JPH0338895A - Circuit board for mounting component - Google Patents

Abstract

PURPOSE:To enable attainment of a circuit board for mounting a component, which is free from occurrence of an electrical or mechanical breakdown between a mounting pattern and the component, by providing an opening in the part of the pattern corresponding to a connection electrode of the component. CONSTITUTION:In the part of a mounting pattern 1 formed on a board 6, which corresponds to a connection electrode 3 of a component 4 such as a passive or active element, openings 2 of the mounting pattern are provided in the shape of a comb in parallel to the direction of the short side of the component 4. A conductive or insulative bonding agent 5 is stuck on this mounting pattern 1 by using a printing, dispense or stamping method or the like, and thereby the component 4 such as the passive or active element is mounted. Even when a load charged on the component 4 at the time of mounting the component is excessive, accordingly, the thickness of a conductive or insulative layer between the connection electrode 3 of the component 4 and the mounting pattern 1 does not approximate to zero and a prescribed thickness of the layer is secured. Thereby a certain strength of bonding of the pattern 1 to the component 4 can be maintained.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a circuit board for mounting components.

[Conventional technology]

Conventionally, this type of circuit board for mounting components is shown in Fig. 3(a).
As shown in FIG. 3(b), the parts of the mounting pattern 21 corresponding to the connection electrodes 3 of the components 4 such as passive elements and active elements are particularly machined as shown in FIGS. 3(a) and (b). without doing
It had a flat mounting pattern 21.

[Problem to be solved by the invention]

In the conventional circuit board for mounting components described above, the mounting pattern portion corresponding to the connection electrodes of components such as passive elements and active elements is flat. When measuring V&mechanical connections, when the load applied to a component becomes excessive, the thickness of the conductive and insulating adhesive layer between the component's connection electrode and mounting pattern approaches zero.

Therefore, there is a disadvantage that there is no expansion coefficient difference between the mounting pattern and the component, and there is no buffer against external force, leading to electrical or mechanical damage between the mounting pattern and the component.

An object of the present invention is to provide a circuit board for mounting components that does not cause electrical or mechanical damage between the mounting pattern and the components.

[Means to solve the problem]

The present invention provides a component mounting circuit board on which at least one of a passive element and an active element is mounted, in which an opening is provided in a portion of a pattern corresponding to a connection electrode of the component.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

FIGS. 1(a) and 1(a)) are a plan view of essential parts and a sectional view taken along the line A-A' of a first embodiment of the present invention.

In the first embodiment, as shown in FIGS. 1(a) and 1(b), parts 4 such as passive or active elements are mounted on parts 4 corresponding to connection electrodes 3 on a mounting pattern 2 formed on a substrate 6'2. Pattern opening (e.g. width 0.2mm x length 1.omm)
are provided in a comb shape parallel to the short side direction of the component 4. Printing conductive or insulating adhesive 5 on this mounting pattern 11,
It is attached using a dispensing method, a stamping method, etc., and components 4 such as passive or active elements are mounted.

FIGS. 2(a) and 2(b) are a plan view of a main part and a sectional view taken along the line B-B' of a second embodiment of the present invention.

The second embodiment, as shown in FIGS. 2(a) and (b),
A mounting pattern opening (for example, width 0.2 mm x length 1.5 mm) is formed in the mounting pattern 11 formed on the substrate 6 at a portion corresponding to the connection electrode 3 of the component 4 such as a passive or active element.
are provided in a comb shape parallel to the long side direction of the component 4. A conductive or insulating adhesive 5 is printed on this mounting pattern 11L and adhered thereto using a dispense stamping method, etc., and components 4 such as passive or active elements are mounted thereon.

〔Effect of the invention〕

As explained above, the present invention has a structure in which openings are provided in the component mounting pattern corresponding to the connection electrodes of components such as passive or active elements, so that when the load applied to the component becomes excessive during component mounting, However, the thickness of the conductive insulation layer between the component connection electrode and mounting pattern does not approach zero,
A certain layer thickness can be ensured. Therefore, the adhesive strength between the pattern and the component can be maintained constant, which is effective in improving quality.

[Brief explanation of drawings]

FIG. 1(a, ), <1)) is a plan view and a cross-sectional view taken along the line B-B' of the first embodiment of the present invention, and FIG. 3(a). (b) is a plan view of the main parts of a conventional component mounting circuit board, and (c)
It is a sectional view taken along the line -c'. 1.1.1.21...Installation pattern, 2,12...
Mounting pattern opening, 3... connection electrode, 4... parts,
5 adhesive, 6... substrate.

Claims (1)

[Claims] A circuit board for mounting a component on which at least one of a passive element and an active element is mounted, characterized in that an opening is provided in a portion of a pattern corresponding to a connection electrode of the component. circuit board.