JPS6226097U - - Google Patents
Info
- Publication number
- JPS6226097U JPS6226097U JP11582385U JP11582385U JPS6226097U JP S6226097 U JPS6226097 U JP S6226097U JP 11582385 U JP11582385 U JP 11582385U JP 11582385 U JP11582385 U JP 11582385U JP S6226097 U JPS6226097 U JP S6226097U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- shield plate
- board
- basic lattice
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図は本考案の一実施例を示す側面図、第２
図はシールド板を示す平面図、第３図は本考案を
電子回路ユニツトに適用した正面図、第４図は従
来装置を示す側面図、第５図は従来装置を電子回
路ユニツトに適用した正面図である。
１１……印刷配線板、１２……電子部品、１３
……電子部品リード、１４……シールド板、１４
ａ……開孔、１５……シエルク。
Figure 1 is a side view showing one embodiment of the present invention;
The figure is a plan view showing the shield plate, Figure 3 is a front view of the present invention applied to an electronic circuit unit, Figure 4 is a side view of a conventional device, and Figure 5 is a front view of the conventional device applied to an electronic circuit unit. It is a diagram. 11...Printed wiring board, 12...Electronic component, 13
...Electronic component lead, 14...Shield plate, 14
a... open hole, 15... shield.
Claims (1)
突出する前記電子部品のリードを覆いかつ前記印
刷配線板に平行に設けられたシールド板とから成
る電子回路パツケージ構造において、 前記シールド板は、前記印刷配線板の基本格子
と同一ピツチで縦横に配列されかつ電子部品のリ
ード径より大きい多数の開孔を有するシールド部
材を用い、 このシールド板の開孔が印刷配線板の基本格子
と対向し、かつ、これら両板の間隔を印刷配線板
下方に突出するリード長とほぼ同等ならしめた電
子回路パツケージ構造。[Claims for Utility Model Registration] An electronic circuit package structure consisting of a printed wiring board on which electronic components are mounted, and a shield plate that covers the leads of the electronic components protruding from the back surface and is provided in parallel to the printed wiring board. The shield plate uses a shield member having a large number of openings arranged vertically and horizontally at the same pitch as the basic lattice of the printed wiring board and larger than the lead diameter of the electronic component, and the openings of the shield plate are arranged in the same pitch as the basic lattice of the printed wiring board. An electronic circuit package structure in which the basic lattice of the board faces the board, and the distance between the two boards is approximately equal to the length of the leads projecting downward from the printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11582385U JPH0337272Y2 (en) | 1985-07-30 | 1985-07-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11582385U JPH0337272Y2 (en) | 1985-07-30 | 1985-07-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6226097U true JPS6226097U (en) | 1987-02-17 |
| JPH0337272Y2 JPH0337272Y2 (en) | 1991-08-07 |
Family
ID=30999838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11582385U Expired JPH0337272Y2 (en) | 1985-07-30 | 1985-07-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0337272Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012174793A (en) * | 2011-02-18 | 2012-09-10 | Sony Corp | Circuit board and electronic apparatus |
-
1985
- 1985-07-30 JP JP11582385U patent/JPH0337272Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012174793A (en) * | 2011-02-18 | 2012-09-10 | Sony Corp | Circuit board and electronic apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0337272Y2 (en) | 1991-08-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6226097U (en) | ||
| JPH0176100U (en) | ||
| JPS58183013U (en) | Structure of multi-function control panel | |
| JPS5914385U (en) | Unit for electronic communication equipment | |
| JPS6395296U (en) | ||
| JPS6240868U (en) | ||
| JPH033799U (en) | ||
| JPS59143064U (en) | Parts mounting holder | |
| JPS58116264U (en) | Insulator | |
| JPS6185184U (en) | ||
| JPS5939960U (en) | printed wiring board | |
| JPH01108947U (en) | ||
| JPS59127270U (en) | printed circuit board equipment | |
| JPS61190187U (en) | ||
| JPS62109479U (en) | ||
| JPS6444682U (en) | ||
| JPS6252987U (en) | ||
| JPS5877054U (en) | Heat sink mounting device | |
| JPS6413762U (en) | ||
| JPS58138371U (en) | Parts mounting holder | |
| JPS6433748U (en) | ||
| JPS58193667U (en) | Parts mounting device | |
| JPS59128798U (en) | Board mounting structure for electronic devices | |
| JPS63153279U (en) | ||
| JPS62154675U (en) |