JPS6196566U - - Google Patents
Info
- Publication number
- JPS6196566U JPS6196566U JP18036084U JP18036084U JPS6196566U JP S6196566 U JPS6196566 U JP S6196566U JP 18036084 U JP18036084 U JP 18036084U JP 18036084 U JP18036084 U JP 18036084U JP S6196566 U JPS6196566 U JP S6196566U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- attached
- chip component
- outer frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 239000004416 thermosoftening plastic Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案一実施例の印刷配線基板のチツ
プ部品の取付け状態を示す断面図、第２図は第１
図の印刷配線基板のチツプ部品取付け前の状態の
平面図、第３図は従来例の印刷配線基板のチツプ
部品取付け状態を示す。
１…印刷配線基板、２…チツプ部品、３…（チ
ツプ部品の）電極端子、４…電極パターン、５…
半田、６…符号、７…外形枠体。
FIG. 1 is a sectional view showing how chip components are attached to a printed wiring board according to an embodiment of the present invention, and FIG.
FIG. 3 is a plan view of the printed wiring board in a state before chip components are attached, and FIG. 3 shows a state in which chip components are attached to a conventional printed wiring board. DESCRIPTION OF SYMBOLS 1... Printed wiring board, 2... Chip component, 3... Electrode terminal (of chip component), 4... Electrode pattern, 5...
Solder, 6... Code, 7... External frame.
Claims (1)
極パターン間に熱可塑性または、溶剤可溶性の接
着剤からなるチツプ部品の取付け位置を表示する
外形枠体を付着させたことを特徴とする印刷配線
基板。 (2) 前記外形枠体内に取付け部品名を表示する
符号を前記接着剤で付着させたことを特徴とする
実用新案登録請求の範囲第１項記載の印刷配線基
板。[Claims for Utility Model Registration] (1) An outer frame made of thermoplastic or solvent-soluble adhesive that indicates the mounting position of the chip component is attached between the electrode patterns of the printed wiring board to which the chip component is connected. A printed wiring board characterized by: (2) The printed wiring board according to claim 1, which is a registered utility model, characterized in that a code indicating the name of an attached part is attached within the outer frame using the adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18036084U JPS6196566U (en) | 1984-11-28 | 1984-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18036084U JPS6196566U (en) | 1984-11-28 | 1984-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6196566U true JPS6196566U (en) | 1986-06-21 |
Family
ID=30737918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18036084U Pending JPS6196566U (en) | 1984-11-28 | 1984-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6196566U (en) |
-
1984
- 1984-11-28 JP JP18036084U patent/JPS6196566U/ja active Pending
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