JPH02113344U - - Google Patents
Info
- Publication number
- JPH02113344U JPH02113344U JP2261989U JP2261989U JPH02113344U JP H02113344 U JPH02113344 U JP H02113344U JP 2261989 U JP2261989 U JP 2261989U JP 2261989 U JP2261989 U JP 2261989U JP H02113344 U JPH02113344 U JP H02113344U
- Authority
- JP
- Japan
- Prior art keywords
- resin container
- semiconductor chip
- surface mount
- leads
- mount component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例を示す平面図、第２
図は第１図の実施例を装着する回路基板の一例を
示す平面図、第３図は第２図の回路基板に第１図
の実施例を正しく装着した場合の平面図、第４図
は第２図の回路基板に第１図の実施例を誤つて装
着した場合の平面図、第５図ａおよびｂは従来の
表面実装部品を回路基板に装着した状態の一例を
示す平面図および正面図である。
１，１１……部品本体、２，１２……リード、
３，１３……リード番号印、４，１４……回路基
板、５，１５……パターン。
Figure 1 is a plan view showing one embodiment of the present invention;
The figure is a plan view showing an example of a circuit board on which the embodiment shown in Fig. 1 is mounted, Fig. 3 is a plan view when the embodiment shown in Fig. 1 is correctly mounted on the circuit board shown in Fig. 2, and Fig. 4 is a plan view showing an example of the circuit board on which the embodiment shown in Fig. 1 is mounted. FIG. 2 is a plan view of the embodiment shown in FIG. 1 being mistakenly attached to the circuit board, and FIGS. It is a diagram. 1, 11... Part body, 2, 12... Lead,
3, 13... Lead number mark, 4, 14... Circuit board, 5, 15... Pattern.
Claims (1)
た部品本体と、前記樹脂容器の各辺に等間隔に設
けられ前記半導体チツプの電極と接続する複数個
のリードとを備える表面実装部品において、前記
リードを前記樹脂容器の各辺の中心線に対して非
対称の位置に設けたことを特徴とする表面実装部
品。 The surface mount component includes a component body in which a semiconductor chip is sealed in a rectangular resin container, and a plurality of leads provided at equal intervals on each side of the resin container and connected to electrodes of the semiconductor chip. A surface mount component characterized in that the leads are provided at positions asymmetrical with respect to the center line of each side of the resin container.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2261989U JPH02113344U (en) | 1989-02-27 | 1989-02-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2261989U JPH02113344U (en) | 1989-02-27 | 1989-02-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02113344U true JPH02113344U (en) | 1990-09-11 |
Family
ID=31240894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2261989U Pending JPH02113344U (en) | 1989-02-27 | 1989-02-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02113344U (en) |
-
1989
- 1989-02-27 JP JP2261989U patent/JPH02113344U/ja active Pending