JPH0176100U - - Google Patents

Info

Publication number
JPH0176100U
JPH0176100U JP1987172349U JP17234987U JPH0176100U JP H0176100 U JPH0176100 U JP H0176100U JP 1987172349 U JP1987172349 U JP 1987172349U JP 17234987 U JP17234987 U JP 17234987U JP H0176100 U JPH0176100 U JP H0176100U
Authority
JP
Japan
Prior art keywords
chip
chip mounter
parts
chip parts
measuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987172349U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987172349U priority Critical patent/JPH0176100U/ja
Publication of JPH0176100U publication Critical patent/JPH0176100U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案のチツプマウンターを概略的に
説明するブロツク図、第2図はチツプマウンター
に内蔵される部品測定装置の斜視図である。 2……プリント基板、3……チツプマウンター
、5……リール、6……チツプ部品、10……測
定装置。
FIG. 1 is a block diagram schematically illustrating the chip mounter of the present invention, and FIG. 2 is a perspective view of a component measuring device built into the chip mounter. 2... Printed circuit board, 3... Chip mounter, 5... Reel, 6... Chip parts, 10... Measuring device.

Claims (1)

【実用新案登録請求の範囲】 (1) チツプ部品を基板に取付ける際に、先頭部
分の所定個数のチツプ部品の定数を測定するよう
にしたことを特徴とするチツプマウンター。 (2) 上記請求範囲(1)項のチツプマウンターは複
数個の連続包装されたチツプを基板に取付けるこ
とを特徴とする。
[Claims for Utility Model Registration] (1) A chip mounter characterized by measuring the constant of a predetermined number of chip parts at the top when mounting the chip parts on a board. (2) The chip mounter according to claim (1) above is characterized in that a plurality of continuously packaged chips are mounted on a substrate.
JP1987172349U 1987-11-11 1987-11-11 Pending JPH0176100U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987172349U JPH0176100U (en) 1987-11-11 1987-11-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987172349U JPH0176100U (en) 1987-11-11 1987-11-11

Publications (1)

Publication Number Publication Date
JPH0176100U true JPH0176100U (en) 1989-05-23

Family

ID=31464322

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987172349U Pending JPH0176100U (en) 1987-11-11 1987-11-11

Country Status (1)

Country Link
JP (1) JPH0176100U (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105309063A (en) * 2013-06-18 2016-02-03 富士机械制造株式会社 Mounting management device, mounting processing device, mounting system, mounting management method and mounting processing method
JP2017026325A (en) * 2015-07-15 2017-02-02 富士機械製造株式会社 Inspection device
US10509069B2 (en) 2015-07-15 2019-12-17 Fuji Corporation Inspection device
WO2020017019A1 (en) * 2018-07-20 2020-01-23 株式会社Fuji Measurement device
US10551410B2 (en) 2015-07-15 2020-02-04 Fuji Corporation Inspection device
JP2020098904A (en) * 2015-07-15 2020-06-25 株式会社Fuji Electrical characteristic acquisition method and component mounting method

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105309063A (en) * 2013-06-18 2016-02-03 富士机械制造株式会社 Mounting management device, mounting processing device, mounting system, mounting management method and mounting processing method
JPWO2014203331A1 (en) * 2013-06-18 2017-02-23 富士機械製造株式会社 Mounting management device, mounting processing device, mounting system, mounting management method and mounting processing method
US10182520B2 (en) 2013-06-18 2019-01-15 Fuji Corporation Mounting management device, mounting process device, mounting system, mounting management method, and mounting process method
JP2017026325A (en) * 2015-07-15 2017-02-02 富士機械製造株式会社 Inspection device
US10509069B2 (en) 2015-07-15 2019-12-17 Fuji Corporation Inspection device
US10551410B2 (en) 2015-07-15 2020-02-04 Fuji Corporation Inspection device
JP2020098904A (en) * 2015-07-15 2020-06-25 株式会社Fuji Electrical characteristic acquisition method and component mounting method
WO2020017019A1 (en) * 2018-07-20 2020-01-23 株式会社Fuji Measurement device
JPWO2020017019A1 (en) * 2018-07-20 2021-07-15 株式会社Fuji measuring device

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