JPH0463147U - - Google Patents
Info
- Publication number
- JPH0463147U JPH0463147U JP10539790U JP10539790U JPH0463147U JP H0463147 U JPH0463147 U JP H0463147U JP 10539790 U JP10539790 U JP 10539790U JP 10539790 U JP10539790 U JP 10539790U JP H0463147 U JPH0463147 U JP H0463147U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- protruded
- package
- utility
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図、第２図はこの考案の一実施例である半
導体素子のプリント基板への実装状態を示す側面
図、第３図は従来の半導体素子のプリント基板へ
の実装状態を示す側面図である。
図において、１はモールド、２はリード、３は
スタンドオフ、４はプリント基板、５は突起を示
す。なお、図中、同一符号は同一、または相当部
分を示す。
Figures 1 and 2 are side views showing a state in which a semiconductor element, which is an embodiment of this invention, is mounted on a printed circuit board, and Figure 3 is a side view showing a state in which a conventional semiconductor element is mounted on a printed circuit board. be. In the figure, 1 is a mold, 2 is a lead, 3 is a standoff, 4 is a printed circuit board, and 5 is a protrusion. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
させたことを特徴とする半導体素子。 A semiconductor device characterized in that a part of the mold on the back side of an IC package is protruded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10539790U JPH0463147U (en) | 1990-10-04 | 1990-10-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10539790U JPH0463147U (en) | 1990-10-04 | 1990-10-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0463147U true JPH0463147U (en) | 1992-05-29 |
Family
ID=31851067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10539790U Pending JPH0463147U (en) | 1990-10-04 | 1990-10-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0463147U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009088352A (en) * | 2007-10-01 | 2009-04-23 | Denso Corp | Production method for electronic circuit device, and electronic circuit device |
-
1990
- 1990-10-04 JP JP10539790U patent/JPH0463147U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009088352A (en) * | 2007-10-01 | 2009-04-23 | Denso Corp | Production method for electronic circuit device, and electronic circuit device |
| JP4518128B2 (en) * | 2007-10-01 | 2010-08-04 | 株式会社デンソー | Electronic circuit device manufacturing method and electronic circuit device |