JPS6196568U - - Google Patents
Info
- Publication number
- JPS6196568U JPS6196568U JP18171184U JP18171184U JPS6196568U JP S6196568 U JPS6196568 U JP S6196568U JP 18171184 U JP18171184 U JP 18171184U JP 18171184 U JP18171184 U JP 18171184U JP S6196568 U JPS6196568 U JP S6196568U
- Authority
- JP
- Japan
- Prior art keywords
- insulating base
- base material
- mounting
- pattern
- identification pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 description 3
- 229910052715 tantalum Inorganic materials 0.000 description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 3
- 239000003985 ceramic capacitor Substances 0.000 description 2
Description
第１図は本考案の一実施例を示す平面図、第２
図は第１図に示す一実施例に部品実装した例を示
す平面図、第３図ａ，ｂ，ｃ、第４図ａ，ｂは識
別パターンの別の実施例を示す正面図である。
１…絶縁基材、２…端子実装用パターン、３…
平面実装型トランジスタ／ダイオード共用パター
ン、４…セラミツクコンデンサ実装用パターン、
５…ＩＣ実装用パターン、６…ＩＣ実装用方向識
別パターン、７…タンタル・コンデンサ実装用パ
ターン、８…タンタルコンデンサ実装用方向識別
パターン、３０…平面実装型トランジスタ／ダイ
オード、４０…セラミツク・コンデンサ、５０…
ＩＣ、７０…タンタルコンデンサ。
Figure 1 is a plan view showing one embodiment of the present invention;
The figure is a plan view showing an example in which components are mounted on the embodiment shown in FIG. 1, and FIGS. 3a, b, and c and FIGS. 4a and b are front views showing other embodiments of the identification pattern. 1... Insulating base material, 2... Terminal mounting pattern, 3...
Planar mount transistor/diode shared pattern, 4...Ceramic capacitor mounting pattern,
5... Pattern for IC mounting, 6... Direction identification pattern for IC mounting, 7... Pattern for tantalum capacitor mounting, 8... Direction identification pattern for tantalum capacitor mounting, 30... Planar mount transistor/diode, 40... Ceramic capacitor, 50...
IC, 70...Tantalum capacitor.
Claims (1)
回路パターンと同材料を使用して、前記絶縁基板
材上に部品実装する際の実装方向識別パターンを
設けたことを特徴とする混成集積回路基板。 A hybrid integrated circuit board characterized in that the same material as the circuit elements or circuit patterns to be printed and arranged on the insulating base material is used to provide a mounting direction identification pattern for mounting components on the insulating base material. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18171184U JPS6196568U (en) | 1984-11-30 | 1984-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18171184U JPS6196568U (en) | 1984-11-30 | 1984-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6196568U true JPS6196568U (en) | 1986-06-21 |
Family
ID=30739252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18171184U Pending JPS6196568U (en) | 1984-11-30 | 1984-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6196568U (en) |
-
1984
- 1984-11-30 JP JP18171184U patent/JPS6196568U/ja active Pending