JPS63132439U - - Google Patents
Info
- Publication number
- JPS63132439U JPS63132439U JP2513987U JP2513987U JPS63132439U JP S63132439 U JPS63132439 U JP S63132439U JP 2513987 U JP2513987 U JP 2513987U JP 2513987 U JP2513987 U JP 2513987U JP S63132439 U JPS63132439 U JP S63132439U
- Authority
- JP
- Japan
- Prior art keywords
- frame part
- leads
- view
- intermediate leads
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案に係る半導体装置の実施例を示
す平面図、第２図は同断面図、第３図及び第４図
はリードフレームの平面図、第５図はリードフレ
ームの部分拡大図、第６図は成型金型の斜視図、
第７図はトランスフアモールド工程を示す説明図
、第８図は測定器を示す斜視図、第９図は半導体
装置の変形例を示す平面図、第１０図は変形例の
拡大図、第１１図は従来例を示す斜視図、第１２
図は従来の実装状態を示す断面図である。
Ａ…半導体装置、ｂ…電子部品、１１…ＩＣチ
ツプ、１２…モールド部、１３…中間リード、１
４…枠体部、１５…外部リード、１７…リードフ
レーム。
FIG. 1 is a plan view showing an embodiment of the semiconductor device according to the present invention, FIG. 2 is a sectional view thereof, FIGS. 3 and 4 are plan views of a lead frame, and FIG. 5 is a partially enlarged view of the lead frame. , FIG. 6 is a perspective view of the molding die,
7 is an explanatory diagram showing the transfer molding process, FIG. 8 is a perspective view showing a measuring device, FIG. 9 is a plan view showing a modification of the semiconductor device, FIG. 10 is an enlarged view of the modification, and FIG. The figure is a perspective view showing a conventional example.
The figure is a sectional view showing a conventional mounting state. A...Semiconductor device, b...Electronic component, 11...IC chip, 12...Mold part, 13...Intermediate lead, 1
4... Frame body portion, 15... External lead, 17... Lead frame.
Claims (1)
中間リードを介して絶縁性を有する枠体部を該モ
ールド部と一体に形成すると共に、前記枠体部の
外側面に突設され且つ前記中間リードの夫々に順
次導通する外部リードを設け、前記中間リードに
他の電子部品が接続されて成ることを特徴とする
半導体装置。 An insulating frame part is integrally formed with the mold part through a plurality of intermediate leads led out from the mold part of the semiconductor element, and a frame part protruding from the outer surface of the frame part and connected to the intermediate leads. 1. A semiconductor device comprising: external leads which are sequentially electrically connected to each other; and other electronic components are connected to the intermediate leads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2513987U JPS63132439U (en) | 1987-02-23 | 1987-02-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2513987U JPS63132439U (en) | 1987-02-23 | 1987-02-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63132439U true JPS63132439U (en) | 1988-08-30 |
Family
ID=30825014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2513987U Pending JPS63132439U (en) | 1987-02-23 | 1987-02-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63132439U (en) |
-
1987
- 1987-02-23 JP JP2513987U patent/JPS63132439U/ja active Pending