JPS62250650A - Mounting structure of electronic component part - Google Patents

Mounting structure of electronic component part

Info

Publication number
JPS62250650A
JPS62250650A JP61095583A JP9558386A JPS62250650A JP S62250650 A JPS62250650 A JP S62250650A JP 61095583 A JP61095583 A JP 61095583A JP 9558386 A JP9558386 A JP 9558386A JP S62250650 A JPS62250650 A JP S62250650A
Authority
JP
Japan
Prior art keywords
tabic
electronic component
ceramic substrate
stress
component part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61095583A
Other languages
Japanese (ja)
Other versions
JPH053738B2 (en
Inventor
Michinori Shiina
椎名　道則
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP61095583A priority Critical patent/JPS62250650A/en
Publication of JPS62250650A publication Critical patent/JPS62250650A/en
Publication of JPH053738B2 publication Critical patent/JPH053738B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To increase a buffer force, to obtain high elasticity while absorbing stress by heat, external force, etc., to prevent the damage of a TABIC and to improve the reliability of an electronic component part by forming organic insulators in fine width at a plurality of positions between a ceramic substrate and the TABIC. CONSTITUTION:Organic insulators 2 for buffer consisting of polyimide in fine width are shaped at two positions on a ceramic substrate 1, and a TABIC 3 is mounted onto the organic insulators 2. Even when stress operates to the TABIC 3 by strain by heat of a cap 4 or the application of external force from the upper section of the cap 4 or the like in an electronic component part constituted in this manner, stress by these external force is absorbed by a displacement because the organic insulators 2 composed of polyimide in fine width formed at two positions have thermal stress resistance, thus avoiding the damage of the TABIC 3.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、テープキャリア方式で組立られたＴＡＢＩＣ
と、セラミック基板とで構成される電子部品の構造に関
する。[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a TABIC assembled using a tape carrier method.
and a ceramic substrate.

〔従来の技術〕[Conventional technology]

従来、この種の電子部品の実装構造としては、例えば、
第２図に図示されるようなものがある。Conventionally, the mounting structure for this type of electronic component is, for example,
There is one as shown in FIG.

この構成では、セラミック基板１の上にブロック状の緩
衝用有機絶縁体１２が設置され、そのｈにＴＡＢＩＣ３
が装着され、ＴＡＢＩＣ３とセラミック基板１はＴＡＢ
ＩＣリード５で接続され、さらにキャップ４がセラミッ
ク基板１の上に装着された電子部品をカバー子るように
取付けられている。In this configuration, a block-shaped buffer organic insulator 12 is installed on the ceramic substrate 1, and the TABIC 3
is installed, TABIC3 and ceramic board 1 are connected to TAB
They are connected by IC leads 5, and a cap 4 is attached to cover the electronic components mounted on the ceramic substrate 1.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

ト述した従来の電子部品組立体の構造では、緩衝用有機
絶縁体の弾力性が不足し、電子部品の発熱等によって生
じる構成部品間の歪を充分吸収することができず、ＴＡ
ＢＩＣにこれらの歪による大きな応力が作用し、　ＴＡ
ＢＩＣが破損するなど電子部品の信頼性を著しく低下さ
せるという欠点がある。In the structure of the conventional electronic component assembly described above, the elasticity of the buffering organic insulator is insufficient, and the strain between the components caused by heat generation of the electronic component cannot be sufficiently absorbed.
A large stress due to these strains acts on the BIC, and TA
This has the disadvantage that the reliability of electronic components is significantly reduced, such as damage to the BIC.

〔問題点を解決するための手段〕[Means for solving problems]

本発明の電子部品の実装構造は、微細幅の緩衝用有機絶
縁体をセラミック基板とＴＡＢＩＣの間の複数箇所に設
置したことを特徴とする。The electronic component mounting structure of the present invention is characterized in that micro-width buffering organic insulators are installed at multiple locations between the ceramic substrate and the TABIC.

したがって、複数箇所に設置された微細幅の緩衝用有機
絶縁体により、セラミック基板とＴＡＢＩＣの間の緩衝
力が向トし、電子部品の発熱等により発生した応力を吸
収することが可能となる。Therefore, the buffering organic insulators with fine widths installed at a plurality of locations balance the buffering force between the ceramic substrate and the TABIC, making it possible to absorb stress generated due to heat generation of electronic components, etc.

〔実施例〕〔Example〕

次に１本発明の実施例について図面を参照して説明する
。Next, an embodiment of the present invention will be described with reference to the drawings.

第１図は本発明の電子部品の実装構造の一実施例の断面
図である０本実施例では、セラミック基１ｆｉ１のヒの
２箇所に微細幅のポリイミドからなるｌｓ衝用有機絶縁
体２が設置され、そのヒにＴＡＢＩＣ３が装着されてお
り、それ以外の構造は第２図のものと同様である。FIG. 1 is a cross-sectional view of one embodiment of the electronic component mounting structure of the present invention. In this embodiment, an organic insulator 2 for LS made of polyimide with a fine width is placed at two locations on the ceramic base 1fi1. The TABIC 3 is installed on its head, and the other structure is the same as that shown in Fig. 2.

Ｈ記のように構成された電子部品において。In an electronic component configured as in Section H.

キャー、プ４が熱によって歪むか、又は、キャップ４の
とから外力が加わる等によりＴＡＢＩＣ３に応力が作用
しても、２箇所に設けられた微細幅のポリイミドからな
る有機絶縁体２は耐熱応力性を有するのでこれら外力に
よる応力を変位により吸収し、ＴＡＢＩＣ３の損傷を避
けることができる。Even if stress is applied to the TABIC 3 due to the cap 4 being distorted by heat or external force being applied from the cap 4, the organic insulator 2 made of polyimide with a fine width provided at two locations will resist heat stress. Since the TABIC 3 has such properties, the stress caused by these external forces can be absorbed by displacement, and damage to the TABIC 3 can be avoided.

〔発明の効果〕〔Effect of the invention〕

以ヒ説明したように本発明は、セラミック基板とＴＡＢ
ＩＣとの間に、微細幅の有機絶縁体を複数箇所に設置す
ることにより、緩衝力が向上して高い弾性が得られ、熱
又は、外力等により発生する応力をこれら有機絶縁体に
より吸収して、応力によるＴＡＢＩＣの破損を防１ヒし
、これにより電子部品の高い信頼性を得ることができる
という効果がある。As explained below, the present invention has a ceramic substrate and a TAB.
By installing micro-width organic insulators at multiple locations between the IC and the IC, the buffering force is improved and high elasticity is obtained, and the stress generated by heat or external force is absorbed by these organic insulators. This has the effect of preventing damage to the TABIC due to stress, thereby making it possible to obtain high reliability of electronic components.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、本発明の電子部品組立体の一実施例の断面図
、第２図は、従来の電子部品の一例の断面図である。 ｌ・・・・・・セラミック基板、 ２・・・・・・有機絶縁体。 ３・・・・・・ＴＡＢＩＣｌ ４・・・・・・キャップ、 ５・・・・・・ＴＡＢＩＣリード。FIG. 1 is a cross-sectional view of an embodiment of an electronic component assembly according to the present invention, and FIG. 2 is a cross-sectional view of an example of a conventional electronic component. l...Ceramic substrate, 2...Organic insulator. 3...TABICl 4...Cap, 5...TABIC lead.

Claims (1)

【特許請求の範囲】 配線パターンを有するセラミック基板と、テープキャリ
ア方式で組立られたＴＡＢＩＣと、前記セラミック基板
上に設けられたＴＡＢＩＣの緩衝用有機絶縁体と、前記
セラミック基板上に載置された部品をカバーするキャッ
プとからなる電子部品の組立構造において、 微細幅の緩衝用有機絶縁体を前記セラミック基板とＴＡ
ＢＩＣの間の複数箇所に設置したことを特徴とする電子
部品の実装構造。[Scope of Claims] A ceramic substrate having a wiring pattern, a TABIC assembled using a tape carrier method, an organic insulator for buffering the TABIC provided on the ceramic substrate, and a TABIC buffer mounted on the ceramic substrate. In an electronic component assembly structure consisting of a cap that covers the component, a micro-width buffering organic insulator is bonded to the ceramic substrate and the TA.
A mounting structure for electronic components, which is characterized by being installed at multiple locations between BICs.
JP61095583A 1986-04-23 1986-04-23 Mounting structure of electronic component part Granted JPS62250650A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61095583A JPS62250650A (en) 1986-04-23 1986-04-23 Mounting structure of electronic component part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61095583A JPS62250650A (en) 1986-04-23 1986-04-23 Mounting structure of electronic component part

Publications (2)

Publication Number Publication Date
JPS62250650A true JPS62250650A (en) 1987-10-31
JPH053738B2 JPH053738B2 (en) 1993-01-18

Family

ID=14141606

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61095583A Granted JPS62250650A (en) 1986-04-23 1986-04-23 Mounting structure of electronic component part

Country Status (1)

Country Link
JP (1) JPS62250650A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5264726A (en) * 1989-07-21 1993-11-23 Nec Corporation Chip-carrier

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5810841A (en) * 1981-07-13 1983-01-21 Mitsubishi Electric Corp Resin sealing type semiconductor device
JPS60206314A (en) * 1984-03-30 1985-10-17 Matsushita Electric Ind Co Ltd Ladder-type ceramic filter

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5810841A (en) * 1981-07-13 1983-01-21 Mitsubishi Electric Corp Resin sealing type semiconductor device
JPS60206314A (en) * 1984-03-30 1985-10-17 Matsushita Electric Ind Co Ltd Ladder-type ceramic filter

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5264726A (en) * 1989-07-21 1993-11-23 Nec Corporation Chip-carrier

Also Published As

Publication number Publication date
JPH053738B2 (en) 1993-01-18

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