JPS62147359U - - Google Patents
Info
- Publication number
- JPS62147359U JPS62147359U JP3606586U JP3606586U JPS62147359U JP S62147359 U JPS62147359 U JP S62147359U JP 3606586 U JP3606586 U JP 3606586U JP 3606586 U JP3606586 U JP 3606586U JP S62147359 U JPS62147359 U JP S62147359U
- Authority
- JP
- Japan
- Prior art keywords
- package
- connecting member
- protruding outward
- semiconductor chip
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第1図は本考案の一実施例を示す半導体装置の
斜視図、第2図は従来の半導体装置の斜視図、第
3図及び第4図は従来の半導体装置の部分図、第
5図は第1図の実装状態を示す図である。
11……パツケージ、12……リード、13…
…連結部材、20……プリント基板、21……配
線パターン、22……半田層。
FIG. 1 is a perspective view of a semiconductor device showing an embodiment of the present invention, FIG. 2 is a perspective view of a conventional semiconductor device, FIGS. 3 and 4 are partial views of a conventional semiconductor device, and FIG. FIG. 2 is a diagram showing the mounting state of FIG. 1; 11...package, 12...lead, 13...
... Connecting member, 20 ... Printed circuit board, 21 ... Wiring pattern, 22 ... Solder layer.
Claims (1)
ケージに固定され一端部が前記半導体チツプに接
続され他端部が該パツケージから外側に突出する
複数本のリードとを具え、前記パツケージから外
側に突出する各リードにおける被固定部材上に接
続される部分を、連結部材で相互に連結した半導
体装置において、 前記連結部材は、接続用の低融点金属で構成し
たことを特徴とする半導体装置。[Claims for Utility Model Registration] A package containing a semiconductor chip, and a plurality of leads fixed to the package and having one end connected to the semiconductor chip and the other end protruding outward from the package, A semiconductor device in which the parts of each lead protruding outward from the package that are connected to the fixed member are interconnected by a connecting member, characterized in that the connecting member is made of a low-melting metal for connection. Semiconductor equipment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3606586U JPS62147359U (en) | 1986-03-12 | 1986-03-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3606586U JPS62147359U (en) | 1986-03-12 | 1986-03-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62147359U true JPS62147359U (en) | 1987-09-17 |
Family
ID=30846129
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3606586U Pending JPS62147359U (en) | 1986-03-12 | 1986-03-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62147359U (en) |
-
1986
- 1986-03-12 JP JP3606586U patent/JPS62147359U/ja active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS62147359U (en) | ||
JPH0176100U (en) | ||
JPH0217854U (en) | ||
JPS6338368U (en) | ||
JPS61136576U (en) | ||
JPH01121945U (en) | ||
JPH0184460U (en) | ||
JPS6247171U (en) | ||
JPS6228474U (en) | ||
JPS62197881U (en) | ||
JPH0167725U (en) | ||
JPS60169849U (en) | Integrated circuit mounting structure | |
JPH01112077U (en) | ||
JPS6278784U (en) | ||
JPH02131675U (en) | ||
JPH0320463U (en) | ||
JPS60130672U (en) | printed wiring board | |
JPS6217179U (en) | ||
JPS63105354U (en) | ||
JPS6437079U (en) | ||
JPS6273549U (en) | ||
JPS62140771U (en) | ||
JPS6094861U (en) | printed circuit device | |
JPS62184776U (en) | ||
JPS5965563U (en) | printed wiring board |