JPH1022164A - Ceramic electronic component - Google Patents

Ceramic electronic component

Info

Publication number
JPH1022164A
JPH1022164A JP8195547A JP19554796A JPH1022164A JP H1022164 A JPH1022164 A JP H1022164A JP 8195547 A JP8195547 A JP 8195547A JP 19554796 A JP19554796 A JP 19554796A JP H1022164 A JPH1022164 A JP H1022164A
Authority
JP
Japan
Prior art keywords
ceramic
electronic component
external electrode
shoulder
ceramic element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8195547A
Other languages
Japanese (ja)
Other versions
JP3307234B2 (en
Inventor
Takashi Nomichi
孝志 野路
Mamoru Ogawa
守 小川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP19554796A priority Critical patent/JP3307234B2/en
Publication of JPH1022164A publication Critical patent/JPH1022164A/en
Application granted granted Critical
Publication of JP3307234B2 publication Critical patent/JP3307234B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • H05K3/3442Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers

Abstract

PROBLEM TO BE SOLVED: To provide highly reliable small-sized ceramic electronic components which do not cause any tombstone phenomenon when the components are mounted on a circuit board. SOLUTION: The shoulder sections 4b of external electrodes 4 creeping from both end faces 3a of a ceramic element 3 in the longitudinal direction to the peripheral surfaces of both end sections of the element 3 are rounded with a radius of curvature of <=60μm and, at the same time, projecting sections 10 are respectively formed at the central parts of the parts 4a of the electrodes 4 formed on the end faces 3a so that the heights of the sections 10 from the surrounding areas 11 can become 5-35μm.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、電子部品に関し、
詳しくは、セラミック素子の長手方向両端面を含む両端
側部分に外部電極が配設された構造を有するセラミック
電子部品に関する。
TECHNICAL FIELD The present invention relates to an electronic component,
More specifically, the present invention relates to a ceramic electronic component having a structure in which external electrodes are provided at both end portions including both end surfaces in the longitudinal direction of a ceramic element.

【0002】[0002]

【従来の技術及び発明が解決しようとする課題】表面実
装型のセラミック電子部品の一つに、例えば、図3及び
図4に示すように、セラミック層31を介して複数の電
極(内部電極)32が互いに対向するように積層、配設
されたセラミック素子33の両端部に、内部電極32と
導通するように外部電極34が配設された構造を有する
積層セラミックコンデンサ(セラミック電子部品)35
がある。
2. Description of the Related Art As shown in FIGS. 3 and 4, for example, as shown in FIGS. 3 and 4, a plurality of electrodes (internal electrodes) are interposed on a ceramic electronic component of a surface mount type. A multilayer ceramic capacitor (ceramic electronic component) 35 having a structure in which external electrodes 34 are provided so as to be electrically connected to the internal electrodes 32 at both ends of a ceramic element 33 laminated and provided so that the ceramic elements 32 face each other.
There is.

【0003】そして、電子機器が小型化するにつれて、
このようなセラミック電子部品35も小型化し、セラミ
ック素子33の長さ(L)が1.0mm以下、高さ(H)
及び幅(W)が0.5mm以下というようなきわめて小型
のセラミック電子部品が用いられるに至っている。
[0003] As electronic devices become smaller,
Such a ceramic electronic component 35 is also miniaturized, and the length (L) of the ceramic element 33 is 1.0 mm or less and the height (H).
Very small ceramic electronic components having a width (W) of 0.5 mm or less have been used.

【0004】そして、このような小型のセラミック電子
部品35においては、例えば、セラミック素子33の長
手方向両端面33aから周囲面33cに回り込む部分で
ある肩部(エッジ部)33bが曲率半径50μm程度の
丸み(R)が与えられており、さらに、その上に形成さ
れた外部電極34の肩部34bは曲率半径80μm程度
の丸み(R)が与えられている。また、外部電極34の
セラミック素子33の端面33aに形成された部分34
aは、約50μm程度の厚みtを有している。
In such a small-sized ceramic electronic component 35, for example, a shoulder (edge portion) 33b, which is a portion extending from both longitudinal end surfaces 33a of the ceramic element 33 to the peripheral surface 33c, has a radius of curvature of about 50 μm. The shoulder 34b of the external electrode 34 formed thereon is rounded (R) with a radius of curvature of about 80 μm. Further, a portion 34 formed on the end face 33a of the ceramic element 33 of the external electrode 34
a has a thickness t of about 50 μm.

【0005】ところで、上記のような小型のセラミック
電子部品35の場合、例えば、はんだリフローによる実
装工程でセラミック電子部品35が、図5に示すよう
に、実装基板36のランド37上で立ち上がってしまう
ツームストーン現象が発生するという問題点がある。
In the case of the above-described small ceramic electronic component 35, for example, the ceramic electronic component 35 rises on the land 37 of the mounting board 36 in a mounting process by solder reflow as shown in FIG. There is a problem that the tombstone phenomenon occurs.

【0006】このツームストーン現象は、セラミック素
子33の肩部33bや外部電極34の肩部34bの丸み
(R)などの形状的な条件、はんだリフロー工程などの
実装工程の操作条件などに関連して発生するものであ
り、実装の信頼性に大きな影響を与えるものである。
The tombstone phenomenon is related to geometrical conditions such as the roundness (R) of the shoulder 33b of the ceramic element 33 and the shoulder 34b of the external electrode 34, and operating conditions of a mounting process such as a solder reflow process. This has a significant effect on the reliability of the implementation.

【0007】本発明は、上記問題点を解決するものであ
り、実装工程でツームストーン現象の発生しない、実装
信頼性の高い小型のセラミック電子部品を提供すること
を目的とする。
An object of the present invention is to solve the above-mentioned problems, and an object of the present invention is to provide a small-sized ceramic electronic component having high mounting reliability and free from tombstone phenomenon in a mounting process.

【0008】[0008]

【課題を解決するための手段】上記目的を達成するため
に、本発明のセラミック電子部品は、長さ(L)≦1.
0mm、高さ(H)≦0.5mm、幅(W)≦0.5mmのセ
ラミック素子の長手方向両端面を含む両端側部分に外部
電極が配設された構造を有するセラミック電子部品にお
いて、前記セラミック素子の長手方向両端面から周囲面
に回り込む前記外部電極の肩部に曲率半径60μm以下
の丸み(R)をつけるとともに、前記外部電極のセラミ
ック素子の端面に形成された部分の略中央部に、その周
辺部との間に5〜35μmの段差が形成されるような突
出部を設けたことを特徴としている。
In order to achieve the above object, a ceramic electronic component according to the present invention has a length (L) ≦ 1.
A ceramic electronic component having a structure in which external electrodes are provided at both end portions including both end surfaces in a longitudinal direction of a ceramic element having a height of 0 mm, a height (H) of 0.5 mm, and a width (W) of 0.5 mm, A shoulder (R) having a radius of curvature of 60 μm or less is rounded at the shoulder of the external electrode extending from both end surfaces in the longitudinal direction to the peripheral surface of the ceramic element, and the external electrode is formed substantially at the center of a portion formed on the end face of the ceramic element. And a peripheral portion thereof is provided with a protruding portion for forming a step of 5 to 35 μm.

【0009】外部電極の肩部の丸み(R)が曲率半径6
0μm以下と小さいため、セラミック電子部品が立ち上
がりにくくなるとともに、セラミック素子の端面側の外
部電極の中央部に、周辺部との段差が5〜35μmの突
出部が形成されており、セラミック電子部品が立ち上が
りかけた場合、この突出部とその周辺部との段差部分
が、セラミック電子部品がそれ以上立ち上がることを抑
制する機能を果す。その結果、実装工程でツームストー
ン現象が発生することを効率よく、抑制、防止すること
が可能になり、実装信頼性を向上させることができる。
The roundness (R) of the shoulder of the external electrode has a radius of curvature of 6
Since the ceramic electronic component is difficult to stand up because it is as small as 0 μm or less, a protruding portion having a step difference of 5 to 35 μm from the peripheral portion is formed at the center of the external electrode on the end face side of the ceramic element. In the case of rising, the step between the protruding portion and the peripheral portion has a function of suppressing the ceramic electronic component from further rising. As a result, the occurrence of the tombstone phenomenon in the mounting process can be efficiently suppressed and prevented, and the mounting reliability can be improved.

【0010】また、本発明のセラミック電子部品は、前
記セラミック素子の両端側肩部が曲率半径25μm以上
の丸み(R)を有しており、かつ、前記外部電極の、前
記セラミック素子の端面に形成された部分の最大厚みが
40μm以下であることを特徴としている。
In the ceramic electronic component of the present invention, the shoulders on both ends of the ceramic element have a radius (R) of a radius of curvature of 25 μm or more, and the external electrode is provided on an end face of the ceramic element. The maximum thickness of the formed portion is not more than 40 μm.

【0011】このように、セラミック素子の両端側肩部
に曲率半径25μm以上の丸み(R)をもたせるととも
に、外部電極の、セラミック素子の端面に形成された部
分の最大厚みを40μm以下とすることにより、容易
に、外部電極の肩部に曲率半径60μm以下の丸み
(R)をもたせることが可能になるとともに、外部電極
の、セラミック素子の端面に形成された部分に、その周
辺部との段差が5〜35μmの突出部を形成することが
できるようになる。
As described above, the shoulders at both ends of the ceramic element are rounded (R) with a radius of curvature of 25 μm or more, and the maximum thickness of the external electrode formed on the end face of the ceramic element is 40 μm or less. Accordingly, the shoulder of the external electrode can easily have a roundness (R) having a radius of curvature of 60 μm or less, and a step formed between the peripheral portion of the external electrode and the portion formed on the end face of the ceramic element. Can form protrusions of 5 to 35 μm.

【0012】[0012]

【発明の実施の形態】以下、本発明の実施形態を示して
その特徴とするところをさらに詳しく説明する。なお、
この実施形態では、表面実装型の積層セラミックコンデ
ンサを例にとって説明する。
BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described, and features thereof will be described in more detail. In addition,
In this embodiment, a description will be given by taking a surface mount type multilayer ceramic capacitor as an example.

【0013】図1は本発明の一実施形態にかかる積層セ
ラミックコンデンサ(セラミック電子部品)の正面断面
図、図2はその平面図である。
FIG. 1 is a front sectional view of a multilayer ceramic capacitor (ceramic electronic component) according to an embodiment of the present invention, and FIG. 2 is a plan view thereof.

【0014】この実施形態の積層セラミックコンデンサ
5は、図1及び図2に示すように、内部にセラミック層
1を介して複数の容量形成用の電極(内部電極)2が互
いに対向するように積層、配設されたセラミック素子3
の両端側に外部電極4を配設した構造を有している。
As shown in FIGS. 1 and 2, a multilayer ceramic capacitor 5 of this embodiment has a plurality of electrodes (internal electrodes) 2 for forming a capacitance, which are interposed via a ceramic layer 1 inside. , Disposed ceramic element 3
Have external electrodes 4 disposed at both ends.

【0015】この積層セラミックコンデンサ5のセラミ
ック素子3の寸法は次の通りである。 長さ(L)=0.6mm 高さ(H)=0.3mm 幅(W) =0.3mm
The dimensions of the ceramic element 3 of the multilayer ceramic capacitor 5 are as follows. Length (L) = 0.6mm Height (H) = 0.3mm Width (W) = 0.3mm

【0016】また、セラミック素子3の端面3aと周囲
面3c(上下面、両側面など)との境界部である肩部
(エッジ部)3bには曲率半径が約30μmの丸み
(R)がつけられている。さらに、この積層セラミック
コンデンサ5の、セラミック素子3の長手方向両端面3
aから周囲面3cに回り込む部分である外部電極4の肩
部4bには曲率半径が約55μmの丸み(R)がつけら
れている。また、外部電極4のセラミック素子3の端面
3aに形成された部分4aの最大厚みtは約35μmで
あり、その略中央部には突出部10が形成されている。
そして、この突出部10とその周辺部11との間には約
25μmの段差Gが形成されている。
A shoulder (edge) 3b which is a boundary between the end surface 3a of the ceramic element 3 and the peripheral surface 3c (upper and lower surfaces, both side surfaces, etc.) is rounded (R) with a radius of curvature of about 30 μm. Have been. Further, both ends 3 of the multilayer ceramic capacitor 5 in the longitudinal direction of the ceramic element 3 are formed.
The shoulder 4b of the external electrode 4, which is a part that goes from the position a to the peripheral surface 3c, is rounded (R) with a radius of curvature of about 55 μm. The maximum thickness t of the portion 4a of the external electrode 4 formed on the end face 3a of the ceramic element 3 is about 35 μm, and a protrusion 10 is formed substantially at the center.
A step G of about 25 μm is formed between the protruding portion 10 and its peripheral portion 11.

【0017】上記のように構成された積層セラミックコ
ンデンサ(セラミック電子部品)5においては、セラミ
ック素子3の長手方向両端面3aから周囲面3cに回り
込む部分である外部電極4の肩部4bに曲率半径が約5
5μmの、従来より小さいRがつけられているため、は
んだリフロー工程においても積層セラミックコンデンサ
5が立ち上がりにくく、また、セラミック素子3の端面
3aに形成された外部電極部分4(4a)の略中央部
に、その周辺部11との段差Gが約25μmの突出部1
0が設けられているので、はんだリフロー工程において
積層セラミックコンデンサ5が立ち上がりかけても、突
出部10とその周辺部11との段差部分が、積層セラミ
ックコンデンサ5が立ち上がることを阻止する。その結
果、実装工程でツームストーン現象が発生することが効
率よく、抑制、防止され、実装信頼性が大幅に向上す
る。
In the multilayer ceramic capacitor (ceramic electronic component) 5 configured as described above, the radius of curvature is formed on the shoulder 4b of the external electrode 4, which is the portion that goes from the longitudinal end surfaces 3a of the ceramic element 3 to the peripheral surface 3c. Is about 5
Since the R of 5 μm, which is smaller than that of the prior art, is attached, the multilayer ceramic capacitor 5 is hard to rise even in the solder reflow process, and the center of the external electrode portion 4 (4a) formed on the end face 3a of the ceramic element 3 is formed. The protrusion 1 has a step G with the peripheral portion 11 of about 25 μm.
Since 0 is provided, even when the multilayer ceramic capacitor 5 rises in the solder reflow process, the step between the protrusion 10 and the peripheral portion 11 prevents the multilayer ceramic capacitor 5 from rising. As a result, the occurrence of the tombstone phenomenon in the mounting process is efficiently suppressed, prevented, and the mounting reliability is greatly improved.

【0018】また、この実施形態の積層セラミックコン
デンサ5においては、セラミック素子3の肩部3b及び
外部電極4の肩部4bに所定の丸み(R)をもたせてい
るので、積層セラミックコンデンサ5が他の部品などと
接触した場合に外部電極4が、その肩部(エッジ部)4
bで削られて断線することを防止することが可能にな
り、接続信頼性を向上させることができる。
In the multilayer ceramic capacitor 5 of this embodiment, the shoulder 3b of the ceramic element 3 and the shoulder 4b of the external electrode 4 have a predetermined radius (R). When the external electrode 4 comes into contact with a part or the like of the
This makes it possible to prevent the wire from being cut off by b, thereby improving the connection reliability.

【0019】なお、上記実施形態の積層セラミックコン
デンサ5においては、セラミック素子3の両端側肩部3
bに曲率半径が約30μmの丸みをもたせ、かつ、セラ
ミック素子3の端面3aに形成される外部電極4(4
a)の最大厚みtを約35μmとしているので、容易
に、セラミック素子3の長手方向両端面3aから周囲面
3cに回り込む外部電極4の肩部4bに曲率半径60μ
m以下の丸みをもたせるとともに、突出部10とその周
辺部11との間に所定の段差Gを形成することが可能に
なり、本発明をより実効あらしめることができる。
In the multilayer ceramic capacitor 5 of the above embodiment, both shoulders 3 of the ceramic element 3 are provided.
b is rounded with a radius of curvature of about 30 μm, and an external electrode 4 (4
Since the maximum thickness t of a) is set to about 35 μm, the radius of curvature of 60 μm is easily applied to the shoulder 4 b of the external electrode 4 wrapping from the longitudinal end faces 3 a to the peripheral face 3 c of the ceramic element 3.
m and a predetermined step G can be formed between the protruding portion 10 and the peripheral portion 11 thereof, so that the present invention can be made more effective.

【0020】表1に、本発明の積層セラミックコンデン
サ及び比較例の積層セラミックコンデンサについて調べ
た、外部電極の肩部の丸み(R)及び突出部とその周辺
部との段差Gと、ツームストーン現象の発生率の関係を
示す。
Table 1 shows the multilayer ceramic capacitor of the present invention and the multilayer ceramic capacitor of the comparative example. The roundness (R) of the shoulder portion of the external electrode, the step G between the protruding portion and its peripheral portion, and the tombstone phenomenon were examined. Shows the relationship between the occurrence rates.

【0021】[0021]

【表1】 [Table 1]

【0022】なお、表1において、試料番号に*印を付
したものは本発明の範囲外の比較例である。表1に示す
ように、外部電極の肩部のRが60μmを越える試料
(試料番号1,5)の場合、ツームストーン現象の発生
率が高くなっている。また、外部電極の肩部のRが60
μm以下の積層セラミックコンデンサ(試料番号2,
3,4,6,7,8)であっても、段差Gが40μm以
上である積層セラミックコンデンサ(試料番号2,6)
の場合にはツームストーン現象の発生率が高くなってい
る。さらに、外部電極の肩部の丸み(R)が60μm以
下であっても突出部の形成されていない試料(試料番号
3,7)の場合には、ツームストーン現象の発生率が高
くなっている。
In Table 1, samples marked with an asterisk (*) are comparative examples outside the scope of the present invention. As shown in Table 1, the rate of occurrence of the tombstone phenomenon is high in the samples (sample numbers 1 and 5) in which the R of the shoulder of the external electrode exceeds 60 μm. Also, R of the shoulder of the external electrode is 60
μm or smaller multilayer ceramic capacitor (Sample No. 2,
3, 4, 6, 7, 8), a multilayer ceramic capacitor having a step G of 40 μm or more (sample numbers 2, 6)
In the case of, the occurrence rate of the tombstone phenomenon is high. Furthermore, even if the roundness (R) of the shoulder of the external electrode is 60 μm or less, in the case of the sample having no protrusion (sample Nos. 3 and 7), the occurrence rate of the tombstone phenomenon is high. .

【0023】これに対して、外部電極の肩部の丸み
(R)が60μm以下、端面側に形成された外部電極の
最大厚みが40μm以下であって、周辺部との段差が3
0μmの突出部が形成された本発明の積層セラミックコ
ンデンサ(試料番号4,8)の場合、ツームストーン現
象の発生率が低くなっていることがわかる。
On the other hand, the roundness (R) of the shoulder of the external electrode is 60 μm or less, the maximum thickness of the external electrode formed on the end face side is 40 μm or less, and the step with the peripheral portion is 3 μm.
In the case of the multilayer ceramic capacitor of the present invention (Sample Nos. 4 and 8) in which the protrusion of 0 μm was formed, the occurrence rate of the tombstone phenomenon was low.

【0024】なお、上記実施形態では、積層セラミック
コンデンサを例にとって説明したが、本発明は積層セラ
ミックコンデンサに限られるものではなく、セラミック
素子の両端側に外部電極を備えた種々のセラミック電子
部品に適用することが可能である。
In the above embodiment, a multilayer ceramic capacitor has been described as an example. However, the present invention is not limited to a multilayer ceramic capacitor, but may be applied to various ceramic electronic components having external electrodes at both ends of a ceramic element. It is possible to apply.

【0025】本発明はさらにその他の点においても上記
実施形態に限定されるものではなく、セラミック素子の
具体的な寸法、形状、外部電極のパターン、外部電極に
形成される突出部の具体的な配設位置などに関し、発明
の要旨の範囲内において、種々の応用、変形を加えるこ
とが可能である。
The present invention is not limited to the above-described embodiment in other respects as well. Specific dimensions and shapes of the ceramic element, patterns of the external electrodes, and specific details of the projections formed on the external electrodes are not limited to those described above. Regarding the disposition position, various applications and modifications can be made within the scope of the invention.

【0026】[0026]

【発明の効果】上述のように、本発明のセラミック電子
部品は、セラミック電子部品を構成するセラミック素子
の長手方向両端面から周囲面に回り込む外部電極の肩部
に曲率半径60μm以下の丸み(R)をつけるととも
に、外部電極の、セラミック素子の端面に形成された部
分の略中央部に、その周辺部との段差が5〜35μmの
突出部を設けているので、例えば、実装時のはんだリフ
ロー工程においてセラミック電子部品が立ち上がりかけ
た場合にも、突出部とその周辺部との段差部分により、
セラミック電子部品が立ち上がることを抑制、防止する
ことが可能になり、実装工程でツームストーン現象が発
生することを効率よく、抑制、防止して実装信頼性を向
上させることができる。
As described above, the ceramic electronic component of the present invention has a roundness (R) having a radius of curvature of 60 μm or less at the shoulder of the external electrode extending from both longitudinal end surfaces of the ceramic element constituting the ceramic electronic component to the peripheral surface. ), And a protruding portion having a step difference of 5 to 35 μm from the peripheral portion is provided substantially at the center of the portion of the external electrode formed on the end face of the ceramic element. Even when the ceramic electronic component rises in the process, due to the step between the protruding part and its peripheral part,
The rise of the ceramic electronic component can be suppressed and prevented, and the occurrence of the tombstone phenomenon in the mounting process can be efficiently suppressed and prevented, and the mounting reliability can be improved.

【0027】また、セラミック素子の両端側肩部に曲率
半径25μm以上の丸み(R)をもたせるとともに、外
部電極の、セラミック素子の端面に形成された部分の最
大厚みを40μm以下とした場合、容易に、外部電極の
肩部に曲率半径60μm以下の丸み(R)をもたせるこ
とが可能になるとともに、外部電極のセラミック素子の
端面に形成された部分に、その周辺部との段差が5〜3
5μmの突出部を形成することが可能になり、本発明を
より実効あらしめることができる。
When the shoulders at both ends of the ceramic element are rounded with a radius of curvature of 25 μm or more (R) and the maximum thickness of the external electrode formed on the end face of the ceramic element is 40 μm or less, In addition, it is possible to make the shoulder of the external electrode have a radius (R) having a radius of curvature of 60 μm or less, and a step formed on the end face of the ceramic element of the external electrode by 5 to 3 from its peripheral portion.
A protrusion of 5 μm can be formed, and the present invention can be made more effective.

【0028】また、本発明のセラミック電子部品におい
ては、セラミック素子の肩部及び外部電極の肩部に所定
の丸み(R)をもたせているので、セラミック電子部品
が他の部品などと接触した場合に、外部電極がその肩部
で断線することを防止して接続信頼性を向上させること
ができる。
Further, in the ceramic electronic component of the present invention, the shoulder of the ceramic element and the shoulder of the external electrode have a predetermined radius (R), so that the ceramic electronic component may come into contact with other components. In addition, it is possible to prevent the external electrode from being disconnected at its shoulder, thereby improving connection reliability.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施形態にかかる積層セラミックコ
ンデンサ(セラミック電子部品)の正面断面図である。
FIG. 1 is a front sectional view of a multilayer ceramic capacitor (ceramic electronic component) according to an embodiment of the present invention.

【図2】本発明の一実施形態にかかる積層セラミックコ
ンデンサ(セラミック電子部品)の平面図である。
FIG. 2 is a plan view of the multilayer ceramic capacitor (ceramic electronic component) according to one embodiment of the present invention.

【図3】従来のセラミック電子部品を示す正面断面図で
ある。
FIG. 3 is a front sectional view showing a conventional ceramic electronic component.

【図4】従来のセラミック電子部品を示す平面図であ
る。
FIG. 4 is a plan view showing a conventional ceramic electronic component.

【図5】従来のセラミック電子部品の実装工程でツーム
ストーン現象が発生した状態を示す正面図である。
FIG. 5 is a front view showing a state in which a tombstone phenomenon has occurred in a conventional ceramic electronic component mounting process.

【符号の説明】[Explanation of symbols]

1 セラミック層 2 内部電極 3 セラミック素子 3a セラミック素子の端面 3b セラミック素子の肩部 3c セラミック素子の周囲面 4 外部電極 4a 外部電極のセラミック素子の端面
側に形成された部分 4b 外部電極の肩部 5 積層セラミックコンデンサ(セラ
ミック電子部品) 10 突出部 11 突出部の周辺部 G 段差
Reference Signs List 1 ceramic layer 2 internal electrode 3 ceramic element 3a end face of ceramic element 3b shoulder of ceramic element 3c peripheral face of ceramic element 4 external electrode 4a part formed on end face of ceramic element of external electrode 4b shoulder of external electrode 5 Multilayer ceramic capacitor (ceramic electronic component) 10 Projecting part 11 Peripheral part of projecting part G Step

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】長さ(L)≦1.0mm、高さ(H)≦0.
5mm、幅(W)≦0.5mmのセラミック素子の長手方向
両端面を含む両端側部分に外部電極が配設された構造を
有するセラミック電子部品において、 前記セラミック素子の長手方向両端面から周囲面に回り
込む前記外部電極の肩部に曲率半径60μm以下の丸み
(R)をつけるとともに、 前記外部電極のセラミック素子の端面に形成された部分
の略中央部に、その周辺部との間に5〜35μmの段差
が形成されるような突出部を設けたことを特徴とするセ
ラミック電子部品。
1. Length (L) ≦ 1.0 mm and height (H) ≦ 0.
A ceramic electronic component having a structure in which external electrodes are provided at both end portions including both ends in a longitudinal direction of a ceramic element having a width (W) of 0.5 mm and a width (W) ≦ 0.5 mm, wherein a peripheral surface is formed from both ends in a longitudinal direction of the ceramic element. A shoulder (R) having a radius of curvature of 60 μm or less is rounded at the shoulder of the external electrode, and the external electrode is formed at a substantially central portion of a portion formed on the end face of the ceramic element and between the peripheral portion and the central portion. A ceramic electronic component provided with a protrusion that forms a step of 35 μm.
【請求項2】前記セラミック素子の両端側肩部が曲率半
径25μm以上の丸み(R)を有しており、かつ、前記
外部電極の、前記セラミック素子の端面に形成された部
分の最大厚みが40μm以下であることを特徴とする請
求項1記載のセラミック電子部品。
2. The ceramic device according to claim 1, wherein shoulders at both ends of the ceramic element have a radius (R) having a radius of curvature of 25 μm or more, and a maximum thickness of a portion of the external electrode formed on an end face of the ceramic element is reduced. 2. The ceramic electronic component according to claim 1, wherein the thickness is 40 μm or less.
JP19554796A 1996-07-04 1996-07-04 Ceramic electronic components Expired - Lifetime JP3307234B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19554796A JP3307234B2 (en) 1996-07-04 1996-07-04 Ceramic electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19554796A JP3307234B2 (en) 1996-07-04 1996-07-04 Ceramic electronic components

Publications (2)

Publication Number Publication Date
JPH1022164A true JPH1022164A (en) 1998-01-23
JP3307234B2 JP3307234B2 (en) 2002-07-24

Family

ID=16342921

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19554796A Expired - Lifetime JP3307234B2 (en) 1996-07-04 1996-07-04 Ceramic electronic components

Country Status (1)

Country Link
JP (1) JP3307234B2 (en)

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