JPS6236548U - - Google Patents
Info
- Publication number
- JPS6236548U JPS6236548U JP12760285U JP12760285U JPS6236548U JP S6236548 U JPS6236548 U JP S6236548U JP 12760285 U JP12760285 U JP 12760285U JP 12760285 U JP12760285 U JP 12760285U JP S6236548 U JPS6236548 U JP S6236548U
- Authority
- JP
- Japan
- Prior art keywords
- package
- taken out
- leads
- bent
- shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａ，ｂは本考案の一実施例の斜視図とそ
の断面図、第２図ａ，ｂは本考案によるモールド
・パツケージをプリント配線基板に実装する場合
の２つの例の斜視図、第３図、第４図は従来の例
を説明するもので、ａは斜視図、ｂは側面図、第
５図はこれをプリント配線基板に実装する場合の
斜視図である。
１，１１……内側折り曲げのリード、２……モ
ールド・パツケージ、３，１２……外側折り曲げ
リード、４……プリント配線基板、１３……配線
パターン。
FIGS. 1a and 1b are perspective views and cross-sectional views of one embodiment of the present invention; FIGS. 2a and 2b are perspective views of two examples of mounting the molded package according to the present invention on a printed wiring board; 3 and 4 illustrate a conventional example, in which a is a perspective view, b is a side view, and FIG. 5 is a perspective view when this is mounted on a printed wiring board. 1, 11...Leads bent inside, 2...Mold package, 3, 12...Leads bent outside, 4...Printed wiring board, 13...Wiring pattern.
Claims (1)
しクランク状に外側方向に折り曲げるリードと、
アウター・リードをパツケージの側面より取り出
しコの字形にパツケージの側面から底面に添つて
折り曲げるリードとを交互にパツケージの周囲に
配置する事を特徴とする半導体集積回路装置。 The outer lead is taken out from the side of the pack cage and bent outward in a crank shape.
A semiconductor integrated circuit device characterized in that outer leads are taken out from the side of the package and are alternately arranged around the package with leads that are bent from the side to the bottom of the package in a U-shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12760285U JPS6236548U (en) | 1985-08-20 | 1985-08-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12760285U JPS6236548U (en) | 1985-08-20 | 1985-08-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6236548U true JPS6236548U (en) | 1987-03-04 |
Family
ID=31022509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12760285U Pending JPS6236548U (en) | 1985-08-20 | 1985-08-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6236548U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03289162A (en) * | 1990-04-05 | 1991-12-19 | Rohm Co Ltd | Surface-mount type electronic component |
-
1985
- 1985-08-20 JP JP12760285U patent/JPS6236548U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03289162A (en) * | 1990-04-05 | 1991-12-19 | Rohm Co Ltd | Surface-mount type electronic component |