JPS63153551U - - Google Patents
Info
- Publication number
- JPS63153551U JPS63153551U JP4558987U JP4558987U JPS63153551U JP S63153551 U JPS63153551 U JP S63153551U JP 4558987 U JP4558987 U JP 4558987U JP 4558987 U JP4558987 U JP 4558987U JP S63153551 U JPS63153551 U JP S63153551U
- Authority
- JP
- Japan
- Prior art keywords
- periphery
- lead terminals
- flat package
- reinforced
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Description
第１図は本考案の一実施例の実装の縦断面図、
第２図はその平面図である。
１……フラツトパツケージ型ＩＣ、２……リー
ド端子、３……リード端子接続部、４……はんだ
箔、５……配線パターン、６……プリント基板。
FIG. 1 is a vertical cross-sectional view of an implementation of an embodiment of the present invention.
FIG. 2 is a plan view thereof. DESCRIPTION OF SYMBOLS 1... Flat package type IC, 2... Lead terminal, 3... Lead terminal connection part, 4... Solder foil, 5... Wiring pattern, 6... Printed circuit board.
Claims (1)
の周囲にＺ型よりなる外部接続用のリード端子を
有するフラツトパツケージ型ＩＣにおいて、周囲
の各面毎にそれらのリード端子をまとめてはんだ
箔で包んで１体としたことを特徴とする補強端子
型フラツトパツケージ。 In a flat package IC, which has a semiconductor chip molded with molding resin and has Z-shaped lead terminals for external connection around the periphery, the lead terminals are wrapped together in solder foil on each side of the periphery. Reinforced terminal type flat package cage featuring a reinforced body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4558987U JPS63153551U (en) | 1987-03-30 | 1987-03-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4558987U JPS63153551U (en) | 1987-03-30 | 1987-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63153551U true JPS63153551U (en) | 1988-10-07 |
Family
ID=30864461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4558987U Pending JPS63153551U (en) | 1987-03-30 | 1987-03-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63153551U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003045509A (en) * | 2001-08-01 | 2003-02-14 | Tokai Rika Co Ltd | Mounting method of connector on printed circuit board and connector |
-
1987
- 1987-03-30 JP JP4558987U patent/JPS63153551U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003045509A (en) * | 2001-08-01 | 2003-02-14 | Tokai Rika Co Ltd | Mounting method of connector on printed circuit board and connector |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS63153551U (en) | ||
| JPH0249140U (en) | ||
| JPS6316178U (en) | ||
| JPH0292936U (en) | ||
| JPH03128952U (en) | ||
| JPS63128745U (en) | ||
| JPH0350348U (en) | ||
| JPS62168657U (en) | ||
| JPH0334242U (en) | ||
| JPS61111160U (en) | ||
| JPH0328748U (en) | ||
| JPS614436U (en) | Packages for semiconductor devices | |
| JPS6249790U (en) | ||
| JPS5991751U (en) | Resin-encapsulated semiconductor integrated circuit device | |
| JPH0241447U (en) | ||
| JPS59111051U (en) | Hybrid integrated circuit device | |
| JPS64332U (en) | ||
| JPS63180936U (en) | ||
| JPH0295247U (en) | ||
| JPH0345U (en) | ||
| JPS63191673U (en) | ||
| JPH0197560U (en) | ||
| JPH04743U (en) | ||
| JPS6389253U (en) | ||
| JPH02113344U (en) |