JPH0249140U - - Google Patents

Info

Publication number
JPH0249140U
JPH0249140U JP12774388U JP12774388U JPH0249140U JP H0249140 U JPH0249140 U JP H0249140U JP 12774388 U JP12774388 U JP 12774388U JP 12774388 U JP12774388 U JP 12774388U JP H0249140 U JPH0249140 U JP H0249140U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
lead
semiconductor device
external lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12774388U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12774388U priority Critical patent/JPH0249140U/ja
Publication of JPH0249140U publication Critical patent/JPH0249140U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例にかかる半導体装置
の一部破断斜視図、第２図は第１図の半導体装置
の−断面図、第３図は同実施例に使用される
アイランド部と外部導出リードの斜視図、第４図
は本考案の他の実施例の半導体装置に使用される
アイランド部と外部導出リードの斜視図、第５図
は従来の半導体装置の一部破断斜視図である。 １……半導体ペレツト、２……プリント基板、
５……導電パターン、８……樹脂モールドパツケ
ージ、３１，３３……アイランド部、３１ａ，３
３ａ……凹部、７１……外部導出リード、７２，
７３……一端を延設した外部導出リード、７２ａ
，７３ａ……一端。 FIG. 1 is a partially cutaway perspective view of a semiconductor device according to an embodiment of the present invention, FIG. 2 is a sectional view of the semiconductor device of FIG. 1, and FIG. 3 is an island portion used in the embodiment. FIG. 4 is a perspective view of an island portion and external leads used in a semiconductor device according to another embodiment of the present invention, and FIG. 5 is a partially cutaway perspective view of a conventional semiconductor device. be. 1... Semiconductor pellet, 2... Printed circuit board,
5... Conductive pattern, 8... Resin mold package, 31, 33... Island portion, 31a, 3
3a... recess, 71... external lead-out lead, 72,
73...External lead-out lead with one end extended, 72a
, 73a... one end.

Claims (1)

【実用新案登録請求の範囲】 複数の半導体ペレツトがマウントされたプリン
ト基板をアイランド部に貼り合わせ、外部導出リ
ードと上記プリント基板の導電パターンとをワイ
ヤボンデイングした後樹脂モールドパツケージン
グしてなる半導体装置において、 上記アイランド部に外部導出リードに対応する
凹部を形成し、該凹部に上記外部導出リードの延
設された一端を進入させてアイランド部およびプ
リント基板の少なくとも一方と近接かつ絶縁して
接着したことを特徴とする半導体装置。[Scope of Claim for Utility Model Registration] A semiconductor device obtained by bonding a printed circuit board on which a plurality of semiconductor pellets are mounted to an island portion, wire bonding the external lead and the conductive pattern of the printed circuit board, and then resin mold packaging. A recess corresponding to the external lead-out lead is formed in the island part, and one extended end of the external lead-out lead is inserted into the recess and adhered in close proximity to and insulated from at least one of the island part and the printed circuit board. A semiconductor device characterized by:
JP12774388U 1988-09-29 1988-09-29 Pending JPH0249140U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12774388U JPH0249140U (en) 1988-09-29 1988-09-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12774388U JPH0249140U (en) 1988-09-29 1988-09-29

Publications (1)

Publication Number Publication Date
JPH0249140U true JPH0249140U (en) 1990-04-05

Family

ID=31380445

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12774388U Pending JPH0249140U (en) 1988-09-29 1988-09-29

Country Status (1)

Country Link
JP (1) JPH0249140U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04136484A (en) * 1990-09-28 1992-05-11 Matsushita Electric Ind Co Ltd Electronic ignitor
JP2006253681A (en) * 2005-03-07 2006-09-21 Agere Systems Inc Integrated circuit package
US7230320B2 (en) 2003-02-18 2007-06-12 Hitachi, Ltd. Electronic circuit device with reduced breaking and cracking
JP2008066457A (en) * 2006-09-06 2008-03-21 Asmo Co Ltd Connector integrated semiconductor module for controlling motor for motorcar

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04136484A (en) * 1990-09-28 1992-05-11 Matsushita Electric Ind Co Ltd Electronic ignitor
US7230320B2 (en) 2003-02-18 2007-06-12 Hitachi, Ltd. Electronic circuit device with reduced breaking and cracking
JP2006253681A (en) * 2005-03-07 2006-09-21 Agere Systems Inc Integrated circuit package
JP2008066457A (en) * 2006-09-06 2008-03-21 Asmo Co Ltd Connector integrated semiconductor module for controlling motor for motorcar
JP4745925B2 (en) * 2006-09-06 2011-08-10 アスモ株式会社 Connector integrated semiconductor module for automotive motor control

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