JP2870021B2 - Circuit board for mounting components - Google Patents
Circuit board for mounting componentsInfo
- Publication number
- JP2870021B2 JP2870021B2 JP1174626A JP17462689A JP2870021B2 JP 2870021 B2 JP2870021 B2 JP 2870021B2 JP 1174626 A JP1174626 A JP 1174626A JP 17462689 A JP17462689 A JP 17462689A JP 2870021 B2 JP2870021 B2 JP 2870021B2
- Authority
- JP
- Japan
- Prior art keywords
- component
- mounting
- circuit board
- mounting pattern
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は部品搭載用回路基板に関する。Description: TECHNICAL FIELD The present invention relates to a circuit board for mounting components.
従来、この種の部品搭載用回路基板は、第３図
（ａ），（ｂ）に示すように、受動素子と能動素子等の
部品４の接続電極３に対応する搭載パターン21の部分に
は、第３図（ａ），（ｂ）に示すように、特に、加工を
せず、フラットな搭載パターン21となっていた。Conventionally, as shown in FIGS. 3A and 3B, this type of component mounting circuit board has a mounting pattern 21 corresponding to the connection electrode 3 of the component 4 such as a passive element and an active element. As shown in FIGS. 3 (a) and 3 (b), a flat mounting pattern 21 was obtained without any particular processing.
上述した従来技術の部品搭載用回路基板は、受動素子
と能動素子等の部品の接続電極に対応する搭載パターン
の部分がフラットであるため、導電性，絶縁性接着剤等
を用いて電気的，機械的接続を図る場合、部品にかかる
加重が過大になった時に、部品の接続電極と搭載パター
ン間に於ける導電性，絶縁性接着剤層厚はゼロに近づい
ていく。このため、搭載パターンと部品間の膨張係数
差、および、外力に対するバッファーがなくなり、搭載
パターンと部品間の電気的あるいは機械的な破壊につな
がるという欠点がある。In the above-described circuit board for mounting components of the prior art, the portions of the mounting pattern corresponding to the connection electrodes of the components such as the passive element and the active element are flat. In the case of mechanical connection, when the load applied to the component becomes excessive, the thickness of the conductive and insulating adhesive layer between the connection electrode of the component and the mounting pattern approaches zero. For this reason, there is no buffer for the expansion coefficient difference between the mounting pattern and the component and an external force, and there is a drawback that the electrical or mechanical destruction between the mounting pattern and the component occurs.
本発明の目的は、搭載パターンと部品間の電気的ある
いは機械的な破壊の発生がない部品搭載用回路基板を提
供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a component mounting circuit board in which no electrical or mechanical destruction occurs between a mounting pattern and a component.
本発明は、受動素子又は能動素子の接続電極と電気的
に接続される搭載パターンを有する部品搭載用回路基板
において、前記搭載パターンのうち接着剤を介して前記
接続電極と接する部分には、前記搭載パターンに囲まれ
て閉じた外周を有する、前記接着剤が充填される複数の
開口部が形成されていることを特徴とする。The present invention is directed to a component mounting circuit board having a mounting pattern electrically connected to a connection electrode of a passive element or an active element, wherein a portion of the mounting pattern which is in contact with the connection electrode via an adhesive is A plurality of openings filled with the adhesive and having a closed outer periphery surrounded by a mounting pattern are formed.
次に、本発明の実施例について図面を参照して説明す
る。Next, embodiments of the present invention will be described with reference to the drawings.
第１図（ａ），（ｂ）は本発明の実施例の要部平面図
及びＡ−Ａ′線断面図である。本発明の実施例は第１図
（ａ），（ｂ）に示すように、基板６上に形成した搭載
パターン１に受動あるいは能動素子等の部品４の接続電
極３に対応する部分に搭載パターン開口部（例えば、巾
0.2mm×長さ1.0mm）を部品４の短辺方向に平行に櫛型状
に複数個（この場合には２個）設ける。この搭載パター
ン１上に導電性あるいは絶縁性接着剤５を印刷，ディス
ペンス，スタンピング法等を用いて付着させ、受動ある
いは能動素子等の部品４を搭載する。FIGS. 1 (a) and 1 (b) are a plan view and a sectional view taken along line AA 'of an embodiment of the present invention. In the embodiment of the present invention, as shown in FIGS. 1 (a) and 1 (b), a mounting pattern 1 formed on a substrate 6 is mounted on a portion corresponding to the connection electrode 3 of a component 4 such as a passive or active element. Openings (eg width
A plurality (0.2 in this case, 1.0 mm in length) is provided in a comb shape in parallel with the short side direction of the component 4 (two in this case). A conductive or insulative adhesive 5 is attached onto the mounting pattern 1 by printing, dispensing, stamping, or the like, and a component 4 such as a passive or active element is mounted.
第２図（ａ），（ｂ）は本発明の参考例の要部平面図
及びＢ−Ｂ′線断面図である。FIGS. 2 (a) and 2 (b) are a plan view and a sectional view taken along line BB 'of a main portion of a reference example of the present invention.
この参考例は、第２図（ａ），（ｂ）に示すように、
基板６上に形成した搭載パターン11に受動あるいは能動
素子等の部品４の接続電極３に対応する部分に搭載パタ
ーン開口部（例えば、巾0.2mm×長さ1.5mm）を部品４の
長辺方向に平行に櫛型状に設ける。この搭載パターン11
上に導電性あるいは絶縁性接着剤５を印刷，ディスペン
ス，スタンピング法等を用いて付着させ、受動あるいは
能動素子等の部品４を搭載する。第２図の参考例におい
ては、基板６の搭載パターン11には部品４の長辺方向平
行に開口部が櫛型状に設けられているが、搭載パターン
11の開口部の一端はパターンが完全に切れた形状である
ために、第１図の本発明の実施例と比較して導電性の接
着剤５が流れ出し、部品４の両端の接続電極３を搭載す
る二つの搭載パターン間で電気的絶縁性が低下したり、
ショートする不具合が発生しやすい。As shown in FIGS. 2 (a) and 2 (b),
A mounting pattern opening (for example, 0.2 mm in width × 1.5 mm in length) is formed in a portion corresponding to the connection electrode 3 of the component 4 such as a passive or active element on the mounting pattern 11 formed on the substrate 6 in the long side direction of the component 4. Is provided in a comb shape in parallel with This mounting pattern 11
A conductive or insulating adhesive 5 is adhered on the upper surface by printing, dispensing, stamping, or the like, and a component 4 such as a passive or active element is mounted. In the reference example of FIG. 2, the mounting pattern 11 of the substrate 6 is provided with openings in a comb shape in parallel with the long side direction of the component 4.
Since one end of the opening 11 has a completely cut pattern, the conductive adhesive 5 flows out as compared with the embodiment of the present invention shown in FIG. The electrical insulation between the two mounting patterns to be mounted decreases,
Short-circuiting is likely to occur.
以上説明したように本発明は、受動あるいは能動素子
等の部品の接続電極に対応する部品搭載パターンに開口
部を複数個設けた構造をとることにより、部品搭載時に
部品にかかる荷重が過大になった時でも、部品の接続電
極と搭載パターン間に於ける導電絶縁層圧は、ゼロに近
づかず、一定の層厚が確保できる。従って、パターンと
部品の接着強度を一定に保持できることになり品質の向
上に効果がある。また、部品搭載パターンの矩形の開口
部により導電絶縁層の接着剤の該部品搭載パターン間へ
の流れ出しも防止でき、電気的絶縁性の低下が抑制でき
る効果もある。As described above, the present invention employs a structure in which a plurality of openings are provided in a component mounting pattern corresponding to connection electrodes of components such as passive or active elements, so that a load applied to the component during component mounting becomes excessive. Even when this occurs, the pressure of the conductive insulating layer between the connection electrode of the component and the mounting pattern does not approach zero, and a constant layer thickness can be secured. Therefore, the adhesive strength between the pattern and the component can be kept constant, which is effective in improving the quality. In addition, the rectangular opening of the component mounting pattern can also prevent the adhesive of the conductive insulating layer from flowing out between the component mounting patterns, and have an effect of suppressing a decrease in electrical insulation.
第１図（ａ），（ｂ）は本発明の実施例の要部平面図、
及びＡ−Ａ′線断面図、第２図（ａ），（ｂ）は本発明
の参考例の要部平面図及びＢ−Ｂ′線断面図、第３図
（ａ），（ｂ）は従来の部品搭載用回路基板の要部平面
図及びＣ−Ｃ′線断面図である。 1,11,21……搭載パターン、2,12……搭載パターン開口
部、３……接続電極、４……部品、５……接着剤、６…
…基板。1 (a) and 1 (b) are plan views of a main part of an embodiment of the present invention,
2 (a) and 2 (b) are main part plan views and BB 'line sectional views of a reference example of the present invention, and FIGS. 3 (a) and 3 (b) are It is the principal part top view and CC 'line sectional drawing of the conventional circuit board for component mounting. 1,11,21 mounting pattern, 2,12 mounting pattern opening, 3 ... connection electrode, 4 ... part, 5 ... adhesive, 6 ...
…substrate.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭62−73696（ＪＰ，Ａ) 特開 昭63−302595（ＪＰ，Ａ) 特開 昭60−218900（ＪＰ，Ａ) 実開 昭58−5372（ＪＰ，Ｕ) 実開 昭59−36268（ＪＰ，Ｕ) 実開 平２−86133（ＪＰ，Ｕ) 実開 昭61−38975（ＪＰ，Ｕ) 実公 昭52−3649（ＪＰ，Ｙ２) (58)調査した分野(Int.Cl.6，ＤＢ名) H05K 3/34 H05K 3/32 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-62-73696 (JP, A) JP-A-63-302595 (JP, A) JP-A-60-218900 (JP, A) 5372 (JP, U) JP-A-59-36268 (JP, U) JP-A 2-86133 (JP, U) JP-A 61-38975 (JP, U) JP-A 52-3649 (JP, Y2) (58) Field surveyed (Int.Cl. 6 , DB name) H05K 3/34 H05K 3/32
Claims (1)
に接続される搭載パターンを有する部品搭載用回路基板
において、前記搭載パターンのうち接着剤を介して前記
接続電極と接する部分には、前記搭載パターンに囲まれ
て閉じた外周を有する、前記接着剤が充填される複数の
開口部が形成されていることを特徴とする部品搭載用回
路基板。In a component mounting circuit board having a mounting pattern electrically connected to a connection electrode of a passive element or an active element, a portion of the mounting pattern that is in contact with the connection electrode via an adhesive is: A component mounting circuit board, wherein a plurality of openings filled with the adhesive are formed, the plurality of openings having a closed outer periphery surrounded by the mounting pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1174626A JP2870021B2 (en) | 1989-07-05 | 1989-07-05 | Circuit board for mounting components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1174626A JP2870021B2 (en) | 1989-07-05 | 1989-07-05 | Circuit board for mounting components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0338895A JPH0338895A (en) | 1991-02-19 |
| JP2870021B2 true JP2870021B2 (en) | 1999-03-10 |
Family
ID=15981884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1174626A Expired - Lifetime JP2870021B2 (en) | 1989-07-05 | 1989-07-05 | Circuit board for mounting components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2870021B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0546115U (en) * | 1991-11-12 | 1993-06-18 | 株式会社大真空 | Surface mount crystal unit |
| WO2012063682A1 (en) * | 2010-11-08 | 2012-05-18 | 株式会社村田製作所 | Circuit module having attached metal case, circuit module assembly having attached metal case, and method for producing circuit module having attached metal case |
| JP2015135863A (en) * | 2014-01-16 | 2015-07-27 | 三菱電機株式会社 | printed circuit board |
| JP6326957B2 (en) * | 2014-05-16 | 2018-05-23 | 大日本印刷株式会社 | Suspension board, suspension board with actuator element, suspension, suspension with head, and hard disk drive |
| JP6829687B2 (en) | 2015-08-10 | 2021-02-10 | ヌヴォトンテクノロジージャパン株式会社 | Light emitting device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6273696A (en) * | 1985-09-26 | 1987-04-04 | 富士通株式会社 | Placing method for chip type part |
-
1989
- 1989-07-05 JP JP1174626A patent/JP2870021B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0338895A (en) | 1991-02-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5151771A (en) | High lead count circuit board for connecting electronic components to an external circuit | |
| EP0823782B1 (en) | Piezoelectric component | |
| JP2870021B2 (en) | Circuit board for mounting components | |
| JPH1022164A (en) | Ceramic electronic component | |
| JPH09186042A (en) | Laminated electronic component | |
| JP4107160B2 (en) | Composite electronic components | |
| JPH09307208A (en) | Connecting end part structure of flexible printed board | |
| JP2528326B2 (en) | How to attach a capacitor to a circuit board | |
| JP3164182B2 (en) | Composite electronic components | |
| JP3360011B2 (en) | Circuit board structure | |
| JP2949252B2 (en) | Chip type electronic components | |
| JPH10256695A (en) | Electric-part connecting structure and land pattern structure | |
| JPH0519974Y2 (en) | ||
| JP3022853B2 (en) | Circuit board | |
| JP2924078B2 (en) | IC card | |
| JP2666792B2 (en) | Electronic component mounting structure | |
| JP2530725Y2 (en) | Magnetic head device | |
| JPH0230843Y2 (en) | ||
| JPS6214718Y2 (en) | ||
| JP3580477B2 (en) | Thermal head | |
| JP2504978Y2 (en) | Electronic component board | |
| JP2001185837A (en) | Wiring board | |
| JPH10284927A (en) | Planar antenna structure | |
| JPH02288205A (en) | Chip element | |
| JPS61154002A (en) | Chip resistor |