JPS61207043U

JPS61207043U -

Info

Publication number: JPS61207043U
Application number: JP9213385U
Authority: JP
Priority date: 1985-06-18
Filing date: 1985-06-18
Publication date: 1986-12-27

Description

[Brief explanation of the drawing]

第１図は本考案の一実施例の半導体集積回路装
置を示す斜視図、第２図及び第３図は第１図の半
導体集積回路装置の正面図及び底面図、第４図は
第１図の装置の製造途中の斜視図、第５図は第４
図の装置の一部拡大断面図、第６図は第１図の装
置の実施用ソケツトの斜視図、第７図は第６図の
ソケツトに第１図の装置を実装したものの正面図
、第８図及び第９図は本考案の他の一実施例を示
す斜視図及び正面図である。第１０図は従来の半
導体集積回路装置の斜視図、第１１図及び第１２
図は第１０図の装置の実装用ソケツトの斜視図及
び使用時の側面図、第１３図及び第１４図は第１
０図の装置の各状態での側面図である。９…半導体集積回路装置（ＩＣ装置）、１０，
１０′…部品本体、１０ａ，１０′ａ…側面、１
０ｂ，１０′ｂ…底面、１１，１１′…リード。 1 is a perspective view showing a semiconductor integrated circuit device according to an embodiment of the present invention, FIGS. 2 and 3 are front and bottom views of the semiconductor integrated circuit device of FIG. 1, and FIG. 4 is a perspective view of the semiconductor integrated circuit device of FIG. Figure 5 is a perspective view of the device in the middle of manufacturing.
6 is a perspective view of a socket for implementing the device in FIG. 1, FIG. 7 is a front view of the device in FIG. 1 mounted in the socket in FIG. 6, and FIG. 8 and 9 are a perspective view and a front view showing another embodiment of the present invention. FIG. 10 is a perspective view of a conventional semiconductor integrated circuit device, and FIGS.
The figure is a perspective view of the mounting socket of the device in Figure 10 and a side view during use, and Figures 13 and 14 are the
FIG. 3 is a side view of the device shown in FIG. 0 in various states; 9...Semiconductor integrated circuit device (IC device), 10,
10'... Part body, 10a, 10'a... Side, 1
0b, 10'b...bottom, 11,11'...lead.

Claims

[Scope of utility model registration request]

A semiconductor integrated circuit device characterized in that a large number of leads are led out from a side surface of a resin-molded rectangular component body along the bottom surface of the component body.