JPS62147359U - - Google Patents

Info

Publication number
JPS62147359U
JPS62147359U JP3606586U JP3606586U JPS62147359U JP S62147359 U JPS62147359 U JP S62147359U JP 3606586 U JP3606586 U JP 3606586U JP 3606586 U JP3606586 U JP 3606586U JP S62147359 U JPS62147359 U JP S62147359U
Authority
JP
Japan
Prior art keywords
package
connecting member
protruding outward
semiconductor chip
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3606586U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3606586U priority Critical patent/JPS62147359U/ja
Publication of JPS62147359U publication Critical patent/JPS62147359U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例を示す半導体装置の
斜視図、第2図は従来の半導体装置の斜視図、第
3図及び第4図は従来の半導体装置の部分図、第
5図は第1図の実装状態を示す図である。 11……パツケージ、12……リード、13…
…連結部材、20……プリント基板、21……配
線パターン、22……半田層。
FIG. 1 is a perspective view of a semiconductor device showing an embodiment of the present invention, FIG. 2 is a perspective view of a conventional semiconductor device, FIGS. 3 and 4 are partial views of a conventional semiconductor device, and FIG. FIG. 2 is a diagram showing the mounting state of FIG. 1; 11...package, 12...lead, 13...
... Connecting member, 20 ... Printed circuit board, 21 ... Wiring pattern, 22 ... Solder layer.

Claims (1)

【実用新案登録請求の範囲】 半導体チツプを収納したパツケージと、該パツ
ケージに固定され一端部が前記半導体チツプに接
続され他端部が該パツケージから外側に突出する
複数本のリードとを具え、前記パツケージから外
側に突出する各リードにおける被固定部材上に接
続される部分を、連結部材で相互に連結した半導
体装置において、 前記連結部材は、接続用の低融点金属で構成し
たことを特徴とする半導体装置。
[Claims for Utility Model Registration] A package containing a semiconductor chip, and a plurality of leads fixed to the package and having one end connected to the semiconductor chip and the other end protruding outward from the package, A semiconductor device in which the parts of each lead protruding outward from the package that are connected to the fixed member are interconnected by a connecting member, characterized in that the connecting member is made of a low-melting metal for connection. Semiconductor equipment.
JP3606586U 1986-03-12 1986-03-12 Pending JPS62147359U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3606586U JPS62147359U (en) 1986-03-12 1986-03-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3606586U JPS62147359U (en) 1986-03-12 1986-03-12

Publications (1)

Publication Number Publication Date
JPS62147359U true JPS62147359U (en) 1987-09-17

Family

ID=30846129

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3606586U Pending JPS62147359U (en) 1986-03-12 1986-03-12

Country Status (1)

Country Link
JP (1) JPS62147359U (en)

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