JP2904596B2 - Board mounting device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate used for attaching an insulator substrate provided with an electric circuit such as a microwave integrated circuit constituting an amplifier in a microwave band to an attachment such as a chassis or a case. It relates to a mounting device.

[0002]

2. Description of the Related Art In general, a microwave integrated circuit is formed by using a thin film technique on one surface of an insulator substrate using a hard substrate such as alumina ceramics. Then, the insulator substrate on which such a microwave integrated circuit is formed is metal-deposited on the other side by vacuum evaporation or the like, and then attached to an attachment using a substrate attachment device.

FIG. 3 shows such a conventional substrate mounting apparatus. An insulating substrate 2 is fixed to a substantially central portion of a carrier plate 1 in which mounting holes 1a and 1b are formed by soldering or bonding. . And this carrier plate 1
Utilizing the mounting holes 1a, 1b, it is screwed to a mounting body (not shown).

However, in the above-described substrate mounting apparatus, since stress is generated when the carrier plate 1 is screwed to a mounting body (not shown), each mounting surface of the carrier plate 1 and the mounting body (not shown) is generated. The carrier plate 1 is deformed due to the unevenness existing in the insulating substrate 2, and the insulating substrate 2 is peeled off.
It had the problem of being damaged.

As a means for preventing such peeling and breakage of the insulating substrate 2, it is only necessary to increase the planar accuracy of each mounting surface of the carrier plate 1 and the mounting body (not shown). It is very cumbersome and very expensive.

Therefore, recently, as shown in FIG. 4, a pair of grooves 3a, 3b are formed between the mounting holes 1a, 1b of the carrier plate 1 and the insulator substrate so as to sandwich the insulator substrate. A method has also been adopted in which the elasticity of the grooves 3a and 3b is used to absorb the stress generated when the insulating substrate 2 is mounted on a mounting body (not shown), thereby preventing the insulating substrate 2 from peeling or breaking.

However, in the above-described substrate mounting apparatus, the stress at the time of mounting the carrier plate 1 is reduced by the grooves 3a, 3a.
b, but it was difficult to reliably prevent the insulating substrate 2 from peeling or breaking.

[0008]

As described above, the conventional substrate mounting apparatus has a problem that the insulating substrate peels off from the carrier plate or is damaged during mounting.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to provide a substrate mounting apparatus which has a simple configuration and can reliably prevent peeling or breakage of an insulating substrate.

[0010]

According to the present invention, an insulator substrate provided with an electric circuit is fixed to a carrier plate .
Both ends of the carrier plate sandwiching the insulator substrate
In the board mounting device, each of which is mounted on the mounting body, the carrier plate sandwiching the insulator substrate.
Grooves between the insulating substrate at the end and the mounting site
Parts at both ends in the longitudinal direction of these grooves.
Each of them is provided with a cutout part which is partially cutout.

[0011]

According to the above construction, the groove of the carrier plate is set to a value suitable for the elastic force to absorb the deformation stress by the action of the notch. Therefore, when a deformation stress is generated due to irregularities on the mounting surfaces of the carrier plate and the mounting body when the mounting plate is mounted on the mounting body, the deformation stress is concentrated on the groove, absorbed by the groove, and applied to the insulating substrate. By preventing the application, peeling and breakage of the insulating substrate are prevented.

[0012]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 shows a substrate mounting apparatus according to an embodiment of the present invention. An insulator substrate 11 is fixed to a carrier plate 10 at a substantially central portion thereof by soldering or bonding. This carrier plate 10 has mounting holes 10
a, 10b are formed at both ends of the insulating substrate 11 with the mounting holes 10a, 10b and the insulating substrate 1
Grooves 12a and 12b are formed on one surface of the insulating substrate 11 to be fixed between the insulating substrate 11 and the insulating substrate 11, respectively. Notches 13a and 13b are formed at both ends in the longitudinal direction of the grooves 12a and 12b, respectively. These notches 13a and 13b are
The function of setting the elastic force of 2a, 12b to be very small compared to the elastic force of the surface of the carrier plate 10 is achieved.

The insulator substrate 11 is formed of an insulating material such as alumina ceramics, and has an electric circuit such as a microwave integrated circuit formed on one surface thereof, and a metal formed on the other surface by vacuum deposition or the like. After being deposited, it is fixed to the carrier plate 10 as described above.

In the above configuration, the carrier plate 10
Is installed at a predetermined position of a mounting body (not shown), and is screwed to a mounting body (not shown) using the mounting holes 10a and 10b. At this time, the carrier plate 10 has the grooves 12a, 12a, 12a, 12a, 12a, 12a, and 12a due to the elastic force due to the deformation force generated by the unevenness of the mounting surface and the unevenness of the mounting surface of the mounting body (not shown).
12b, and is absorbed by the grooves 12a, 12b. Thereby, the insulator substrate 1 of the carrier plate 10
1 is prevented from being given a deformation stress directly,
Peeling and breakage of the insulator substrate 11 are prevented.

As described above, the substrate mounting apparatus has a pair of grooves 12a, 12b provided on the carrier plate 10 so as to sandwich the insulating substrate 11, and the notches 13a, 13b are formed at both ends in the longitudinal direction of the grooves 12a, 12b. Is provided, the elastic force of the grooves 12a and 12b is reduced by the carrier plate 1.
It was configured to be able to be set smaller than the 0 face part. According to this, the deformation stress generated due to the unevenness of the mounting surface of the carrier plate 10 and the mounting body (not shown) is concentrated on the grooves 12a and 12b having a small elastic force, and the application to the insulating substrate 11 is prevented. As a result, the insulator substrate 11
Of the carrier plate 10 from the carrier plate 10 and breakage thereof can be reliably prevented.

In the above embodiment, the grooves 12a, 12
Although the description has been given of the case where b is provided on one surface of the carrier plate 10 to which the insulator substrate 11 is fixed, the present invention is not limited to this. For example, as shown in FIG. It is also possible to configure so as to be provided on the other surface that is not performed. Therefore, it is needless to say that the present invention is not limited to the above-described embodiment, and that various modifications can be made without departing from the scope of the present invention.

[0018]

As described in detail above, according to the present invention, it is possible to provide a substrate mounting apparatus which has a simple structure and can reliably prevent peeling or breakage of an insulating substrate.

[Brief description of the drawings]

FIG. 1 is a view showing a board mounting apparatus according to one embodiment of the present invention.

FIG. 2 is a diagram showing another embodiment of the present invention.

FIG. 3 is a diagram showing a conventional board mounting device.

FIG. 4 is a view showing a conventional board mounting apparatus.

[Explanation of symbols]

10: Carrier plate, 10a, 10b: Mounting hole, 1
1 ... Insulator substrate, 12a, 12b ... Groove, 13a, 13
b: Notch.

Claims (1)

(57) [Claims] We claim: 1. The insulating substrate provided with the electric circuit fixed to the carrier plate, wherein the carrier plate
A board mounting device comprising: a mounting body having both ends sandwiching an insulating substrate, wherein both ends of the carrier plate sandwiching the insulating substrate.
A groove is provided between the insulator substrate and the mounting portion.
And at both ends of each of these grooves in the longitudinal direction.
A substrate mounting device, comprising a cutout part that is partially cut away .