通る接続線8により
接続されている。
The electronic circuit on the keyboard board 1 and the electronic circuit on the control board 3 are connected by a connecting wire 8 passing on the metal plate 4.

発明の効果 このように、この考案の電子部品用基板は2枚のプリン
ト配線基板1,3を1枚の金属板4にて機械構造的に連
結して一体化するとともに、電子部品2. 6.7のう
ち発熱量の多い部品7を前記金属板4上に配置したこと
により、次に列挙するような優れた効果を発輝する。
Effects of the Invention As described above, the electronic component board of this invention mechanically connects and integrates the two printed wiring boards 1 and 3 with one metal plate 4, and also connects the electronic components 2. 6. By arranging the component 7 which generates a large amount of heat out of the components 7 on the metal plate 4, excellent effects as listed below can be achieved.

1 高価な材質のものを全体に使用することなく、制御
回路が設けられた小さな基板3のみに使用し、大きい基
板1には安価なものを使用すればよいので、大幅なコス
トダウンを図ることができる。
1. It is possible to significantly reduce costs by using expensive materials only for the small board 3 on which the control circuit is installed, and by using inexpensive materials for the large board 1, without using expensive materials for the entire board. Can be done.

2 発熱量の多い電子部品7を金属板4上に配置したの
で、その発熱が効率よく放散され、その電子部品7の過
熱による特性の低下及び他の電子部品2,6に対する悪
影響を防止することができる。
2. Since the electronic component 7 that generates a large amount of heat is arranged on the metal plate 4, the heat generated is efficiently dissipated, and the deterioration of the characteristics due to overheating of the electronic component 7 and the adverse effects on the other electronic components 2 and 6 are prevented. Can be done.

3 金属板4が基板1,3に連結一体化されているので
、その金属板4により、熱、湿度等に基づく基板1,3
、特に安価な基板1の歪み等を阻止できる。
3. Since the metal plate 4 is connected and integrated with the substrates 1 and 3, the metal plate 4 allows the substrates 1 and 3 to be controlled based on heat, humidity, etc.
In particular, distortion of the inexpensive substrate 1 can be prevented.

4 両基板1,3が金属板4により連結して一体化され
ているので、タイプライタ−等の本体に対する組付けを
容易に行うことができる。
4. Since both the substrates 1 and 3 are connected and integrated by the metal plate 4, it can be easily assembled to the main body of a typewriter or the like.

なお、この考案は前記実施例に限定されるものではなく
、電動タイプライタ−以外の装置の電子部品用基板とし
て具体化し得ることは言うまでもない。
It goes without saying that this invention is not limited to the above-mentioned embodiment, and can be embodied as a board for electronic components of devices other than electric typewriters.

【図面の簡単な説明】[Brief explanation of drawings]

図はこの考案を具体化した電子部品用基板の平面図であ
る。 キーボード用基板1、接点2、コントロール用基板3、
金属板4、半導体6,7゜
The figure is a plan view of a board for electronic components embodying this idea. Keyboard board 1, contacts 2, control board 3,
Metal plate 4, semiconductor 6,7°

Claims (1)

【実用新案登録請求の範囲】 電子部品2,6.7等を実装する2枚のプリント配線基
板1,3を一平面内に配置し、 内基板1,3を1枚の金属板4にて機械構造的に連結し
て一体化するとともに、 前記内基板1,3上に取付けるべき電子部品のうち発熱
量の多い部品7を前記金属板4上に配置し、部品の放熱
効果を高めたことを特徴とする電子部品用基板。
[Scope of claim for utility model registration] Two printed wiring boards 1 and 3 on which electronic components 2, 6, 7, etc. are mounted are arranged in one plane, and the inner boards 1 and 3 are covered with one metal plate 4. In addition to mechanically connecting and integrating the electronic components to be mounted on the inner substrates 1 and 3, the component 7 that generates a large amount of heat is placed on the metal plate 4 to enhance the heat dissipation effect of the component. A substrate for electronic components featuring:
JP9910180U 1980-07-14 1980-07-14 Substrate for electronic components Expired JPS6012304Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9910180U JPS6012304Y2 (en) 1980-07-14 1980-07-14 Substrate for electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9910180U JPS6012304Y2 (en) 1980-07-14 1980-07-14 Substrate for electronic components

Publications (2)

Publication Number Publication Date
JPS5722265U JPS5722265U (en) 1982-02-04
JPS6012304Y2 true JPS6012304Y2 (en) 1985-04-20

Family

ID=29460786

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9910180U Expired JPS6012304Y2 (en) 1980-07-14 1980-07-14 Substrate for electronic components

Country Status (1)

Country Link
JP (1) JPS6012304Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2003032698A1 (en) * 2001-10-05 2005-01-27 富士通株式会社 Divided and connectable printed boards

Also Published As

Publication number Publication date
JPS5722265U (en) 1982-02-04

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