JPS62151750U - - Google Patents
Info
- Publication number
- JPS62151750U JPS62151750U JP3825386U JP3825386U JPS62151750U JP S62151750 U JPS62151750 U JP S62151750U JP 3825386 U JP3825386 U JP 3825386U JP 3825386 U JP3825386 U JP 3825386U JP S62151750 U JPS62151750 U JP S62151750U
- Authority
- JP
- Japan
- Prior art keywords
- package
- lead
- outer peripheral
- electronic component
- peripheral side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002093 peripheral effect Effects 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案実施例の平面図、第２図は第１
図の―断面図、第３図は本考案に係るＩＣパ
ツケージを搭載するプリント基板のパツドのレイ
アウト図、第４図は従来のＩＣパツケージを搭載
するプリント基板のパツドのレイアウト図である
。
１……パツケージ、２……凸部、３……凹部、
４，５……リード、６，７……パツド、９……プ
リント基板。
Fig. 1 is a plan view of the embodiment of the present invention, and Fig. 2 is a plan view of the embodiment of the present invention.
FIG. 3 is a layout diagram of a pad on a printed circuit board on which an IC package according to the present invention is mounted, and FIG. 4 is a layout diagram of a pad on a printed circuit board on which a conventional IC package is mounted. 1... Package cage, 2... Convex part, 3... Concave part,
4, 5...lead, 6,7...pad, 9...printed circuit board.
Claims (1)
数のリードを有し、各リードはパツケージの側面
から底面まで連続して形成され、該底面の各リー
ドがプリント基板のパツドに接合されるモード電
子部品パツケージにおいて、前記パツケージ外周
側面に凹部および凸部を交互に連続して形成し、
各凹部および凸部に前記リードを設けたことを特
徴とするモールド電子部品パツケージ。 A mode electronic component package in which a package made of a molded body has a plurality of leads on the outer peripheral side surface, each lead is formed continuously from the side surface to the bottom surface of the package, and each lead on the bottom surface is bonded to a pad on a printed circuit board. , forming concave portions and convex portions alternately and continuously on the outer peripheral side surface of the package;
A molded electronic component package characterized in that the lead is provided in each concave portion and convex portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3825386U JPS62151750U (en) | 1986-03-18 | 1986-03-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3825386U JPS62151750U (en) | 1986-03-18 | 1986-03-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62151750U true JPS62151750U (en) | 1987-09-26 |
Family
ID=30850327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3825386U Pending JPS62151750U (en) | 1986-03-18 | 1986-03-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62151750U (en) |
-
1986
- 1986-03-18 JP JP3825386U patent/JPS62151750U/ja active Pending