JPH03124659U - - Google Patents

Info

Publication number
JPH03124659U
JPH03124659U JP3377290U JP3377290U JPH03124659U JP H03124659 U JPH03124659 U JP H03124659U JP 3377290 U JP3377290 U JP 3377290U JP 3377290 U JP3377290 U JP 3377290U JP H03124659 U JPH03124659 U JP H03124659U
Authority
JP
Japan
Prior art keywords
semiconductor device
taken out
leads
package
twisted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3377290U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3377290U priority Critical patent/JPH03124659U/ja
Publication of JPH03124659U publication Critical patent/JPH03124659U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の実施例の要部斜視図、第2図
は本考案の他の実施例の要部斜視図、第3図は従
来例で一部省略したQFPタイプのパツケージの
斜視図で、第4図はその平面図、第5図は従来例
の要部斜視図である。 1……QFPパツケージ、2……QFPリード
ピン、3……PWBパターン、4……リード間隔
Fig. 1 is a perspective view of a main part of an embodiment of the present invention, Fig. 2 is a perspective view of a main part of another embodiment of the present invention, and Fig. 3 is a perspective view of a QFP type package of a conventional example with some parts omitted. FIG. 4 is a plan view thereof, and FIG. 5 is a perspective view of essential parts of the conventional example. 1...QFP package, 2...QFP lead pin, 3...PWB pattern, 4...lead spacing.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ICパツケージより取り出されたリードをプリ
ント基板側の配線パターンに接続することにより
実装される半導体装置において、水平に取り出さ
れたリードのうちの少なくとも一部のものが、少
なくとも一箇所で90°ねじられていることを特
徴とする半導体装置。
In a semiconductor device that is mounted by connecting leads taken out from an IC package to a wiring pattern on a printed circuit board, at least some of the horizontally taken out leads are twisted by 90 degrees at at least one place. A semiconductor device characterized by:
JP3377290U 1990-03-29 1990-03-29 Pending JPH03124659U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3377290U JPH03124659U (en) 1990-03-29 1990-03-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3377290U JPH03124659U (en) 1990-03-29 1990-03-29

Publications (1)

Publication Number Publication Date
JPH03124659U true JPH03124659U (en) 1991-12-17

Family

ID=31537698

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3377290U Pending JPH03124659U (en) 1990-03-29 1990-03-29

Country Status (1)

Country Link
JP (1) JPH03124659U (en)

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