JPS6316178U - - Google Patents
Info
- Publication number
- JPS6316178U JPS6316178U JP11045086U JP11045086U JPS6316178U JP S6316178 U JPS6316178 U JP S6316178U JP 11045086 U JP11045086 U JP 11045086U JP 11045086 U JP11045086 U JP 11045086U JP S6316178 U JPS6316178 U JP S6316178U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- circuit board
- printed circuit
- information card
- board serving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Description
第１図は本考案の一実施例を示す斜視図的説明
図、第２図は半導体素子の埋設塔載部分の拡大断
面図、第３図はホール部分の拡大断面図である。
１……カード本体（プリント基板）、２……外
部端子、３……パターン、４……半導体素子、５
……ホール、６……樹脂モールド封止体、１２…
…半田。
FIG. 1 is an explanatory perspective view showing an embodiment of the present invention, FIG. 2 is an enlarged sectional view of a portion where a semiconductor element is buried, and FIG. 3 is an enlarged sectional view of a hole portion. 1... Card body (printed circuit board), 2... External terminal, 3... Pattern, 4... Semiconductor element, 5
...Hole, 6...Resin mold sealing body, 12...
…solder.
Claims (1)
子が実装された構成を特徴とする情報カード。 ２ 前記半導体素子がカード本体としてのプリン
ト基板に取り外し可能として埋設塔載された実用
新案登録請求の範囲第１項記載の情報カード。 ３ 前記半導体素子が樹脂モールド封止体となつ
ている実用新案登録請求の範囲第１項記載の情報
カード。[Claims for Utility Model Registration] 1. An information card characterized by a configuration in which a semiconductor element is mounted on a printed circuit board serving as the card body. 2. The information card according to claim 1, wherein the semiconductor element is removably embedded in a printed circuit board serving as a card body. 3. The information card according to claim 1, wherein the semiconductor element is a resin molded encapsulation body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11045086U JPS6316178U (en) | 1986-07-18 | 1986-07-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11045086U JPS6316178U (en) | 1986-07-18 | 1986-07-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6316178U true JPS6316178U (en) | 1988-02-02 |
Family
ID=30989460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11045086U Pending JPS6316178U (en) | 1986-07-18 | 1986-07-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6316178U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63192072U (en) * | 1987-05-30 | 1988-12-12 | ||
| JPH02212196A (en) * | 1989-02-13 | 1990-08-23 | Sony Corp | Information card |
-
1986
- 1986-07-18 JP JP11045086U patent/JPS6316178U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63192072U (en) * | 1987-05-30 | 1988-12-12 | ||
| JPH02212196A (en) * | 1989-02-13 | 1990-08-23 | Sony Corp | Information card |